Patents by Inventor Jens Frey
Jens Frey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132342Abstract: A venthole of a micromechanical device is sealed with laser irradiation. A micromechanical device has a substrate, such as silicon. The substrate has an upper surface, and defines a venthole leading to a chamber that contains a device, and a trench extending downward from the upper surface and located offset from the venthole. A laser pulse is applied to the substrate at or within the trench. This causes a portion of the substrate located below the upper surface to melt and travel laterally to close off and seal the venthole laterally from beneath the upper surface.Type: ApplicationFiled: October 24, 2022Publication date: April 25, 2024Inventors: Bo CHENG, Holger RUMPF, Jens FREY, Charles TUFFILE, Stephanie KARG, Tobias Joachim MENOLD
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Publication number: 20240017353Abstract: A method for controlling surface asperity during laser sealing of a membrane vent hole. The method includes applying a laser having a laser intensity spatial distribution to the membrane vent hole to form a seal over the membrane vent hole. The seal has a seal surface. The laser pulse includes a primary laser pulse region and a secondary pulse region later in time than the primary laser pulse region, and a time gap between the primary laser pulse region and the secondary laser pulse region. The primary laser pulse region and/or the secondary pulse region include first and second discontinuous laser pulses having a first time gap therebetween and/or third and fourth discontinuous laser pulses having a second time gap therebetween. The seal surface has a controlled surface asperity characteristic.Type: ApplicationFiled: July 13, 2022Publication date: January 18, 2024Inventors: Bo CHENG, Holger RUMPF, Jens FREY, Charles TUFFILE
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Publication number: 20240017349Abstract: A method for controlling surface asperity during laser sealing of a membrane vent hole. The method includes applying a laser pulse having a laser intensity spatial distribution to the membrane vent hole to form a seal over the membrane vent hole. The seal has a seal surface. The laser pulse includes a primary laser pulse region and a secondary laser pulse region beginning once the primary laser pulse region ends. The primary laser pulse region has a primary laser power, and the secondary laser pulse region has a secondary laser power. The secondary laser power is less than the primary laser power. The seal surface has a controlled surface asperity characteristic.Type: ApplicationFiled: July 13, 2022Publication date: January 18, 2024Inventors: Bo CHENG, Holger RUMPF, Jens FREY, Charles TUFFILE
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Publication number: 20240019457Abstract: An inertial measurement device for controlling surface asperity during laser sealing. The device includes a membrane having an upper surface and defining a vent hole extending downward from the upper surface. The vent hole has a first height and a first perimeter along the first height. The vent hole has a second height and a second perimeter extending along the second height. The first height is disposed above the second height. The first perimeter is greater than the second perimeter to form a shoulder portion therebetween. The shoulder portion, the first perimeter, and the first height collectively create a volume configured to control surface asperity during laser sealing of the vent hole.Type: ApplicationFiled: July 13, 2022Publication date: January 18, 2024Inventors: Bo CHENG, Holger RUMPF, Jens FREY, Charles TUFFILE
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Patent number: 11261082Abstract: A micromechanical device that includes a silicon substrate with an overlying oxide layer and with a micromechanical functional layer lying above same, which extend in parallel to a main extension plane, a cavity being formed at least in the micromechanical functional layer and in the oxide layer. An access channel is formed in the oxide layer and/or in the micromechanical functional layer which, starting from the cavity, extends in parallel to the main extension plane and in the process extends in a projection direction, as viewed perpendicularly to the main extension plane, all the way into an access area outside the cavity. A method for manufacturing a micromechanical device is also described.Type: GrantFiled: December 17, 2019Date of Patent: March 1, 2022Assignee: Robert Bosch GmbHInventors: Eckhard Graf, Holger Rumpf, Jens Frey, Jochen Reinmuth, Kurt-Ulrich Ritzau, Achim Breitling
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Patent number: 10752498Abstract: A method for manufacturing a micromechanical component including a substrate and a cap which is joined to the substrate, and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. In a first step, an access opening connecting the first cavity to surroundings of the micromechanical component being formed in the substrate or in the cap. In a second step, the first pressure and/or the first chemical composition in the first cavity being set. In a third step, the access opening being sealed by introducing energy or heat into an absorbing portion of the substrate or the cap with the aid of a laser, a reversible getter for further setting the first pressure and/or the first chemical composition being introduced into the first cavity chronologically prior to the third step.Type: GrantFiled: October 12, 2016Date of Patent: August 25, 2020Assignee: Robert Bosch GmbHInventors: Achim Breitling, Eckhard Graf, Jens Frey, Jochen Reinmuth, Mawuli Ametowobla
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Publication number: 20200198966Abstract: A micromechanical device that includes a silicon substrate with an overlying oxide layer and with a micromechanical functional layer lying above same, which extend in parallel to a main extension plane, a cavity being formed at least in the micromechanical functional layer and in the oxide layer. An access channel is formed in the oxide layer and/or in the micromechanical functional layer which, starting from the cavity, extends in parallel to the main extension plane and in the process extends in a projection direction, as viewed perpendicularly to the main extension plane, all the way into an access area outside the cavity. A method for manufacturing a micromechanical device is also described.Type: ApplicationFiled: December 17, 2019Publication date: June 25, 2020Inventors: Eckhard Graf, Holger Rumpf, Jens Frey, Jochen Reinmuth, Kurt-Ulrich Ritzau, Achim Breitling
