Abstract: An integrated circuit device with thermal dissipating package comprises a circuit board, a chip and a three-dimensional vapor chamber device. The chip is configured on an upper board surface of the circuit board. The three-dimensional vapor chamber device comprises an upper cover and a bottom cover. The upper cover has a base plate and a tube. The base plate has an opening and an upper outer surface. An airtight cavity is formed from the tubular cavity of the tube when the bottom cover is sealed to the upper cover. The bottom groove of the bottom cover is configured to accommodate the chip. The chip surface is contacted with the bottom groove surface. The semi-open case has an inlet and an outlet and is coupled to the bottom cover to form a heat-exchanging chamber. The inlet and outlet are connected to the heat-exchanging chamber.

Abstract: A three-dimensional vapor chamber device includes an upper cover, a bottom cover and a porous wick structure. The upper cover includes a tube and a base plate having a base cavity, an opening hole and an upper outer surface. The tube has a top end having a sealed structure and a tubular cavity, and is configured on the upper outer surface, located above the opening hole and extended outwardly. An airtight cavity is formed from the base cavity and the tubular cavity when the bottom cover is sealed to the upper cover. The porous wick structure is continuously disposed on a tubular internal surface, an upper internal surface and a bottom internal surface. Wherein, the sealed structure is formed by pre-setting a liquid injection port at the top end, injecting the working fluid into the airtight cavity through the liquid injection port, and then sealing the liquid injection port.

Abstract: A liquid-cooling heat-dissipating module with embedded three-dimensional vapor chamber device comprises a three-dimensional vapor chamber device and a semi-open case. The three-dimensional vapor chamber device comprises an upper cover having a base plate and a tube, a bottom cover and a porous wick structure. The base plate has a base cavity and an opening hole. The tube is configured on an upper outer surface, located above the opening hole and extended outwardly. An airtight cavity is formed from a tubular cavity of the tube and the base cavity when the bottom cover is sealed to the upper cover. The porous wick structure is formed continuously on a tubular internal surface, an upper internal surface and a bottom internal surface. The semi-open case has an inlet and an outlet, and is coupled to the bottom cover to form a heat-exchanging chamber. The inlet and outlet are connected to the heat-exchanging chamber.

Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.

Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.

Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.

Abstract: A stack of strata containing LEDs is fabricated by repeatedly bonding unpatterned epitaxial structures. Because the epitaxial structures are unpatterned (e.g., not patterned into individual micro LEDs), requirements on alignment are significantly relaxed. One example is an integrated multi-color LED display panel, in which arrays of micro LEDs are integrated with corresponding driver circuitry. Multiple strata of micro LEDs are stacked on top of a base substrate that includes the driver circuitry. In this process, each stratum is fabricated as follows. An unpatterned epitaxial structure is bonded on top of the existing device. The epitaxial structure is then patterned to form micro LEDs. The stratum is filled and planarized to allow the unpatterned epitaxial structure of the next stratum to be bonded. This is repeated to build up the stack of strata.

Abstract: A microarray LED flash, applied to a mobile phone for lighting an adjustable flashlight or projecting an image, comprises a ?LED array module, a mixing optical module and an optical module. The ?LED array module is configured in a shell of the mobile phone for generating a patterning light source. The mixing optical module and the optical module are detachably configured on an external surface of the shell to receive the patterning light source from the ?LED array module for lighting the flashlight or projecting the image respectively. A ?LED array chip could be used as the ?LED array module and combined with the outboard mixing optical module to generate a flashlight with adjustable color and light pattern. Furthermore, the invention can use the optical module to substitute for the mixing optical module for projecting an image from the patterning light source, therefore the mobile phone has a projection function.

Abstract: A message broadcasting system includes a remote server, a digital signal input device connected to the remote server, at least one mobile communicating device communicating with the remote server, at least one carrier, and at least one image projecting device configured on the carrier and communicating with the mobile communicating device. The digital signal input device is used for inputting a digital signal into the remote server. The mobile communicating device receives the digital signal from the remote server and sends the digital signal with an order to the image projecting device on the carrier. The image projecting device projects the digital signal on a display area according to the order. Accordingly, the message broadcasting system can be used in advertisement field to obtain advertisement effect with low cost.

