Abstract: In some embodiments, the present disclosure relates to a device having a semiconductor substrate including a frontside and a backside. On the frontside of the semiconductor substrate are a first source/drain region and a second source/drain region. A gate electrode is arranged on the frontside of the semiconductor substrate and includes a horizontal portion, a first vertical portion, and a second vertical portion. The horizontal portion is arranged over the frontside of the semiconductor substrate and between the first and second source/drain regions. The first vertical portion extends from the frontside towards the backside of the semiconductor substrate and contacts the horizontal portion of the gate electrode structure. The second vertical portion extends from the frontside towards the backside of the semiconductor substrate, contacts the horizontal portion of the gate electrode structure, and is separated from the first vertical portion by a channel region of the substrate.

Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

Abstract: An electronic device includes a first body, a second body, a hinge assembly, and a linkage assembly. The first body has a first pivoting end. The second body includes first and second casings slidably disposed on each other. The first casing has a second pivoting end. The hinge assembly has a first axial portion, a second axial portion, and a connection portion. The first and second pivoting ends are pivotally connected to the first axial portion and the second axial portion, respectively. The connection portion does not overlap the second axial portion along an axial direction. The linkage assembly is connected between the connection portion and the second casing. When the hinge assembly rotates along the second axial portion relative to the first casing to drive the first body to be unfolded, the linkage assembly drives the second casing to slide, so that an end of the second casing protrudes.

Abstract: An electronic device includes a first body, a first supporting member, and a second body. The first supporting member has a first end and a second end opposite to each other, and the first end is pivoted at the first body. The second body has a notch, the second end is pivoted at the second body, and the first supporting member is fitted to the notch. The second body and the first supporting member fitted to the notch are closed or opened up with respect to the first body together as the first supporting member is pivotally rotated relative to the first body. When the second body is opened up, the second body and the first supporting member are pivotally rotated relatively to separate the first supporting member from the notch and move a bottom end of the second body to a preset position on the first body.

Abstract: An electronic device includes a first body, a second body, a hinge assembly, and a linkage assembly. The first body has a first pivoting end. The second body includes first and second casings slidably disposed on each other. The first casing has a second pivoting end. The hinge assembly has a first axial portion, a second axial portion, and a connection portion. The first and second pivoting ends are pivotally connected to the first axial portion and the second axial portion, respectively. The connection portion does not overlap the second axial portion along an axial direction. The linkage assembly is connected between the connection portion and the second casing. When the hinge assembly rotates along the second axial portion relative to the first casing to drive the first body to be unfolded, the linkage assembly drives the second casing to slide, so that an end of the second casing protrudes.

Abstract: An electronic device includes a first body, a first supporting member, and a second body. The first supporting member has a first end and a second end opposite to each other, and the first end is pivoted at the first body. The second body has a notch, the second end is pivoted at the second body, and the first supporting member is fitted to the notch. The second body and the first supporting member fitted to the notch are closed or opened up with respect to the first body together as the first supporting member is pivotally rotated relative to the first body. When the second body is opened up, the second body and the first supporting member are pivotally rotated relatively to separate the first supporting member from the notch and move a bottom end of the second body to a preset position on the first body.