Patents by Inventor Jen-Yun Huang

Jen-Yun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6280524
    Abstract: An apparatus for electrostatically coating powder on a flat panel and a method for using such apparatus are provided. In the apparatus, a heating device is used to heat a panel to be coated and positioned on a powder spray chamber to a temperature of at least 100° C. and simultaneously charging the panel with a negative voltage of at least 20,000 volts. The high temperature and the high voltage of the otherwise non-conductive panel result in a panel that is electrostatically conductive. Powder particles that are charged with a high positive voltage are then injected toward the panel surface by an air pressure of at least 0.8 kg/cm2 until particles are adhered to the panel surface. The present invention novel method can be used advantageously at low costs due to its simple processing steps and as an environmentally friendly process since no solvent needs to be evaporated and released into the atmosphere.
    Type: Grant
    Filed: August 4, 1999
    Date of Patent: August 28, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Shieh-Hsien Lin, Jen-Yun Huang, Lung-Tsai Kuang