Patents by Inventor Jeng-Wei Li

Jeng-Wei Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166149
    Abstract: This disclosure is directed to a sunroof device having a window frame assembly, a pair of linkage assemblies, a panel assembly, a first electrical connector and a second electrical connector. The window frame assembly has a pair of rails. The linkage assemblies are disposed on the rails respectively. The panel assembly is disposed on the pair of linkage assemblies. The first electrical connector on the window frame assembly has a plugging slot and an opening, the opening is located at a side of the first electrical connector and extended to a top of the first electrical connector. The second electrical connector on the panel assembly has a conductive terminal. When the panel assembly rotates, the conductive terminal is plugged in the plugging slot through the opening and movable with the panel assembly in the opening.
    Type: Application
    Filed: March 25, 2023
    Publication date: May 23, 2024
    Inventors: Chih-Wei LI, Sin-Hao HE, Yi-Jen LAN, Tzu-Chiang LEE, Jeng-Yin LAN
  • Patent number: 5533307
    Abstract: Two energy dissipation devices, each comprising a first plate, a plurality of spaced tapered plates, a plurality of cylinders, a plurality of washers, and a base frame. The devices can absorb seismic energy through the yielding of the tapered plates and effectively reduce a building vibration response during an earthquake. The devices are particularly suitable for use in building structures that must be designed to dissipate a large amount of seismic energy to achieve economical earthquake-resistant construction.
    Type: Grant
    Filed: November 29, 1994
    Date of Patent: July 9, 1996
    Assignee: National Science Council
    Inventors: Keh-Chyuan Tsai, Jeng-Wei Li