Patents by Inventor Jennifer W. Chung

Jennifer W. Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EPOXY RESIN SYSTEMS
    Publication number: 20220298295
    Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
    Type: Application
    Filed: June 10, 2022
    Publication date: September 22, 2022
    Inventors: Amitabh Bansal, Larry Steven Corley, Diana Sepulveda-Camarena, Jennifer W. Chung, Leeanne Taylor, Alla Hale
  • Epoxy resin systems
    Patent number: 11359047
    Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: June 14, 2022
    Assignee: HEXION INC.
    Inventors: Amitabh Bansal, Larry Steven Corley, Diana Sepulveda-Camarena, Jennifer W. Chung, Leeanne Taylor, Alla Hale
  • Epoxy resin systems for composites
    Patent number: 11292871
    Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer, a curing agent component including a compound having an imidazole group and, optionally, a co-curing agent for the compound having an imidazole group comprising a phenolic monomer compound, a branched chain carboxylic acid, and combinations thereof, and a non-aromatic polyol compound. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 5, 2022
    Assignee: HEXION INC.
    Inventors: Larry Steven Corley, Wilbur Paul Ubrich, Jennifer W. Chung, Amitabh Bansal, Terry Loy
  • EPOXY RESIN SYSTEMS
    Publication number: 20190077905
    Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
    Type: Application
    Filed: September 10, 2018
    Publication date: March 14, 2019
    Inventors: Amitabh BANSAL, Larry Steven CORLEY, Diana SEPULVEDA-CAMARENA, Jennifer W. CHUNG, Leeanne TAYLOR, Alla HALE
  • EPOXY RESIN SYSTEMS FOR COMPOSITES
    Publication number: 20180355096
    Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer, a curing agent component including a compound having an imidazole group and, optionally, a co-curing agent for the compound having an imidazole group comprising a phenolic monomer compound, a branched chain carboxylic acid, and combinations thereof, and a non-aromatic polyol compound. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.
    Type: Application
    Filed: June 5, 2018
    Publication date: December 13, 2018
    Inventors: Larry Steven Corley, Wilbur Paul Ubrich, Jennifer W. Chung, Amitabh Bansal, Terrry Loy