Patents by Inventor Jeng-Fuh Liu

Jeng-Fuh Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090122552
    Abstract: This invention is to provide a low power consumption high illumination LED lamp comprising a base; a metallic member on a bottom of the base and adapted to insert into a socket; an AC to DC converter disposed inside the base and being electrically connected to the metallic member; a heat sink formed of metal and disposed on a top of the base; at least one matrix shaped LED light array secured to a position outside the base and adjacent to the heat sink and electrically connected to the AC to DC converter, and a bulb having a peripheral edge secured to the top of the base and covering matrix shaped LED light array. By utilizing this lighting device, advantages including low power consumption, high illumination, increased illuminating area, energy saving, and being complied with the concept of environmental protection are obtained.
    Type: Application
    Filed: November 9, 2007
    Publication date: May 14, 2009
    Applicant: CHUNTLON ENTERPRISE CO., LTD.
    Inventor: Jeng-Fuh Liu
  • Publication number: 20080018426
    Abstract: A remote controlled power switch system includes a transmitter (10) having selection elements and emitting different controlling signals each having a predetermined frequency corresponding to different responses of the selection elements; and a number of receivers (11, 12, 13) each adapted to switch an ON/OFF state of an electrical load under control of the corresponding controlling signal transmitted from the transmitter. The switched receiver transmits a feedback signal to the transmitter after receiving the controlling signal. The transmitter has an indicator unit (106) for indicating the receiving of the feedback signal. The indicator unit comprises an LED light (400) for indicating the ON or OFF state of the switched receiver by emitting different color of lights, a number of LED lights (401, 402, 403) for indicating which of the receivers is switched on, or a display (404) for showing a designated number of the switched receiver.
    Type: Application
    Filed: July 17, 2006
    Publication date: January 24, 2008
    Inventor: Jeng-Fuh Liu
  • Publication number: 20060262580
    Abstract: The present invention provides an adapter and a method of detecting and adjusting voltages and currents for supplying the power requirement of different electronic apparatus. The adapter of present invention comprises an AC input port, a DC input port, a power adjusting circuit and a display device. The display device is set on the surface of the adapter for indicating the presently output voltage and current values from the adapter. The power adjusting circuit comprises a power selection device, an AC to DC converter, a voltage adjusting device, a current regulator, a pulse detector and a micro-controller. The micro-controller is capable of controlling the voltage adjusting device and the current regulator for adjusting the output voltage and current of the adapter according to the responding current detected by the pulse detector. The micro-controller can provide a series of pre-programming voltage step within a controlled pulse.
    Type: Application
    Filed: August 4, 2006
    Publication date: November 23, 2006
    Inventor: Jeng-Fuh Liu
  • Publication number: 20030091462
    Abstract: A novel method for fabricating leadless solder for IC packaging includes the following steps: A. to prepare a mixture containing Zn, 7-11 wt %; Co, 0.1-0.5 wt %; and Sn for balance; or a mixture containing Zn, 7-11 wt %; Co, 0.1-0.5 wt %; P, 0.005-0.05 wt % and Sn for balance; or a mixture containing Zn, 7-11 wt %; Al, 0.1-0.5 wt %; and Sn for balance; a mixture containing Zn, 7-11 wt %; Al, 0.1-0.5 wt %; P, 0.005-0.05 wt % and Sn for balance; or a mixture containing In, 10-15 wt %; Co, 0.1-0.5 wt % and Sn for balance; B. to place the mixture in a high frequency furnace to be melted together at a temperature lower than 350° C., then take it out of the furnace for a quick freezing and cast it into an ingot in an adequate size; C. to treat the ingot with a homogenization processing at 180-240° C. for 30-240 minutes; D. to draw the homogenized ingot into the form of leadless solder filament or granule.
    Type: Application
    Filed: December 5, 2001
    Publication date: May 15, 2003
    Inventors: Tao-Kuang Chang, Jeng-Fuh Liu, Jui-Ting Tsai
  • Publication number: 20020192654
    Abstract: A bio-chip substrate includes a base material selected from nylon or resin, and a layer of high purity nano microchip diamond membrane bonded to the surface of the base material for the embedding of DNA or protein. The invention relates also to the fabrication of the bio-chip substrate.
    Type: Application
    Filed: June 15, 2001
    Publication date: December 19, 2002
    Inventors: Tao-Kuang Chang, Jeng-Fuh Liu, Chih-Shen Chen