Patents by Inventor Jeng-Yann Tsay
Jeng-Yann Tsay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11226564Abstract: In a method of diagnosing an RF generator of a laser produced plasma extreme ultra violet (LPP EUV) radiation source apparatus, a testing system is connected to the RF generator of the LPP EUV radiation source apparatus. An output power is measured by the testing system with changing an input power of the RF generator. Using a computer system, the measured output power is analyzed. Based on the analyzed measured output power, whether the RF generator is operating properly is determined.Type: GrantFiled: May 7, 2019Date of Patent: January 18, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Jhan-Hong Yeh, Cheng-Chieh Chen, Jeng-Yann Tsay, Li-Jui Chen, Henry Yee Shian Tong, Wen-Chih Wang, Hsin-Liang Chen
-
Patent number: 11158989Abstract: A device includes a laser source, an amplifier, an optical sensor and a spectrometer. The laser source is configured to produce a seed laser beam. The amplifier includes gain medium and a discharging unit. The discharging unit is configured to pump the gain medium for amplifying power of the seed laser beam. The optical sensor is coupled to the amplifier and configured for sensing an optical emission generated in the amplifier while the gain medium is discharging. The spectrometer is coupled with the optical sensor and configured to measure a spectrum of the optical emission.Type: GrantFiled: April 10, 2020Date of Patent: October 26, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Henry Yee-Shian Tong, Wen-Chih Wang, Hsin-Liang Chen, Louis Chun-Lin Chang, Cheng-Chieh Chen, Li-Jui Chen, Po-Chung Cheng, Jeng-Yann Tsay
-
Publication number: 20200245443Abstract: A device includes a laser source, an amplifier, an optical sensor and a spectrometer. The laser source is configured to produce a seed laser beam. The amplifier includes gain medium and a discharging unit. The discharging unit is configured to pump the gain medium for amplifying power of the seed laser beam. The optical sensor is coupled to the amplifier and configured for sensing an optical emission generated in the amplifier while the gain medium is discharging. The spectrometer is coupled with the optical sensor and configured to measure a spectrum of the optical emission.Type: ApplicationFiled: April 10, 2020Publication date: July 30, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Henry Yee-Shian TONG, Wen-Chih WANG, Hsin-Liang CHEN, Louis Chun-Lin CHANG, Cheng-Chieh CHEN, Li-Jui CHEN, Po-Chung CHENG, Jeng-Yann TSAY
-
Patent number: 10624196Abstract: A device includes a laser source, an amplifier, an optical sensor and a spectrometer. The laser source is configured to produce a seed laser beam. The amplifier includes gain medium and a discharging unit. The discharging unit is configured to pump the gain medium for amplifying power of the seed laser beam. The optical sensor is coupled to the amplifier and configured for sensing an optical emission generated in the amplifier while the gain medium is discharging. The spectrometer is coupled with the optical sensor and configured to measure a spectrum of the optical emission.Type: GrantFiled: January 8, 2019Date of Patent: April 14, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Henry Yee-Shian Tong, Wen-Chih Wang, Hsin-Liang Chen, Louis Chun-Lin Chang, Cheng-Chieh Chen, Li-Jui Chen, Po-Chung Cheng, Jeng-Yann Tsay
-
Publication number: 20200107428Abstract: A device includes a laser source, an amplifier, an optical sensor and a spectrometer. The laser source is configured to produce a seed laser beam. The amplifier includes gain medium and a discharging unit. The discharging unit is configured to pump the gain medium for amplifying power of the seed laser beam. The optical sensor is coupled to the amplifier and configured for sensing an optical emission generated in the amplifier while the gain medium is discharging. The spectrometer is coupled with the optical sensor and configured to measure a spectrum of the optical emission.Type: ApplicationFiled: January 8, 2019Publication date: April 2, 2020Inventors: Henry Yee-Shian TONG, Wen-Chih WANG, Hsin-Liang CHEN, Louis Chun-Lin CHANG, Cheng-Chieh CHEN, Li-Jui CHEN, Po-Chung CHENG, Jeng-Yann TSAY
-
Publication number: 20200004159Abstract: In a method of diagnosing an RF generator of a laser produced plasma extreme ultra violet (LPP EUV) radiation source apparatus, a testing system is connected to the RF generator of the LPP EUV radiation source apparatus. An output power is measured by the testing system with changing an input power of the RF generator. Using a computer system, the measured output power is analyzed. Based on the analyzed measured output power, whether the RF generator is operating properly is determined.Type: ApplicationFiled: May 7, 2019Publication date: January 2, 2020Inventors: Jhan-Hong YEH, Cheng-Chieh CHEN, Jeng-Yann TSAY, Li-Jui CHEN, Yee-Shian Henry TONG, Wen-Chih WANG, Hsin-Liang CHEN
-
Patent number: 9970105Abstract: Embodiments of method for cooling a wafer are provided. A method for cooling a wafer includes placing the wafer in a processing module via a passage of a seat member. The method also includes moving a closure member toward the seat member in a diagonal manner. The method further includes engaging the seat member and the closure member and placing a portion of the closure member inside the passage. In addition, the method includes performing a process on the wafer in the processing module.Type: GrantFiled: December 23, 2013Date of Patent: May 15, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Chun-Ta Chen, Cheng-Chieh Chen, Hong-Hsing Chou, Yeh-Chieh Wang, Jeng-Yann Tsay, Shyue-Shin Tsai, Tsung-Yang Liu
