Patents by Inventor Jennifer Stabach
Jennifer Stabach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105651Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Patent number: 11887953Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: GrantFiled: June 21, 2021Date of Patent: January 30, 2024Assignee: Wolfspeed, Inc.Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Publication number: 20230335473Abstract: The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.Type: ApplicationFiled: June 16, 2023Publication date: October 19, 2023Inventors: Brice McPherson, Brandon Passmore, Roberto M. Schupbach, Jennifer Stabach-Smith
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Patent number: 11756910Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: GrantFiled: December 21, 2021Date of Patent: September 12, 2023Assignee: WOLFSPEED, INC.Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Patent number: 11721617Abstract: The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.Type: GrantFiled: April 23, 2021Date of Patent: August 8, 2023Assignee: WOLFSPEED, INC.Inventors: Brice McPherson, Brandon Passmore, Roberto M. Schupbach, Jennifer Stabach-Smith
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Publication number: 20220115346Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: ApplicationFiled: December 21, 2021Publication date: April 14, 2022Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Publication number: 20210313289Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: ApplicationFiled: June 21, 2021Publication date: October 7, 2021Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Publication number: 20210313256Abstract: The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.Type: ApplicationFiled: April 23, 2021Publication date: October 7, 2021Inventors: Brice McPherson, Brandon Passmore, Roberto M. Schupbach, Jennifer Stabach-Smith
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Patent number: 11135669Abstract: A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.Type: GrantFiled: September 17, 2018Date of Patent: October 5, 2021Assignee: CREE, INC.Inventors: Jennifer Stabach, Brice McPherson, Chad B. O'Neal
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Patent number: 11069640Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: GrantFiled: June 14, 2019Date of Patent: July 20, 2021Assignee: Cree Fayetteville, Inc.Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Publication number: 20200395322Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Inventors: Brice McPherson, Daniel Martin, Jennifer Stabach
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Patent number: 10784235Abstract: A power module includes a case, a first terminal, a second terminal, and a number of silicon carbide semiconductor die. The case has a footprint less than 30 cm2. The silicon carbide semiconductor die are inside the case and coupled between the first terminal and the second terminal. The power module and the silicon carbide semiconductor die are configured such that in a first operating state the silicon carbide semiconductor die are capable of continuously blocking voltages greater than 650V between the first terminal and the second terminal, and in a second operating state the silicon carbide semiconductor die are capable of continuously passing currents greater than 200 A between the first terminal and the second terminal.Type: GrantFiled: January 30, 2018Date of Patent: September 22, 2020Assignee: Cree Fayetteville, Inc.Inventors: Brice McPherson, Sayan Seal, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty McNutt, Alexander B. Lostetter
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Publication number: 20190237439Abstract: A power module includes a case, a first terminal, a second terminal, and a number of silicon carbide semiconductor die. The case has a footprint less than 30 cm2. The silicon carbide semiconductor die are inside the case and coupled between the first terminal and the second terminal. The power module and the silicon carbide semiconductor die are configured such that in a first operating state the silicon carbide semiconductor die are capable of continuously blocking voltages greater than 650V between the first terminal and the second terminal, and in a second operating state the silicon carbide semiconductor die are capable of continuously passing currents greater than 200 A between the first terminal and the second terminal.Type: ApplicationFiled: January 30, 2018Publication date: August 1, 2019Inventors: Brice McPherson, Sayan Seal, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty McNutt, Alexander B. Lostetter
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Publication number: 20190015917Abstract: A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.Type: ApplicationFiled: September 17, 2018Publication date: January 17, 2019Inventors: Jennifer Stabach, Brice McPherson, Chad B. O'Neal
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Patent number: 10076800Abstract: A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.Type: GrantFiled: November 30, 2015Date of Patent: September 18, 2018Assignee: Cree Fayetteville, Inc.Inventors: Jennifer Stabach, Brice McPherson, Chad B. O'Neal
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Publication number: 20170156211Abstract: A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.Type: ApplicationFiled: November 30, 2015Publication date: June 1, 2017Inventors: Jennifer Stabach, Brice McPherson, Chad B. O'Neal
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Patent number: D909310Type: GrantFiled: September 17, 2018Date of Patent: February 2, 2021Assignee: Cree, Fayetteville, Inc.Inventors: Brice McPherson, Sayan Seal, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty McNutt, Alexander B. Lostetter