Abstract: In a dual-sided chip package without a die pad according to the invention, a first die can be fixed directly on the lead fingers of a leadframe, a support bar, or bus bars, while a second die is attached to the first die. Without a die pad, the distance between the surfaces of the dies and the plastic surface of the package therefore gets longer. Thus, the invention enables a large decrease in the probability of generating voids in the plastic and there is no need to grind the dies. Besides, it improves the vibration and floating characteristics of the dies in the manufacturing process and thus prevents the exposure of the bonding wires and the shelling off or breaking of the dies. The invention can raise the yield of chip packages.