-
Publication number: 20150179456Abstract: Embodiments of method for cooling a wafer are provided. A method for cooling a wafer includes placing the wafer in a processing module via a passage of a seat member. The method also includes moving a closure member toward the seat member in a diagonal manner. The method further includes engaging the seat member and the closure member and placing a portion of the closure member inside the passage. In addition, the method includes performing a process on the wafer in the processing module.Type: ApplicationFiled: December 23, 2013Publication date: June 25, 2015Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chun-Ta CHEN, Cheng-Chieh CHEN, Hong-Hsing CHOU, Yeh-Chieh WANG, Jeng-Yann TSAY, Shyue-Shin TSAI, Tsung-Yang LIU
-
Patent number: 8149562Abstract: A system for decharging a wafer or substrate disposed on an electrostatic chuck, includes a capacitance detector for measuring a capacitance between the electrostatic chuck and the wafer or substrate, and a decharging voltage calculator for calculating a decharging voltage based at least in part on the capacitance measured by the capacitance detector. The decharging voltage calculated by the decharging voltage calculator of the system is applied to the electrostatic chuck after dechucking to substantially neutralize electrostatic charges on the wafer or substrate.Type: GrantFiled: March 9, 2007Date of Patent: April 3, 2012Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yen-Hsiang Hsu, Jeng-Yann Tsay
-
Publication number: 20080218931Abstract: A system for decharging a wafer or substrate disposed on an electrostatic chuck, includes a capacitance detector for measuring a capacitance between the electrostatic chuck and the wafer or substrate, and a decharging voltage calculator for calculating a decharging voltage based at least in part on the capacitance measured by the capacitance detector. The decharging voltage calculated by the decharging voltage calculator of the system is applied to the electrostatic chuck after dechucking to substantially neutralize electrostatic charges on the wafer or substrate.Type: ApplicationFiled: March 9, 2007Publication date: September 11, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yen-Hsiang Hsu, Jeng-Yann Tsay
-
Patent number: 7354555Abstract: A system for controlling the flow of gases into a reaction chamber used in processing semiconductor devices includes a safety interlock feature that prevents inadvertent mixing of incompatible, reactive gases. The interlock feature is implemented in an interlock control circuit which operates a valve system for individually controlling the flow of separate gases into the chamber. The interlock circuit includes a series of relay switches and timers arranged to create a time delay between the initiation of flow of gases from separate sources into the chamber.Type: GrantFiled: May 8, 2002Date of Patent: April 8, 2008Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Pen Yen, Jeng-Yann Tsay, Jeng-Chiang Chuang, Cheng-Fang Lin, Yung-Mao Hsu
-
Patent number: 6708565Abstract: Detecting blade vibration via ultrasonic waves is disclosed. The blade may be part of a robot that is used in conjunction with semiconductor device fabrication. A process chamber is provided that has a sidewall and a base defining a cavity contained therein. A rotatable blade is mounted at a center of the cavity that has a base portion and a tip portion extensible from the center to the sidewall of the process chamber. One or more ultrasonic sensors are mounted on the base adjacent to the sidewall. Ultrasonic waves are sent and received toward and reflected by the tip portion of the wafer blade to determine the tip portion's position. In this way, vibrational movement of the blade can be detected.Type: GrantFiled: April 26, 2002Date of Patent: March 23, 2004Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chein-Fang Lin, Jeng-Yann Tsay, Chih-Pen Yen, Yong-Mao Hsu
-
Publication number: 20030211015Abstract: A system for controlling the flow of gases into a reaction chamber used in processing semiconductor devices includes a safety interlock feature that prevents inadvertent mixing of incompatible, reactive gases. The interlock feature is implemented in an interlock control circuit which operates a valve system for individually controlling the flow of separate gases into the chamber. The interlock circuit includes a series of relay switches and timers arranged to create a time delay between the initiation of flow of gases from separate sources into the chamber.Type: ApplicationFiled: May 8, 2002Publication date: November 13, 2003Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Pen Yen, Jeng-Yann Tsay, Jeng-Chiang Chuang, Cheng-Fang Lin, Yung-Mao Hsu
-
Publication number: 20030200808Abstract: Detecting blade vibration via ultrasonic waves is disclosed. The blade may be part of a robot that is used in conjunction with semiconductor device fabrication. A process chamber is provided that has a sidewall and a base defining a cavity contained therein. A rotatable blade is mounted at a center of the cavity that has a base portion and a tip portion extensible from the center to the sidewall of the process chamber. One or more ultrasonic sensors are mounted on the base adjacent to the sidewall. Ultrasonic waves are sent and received toward and reflected by the tip portion of the wafer blade to determine the tip portion's position. In this way, vibrational movement of the blade can be detected.Type: ApplicationFiled: April 26, 2002Publication date: October 30, 2003Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chein-Fang Lin, Jeng-Yann Tsay, Chih-Pen Yen, Yung-Mao Hsu