Abstract: A microarray LED flash, applied to a mobile phone for lighting an adjustable flashlight or projecting an image, comprises a ?LED array module, a mixing optical module and an optical module. The ?LED array module is configured in a shell of the mobile phone for generating a patterning light source. The mixing optical module and the optical module are detachably configured on an external surface of the shell to receive the patterning light source from the ?LED array module for lighting the flashlight or projecting the image respectively. A ?LED array chip could be used as the ?LED array module and combined with the outboard mixing optical module to generate a flashlight with adjustable color and light pattern. Furthermore, the invention can use the optical module to substitute for the mixing optical module for projecting an image from the patterning light source, therefore the mobile phone has a projection function.

Abstract: The present invention discloses an integral LED component which integrates LED epitaxial structure electrodes and interconnects with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.

Abstract: The present invention discloses an integral LED component which integrates LED epitaxial structure electrodes and interconnects with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.

Abstract: An integral LED component is mounted into a hollow carrier. The carrier has two conductive electrodes with opposite polarities. The LED component comprises a substrate, N number of LED epitaxial structures where N is a number greater than one, a third electrode and a fourth electrode. The N number of LED epitaxial structures are formed on the upper surface of the substrate, the at least one of the N number of LED epitaxial structures comprises a first and a second electrode. The third and fourth electrodes are formed on the upper surface and located outside the N number of LED epitaxial structures, the respective electrodes are electrically connected to form a circuit. The two conductive electrodes of the hollow carrier are used for electrically connecting the third and fourth electrodes of the substrate, and the lower surface of the substrate is exposed to the hollow carrier.

Abstract: The present invention discloses an integral LED component which integrates LED epitaxial structures electrodes and interconnect with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.

Abstract: An integral LED component is mounted into a hollow carrier. The carrier has two conductive electrodes with opposite polarities. The LED component comprises a substrate, N number of LED epitaxial structures where N is a number greater than one, a third electrode and a fourth electrode. The N number of LED epitaxial structures are formed on the upper surface of the substrate, the at least one of the N number of LED epitaxial structures comprises a first and a second electrode. The third and fourth electrodes are formed on the upper surface and located outside the N number of LED epitaxial structures, the respective electrodes are electrically connected to form a circuit. The two conductive electrodes of the hollow carrier are used for electrically connecting the third and fourth electrodes of the substrate, and the lower surface of the substrate is exposed to the hollow carrier.

Abstract: The present invention discloses an integral LED component which integrates LED epitaxial structures electrodes and interconnect with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.

Abstract: The invention discloses a LED light source, comprising a control circuit module, a shell, an energy conversion component, a heat pipe, and a cooling component. The shell comprises a dome and a side wall, and the shell contains the control circuit module. The energy conversion component comprises a substrate, a substrate holder, and at least a LED, wherein the LED is disposed on the substrate, the substrate is connected to the substrate holder, and the substrate holder is coupled to the control circuit module to drive the energy conversion component. The heat pipe comprises a flat part, an extension part, and a contact part, wherein the substrate and the substrate holder of the energy conversion component are disposed on the flat part; the extension part, disposed inside the shell, extends toward a direction. The cooling component comprises a plurality of fins, wherein the fins contacts the contact part respectively.

Abstract: The invention discloses a LED light source, comprising a control circuit module, a shell, an energy conversion component, a heat pipe, and a cooling component. The shell comprises a dome and a side wall, and the shell contains the control circuit module. The energy conversion component comprises a substrate, a substrate holder, and at least a LED, wherein the LED is disposed on the substrate, the substrate is connected to the substrate holder, and the substrate holder is coupled to the control circuit module to drive the energy conversion component. The heat pipe comprises a flat part, an extension part, and a contact part, wherein the substrate and the substrate holder of the energy conversion component are disposed on the flat part; the extension part, disposed inside the shell, extends toward a direction. The cooling component comprises a plurality of fins, wherein the fins contacts the contact part respectively.

Abstract: The present invention discloses a semiconductor optoelectronic converting system and the fabricating method thereof, the system comprises a supporting module, a heat pipe, a power converting module and a heat-dissipating plate module. The main features of the present invention are that the supporting module has an accommodating space for disposing the heat pipe, and wherein the supporting module and the heat pipe have a common surface for disposing the power converting module thereon. Furthermore, the present invention further decreases the heat resistant therebetween and improves the heat conducting rate and further capable of becoming a rechargeable self-sufficiency lighting system.