Patents by Inventor Jeng-I Chen

Jeng-I Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7786029
    Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: August 31, 2010
    Assignee: ITEQ Corporation
    Inventors: Li-Chun Chen, Jeng-I Chen, Bill Weng
  • Publication number: 20100036032
    Abstract: A vanish, a heat-dissipation prepreg, and the manufacturing method thereof are disclosed. The vanish has a curing agent with structure as indicated in formula (1). The vanish based on this curing agent will improve thermal stability and peel strength. Glass fabric cloth is dipped into the vanish having the curing agent to form a heat-dissipation prepreg with better thermal stability and peel strength. Furthermore, the curing agent has polarity so that inorganic powders are uniformly distributed in the prepreg. Therefore, the dissipation efficiency of the heat-dissipation prepreg is improved.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 11, 2010
    Inventors: Uen-Ren Chen, Jeng-I Chen
  • Publication number: 20090176104
    Abstract: A resin composition contains a solvent and a solid content dispersed in the solvent. The solid content does not contain phenolic resin. The solid content contains a benzoxazine resin and a phosphorus-containing epoxy resin. The weight ratio of the benzoxazine resin to phosphorus-containing epoxy resin is about 0.6:1 to about 3.0:1. A circuit board substrate and a copper clad laminate fabricated with the resin composition mentioned above are disclosed too.
    Type: Application
    Filed: January 5, 2009
    Publication date: July 9, 2009
    Inventors: Li-Chun CHEN, Jeng-I Chen, Bill Weng
  • Patent number: 5532320
    Abstract: A nonlinear optical interpenetrating polymer network which can exhibit nonlinear optical properties includes a first polymer, and a second polymer interpenetrating the first polymer. At least one of the polymers includes a nonlinear optical component. A method of forming a nonlinear optical interpenetrating polymer network which can exhibit nonlinear optical properties includes combining a first prepolymer, which can react to form a first polymer, with at least one monomer which can react to form a second polymer. At least one of either the first prepolymer or the monomer include a nonlinear optical component. The nonlinear optical component is poled and the first prepolymer and the monomer, or monomers, of the second prepolymer are reacted while the nonlinear optical component is being poled.
    Type: Grant
    Filed: December 21, 1994
    Date of Patent: July 2, 1996
    Assignee: University of Massachusetts Lowell
    Inventors: Sukant K. Tripathy, Ru-Jong Jeng, Jayant Kumar, Sutiyao Marturunkakul, Jeng-I Chen