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Publication number: 20180346324Abstract: A method for manufacturing a micromechanical component including a substrate and a cap which is joined to the substrate, and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity. In a first step, an access opening connecting the first cavity to surroundings of the micromechanical component being formed in the substrate or in the cap. In a second step, the first pressure and/or the first chemical composition in the first cavity being set. In a third step, the access opening being sealed by introducing energy or heat into an absorbing portion of the substrate or the cap with the aid of a laser, a reversible getter for further setting the first pressure and/or the first chemical composition being introduced into the first cavity chronologically prior to the third step.Type: ApplicationFiled: October 12, 2016Publication date: December 6, 2018Inventors: Achim Breitling, Eckhard Graf, Jens Frey, Jochen Reinmuth, Mawuli Ametowobla
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Patent number: 10000375Abstract: A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity. An access opening, connecting the first cavity to surroundings of the micromechanical component, is formed in the substrate or the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy and heat into an absorbing part of the substrate or cap with the aid of a laser. A recess is formed in a surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for accommodating a material area of the substrate or the cap converted into a liquid aggregate state.Type: GrantFiled: October 21, 2016Date of Patent: June 19, 2018Assignee: ROBERT BOSCH GMBHInventors: Frank Reichenbach, Jochen Reinmuth, Jens Frey, Julia Amthor
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Patent number: 9926188Abstract: A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.Type: GrantFiled: February 5, 2015Date of Patent: March 27, 2018Assignee: ROBERT BOSCH GMBHInventors: Johannes Classen, Torsten Kramer, Hubert Benzel, Jens Frey, Daniel Christoph Meisel, Christoph Schelling
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Patent number: 9919919Abstract: A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a cavity, a pressure prevailing and gas mixture having a chemical composition being enclosed in the cavity. An access opening connecting the to surroundings of the micromechanical component is formed in the substrate or in the cap. The pressure and/or chemical composition are/is adjusted in the cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. A layer is deposited on or grown on a surface of the substrate or of the cap in the area of the access opening for mixing with a material area of the substrate or of the cap, which is converted into a liquid aggregate state.Type: GrantFiled: November 21, 2016Date of Patent: March 20, 2018Assignee: ROBERT BOSCH GMBHInventors: Jens Frey, Jochen Reinmuth, Mawuli Ametowobla, Philip Kappe
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Publication number: 20170203958Abstract: A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.Type: ApplicationFiled: February 5, 2015Publication date: July 20, 2017Inventors: Johannes CLASSEN, Torsten KRAMER, Hubert BENZEL, Jens FREY, Daniel Christoph MEISEL, Christoph SCHELLING
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Patent number: 9688527Abstract: A micromechanical component is provided having a substrate having a main plane of extension, a first electrode extending mainly along a first plane in planar fashion, a second electrode extending mainly along a second plane in planar fashion, and a third electrode extending mainly along a third plane in planar fashion, the first, second, and third plane being oriented essentially parallel to the main plane of extension and being situated one over the other at a distance from one another along a normal direction that is essentially perpendicular to the main plane of extension, the micromechanical component having a deflectable mass element, the mass element being capable of being deflected both essentially parallel and also essentially perpendicular to the main plane of extension, the second electrode being connected immovably to the mass element, the second electrode having, in a rest position, a first region of overlap with the first electrode along a projection direction essentially parallel to the normal dType: GrantFiled: August 25, 2014Date of Patent: June 27, 2017Assignee: Robert Bosch GmbHInventors: Jens Frey, Jochen Reinmuth
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Publication number: 20170158496Abstract: A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a cavity, a pressure prevailing and gas mixture having a chemical composition being enclosed in the cavity. An access opening connecting the to surroundings of the micromechanical component is formed in the substrate or in the cap. The pressure and/or chemical composition are/is adjusted in the cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. A layer is deposited on or grown on a surface of the substrate or of the cap in the area of the access opening for mixing with a material area of the substrate or of the cap, which is converted into a liquid aggregate state.Type: ApplicationFiled: November 21, 2016Publication date: June 8, 2017Inventors: Jens Frey, Jochen Reinmuth, Mawuli Ametowobla, Philip Kappe
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Publication number: 20170158495Abstract: A method for manufacturing a micromechanical component including a substrate, and a cap connected to the substrate, the cap, together with the substrate, encloses a cavity, a pressure prevailing and a gas mixture having a first chemical composition being enclosed in the cavity. An access opening connecting the cavity to surroundings of the micromechanical component is formed in the substrate or in the cap. The pressure and/or the chemical composition is adjusted in the cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or the cap with the aid of a laser. A first crystalline, amorphous, nanocrystalline, or polycrystalline layer is deposited or grown on a surface of the substrate or of the cap, and/or a substrate including a second crystalline, amorphous, nanocrystalline, and/or polycrystalline layer, and/or a cap including the second crystalline, amorphous, nanocrystalline, and/or polycrystalline layer is provided.Type: ApplicationFiled: December 5, 2016Publication date: June 8, 2017Inventors: Achim Breitling, Frank Reichenbach, Jens Frey, Jochen Reinmuth, Julia Amthor
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Publication number: 20170113920Abstract: A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate and together with the substrate enclosing a first cavity, a first pressure prevailing and a first gas mixture with a first chemical composition being enclosed in the first cavity. An access opening, connecting the first cavity to surroundings of the micromechanical component, is formed in the substrate or the cap. The first pressure and/or the first chemical composition is adjusted in the first cavity. The access opening is sealed by introducing energy and heat into an absorbing part of the substrate or cap with the aid of a laser. A recess is formed in a surface of the substrate or of the cap facing away from the first cavity in the area of the access opening for accommodating a material area of the substrate or the cap converted into a liquid aggregate state.Type: ApplicationFiled: October 21, 2016Publication date: April 27, 2017Inventors: Frank Reichenbach, Jochen Reinmuth, Jens Frey, Julia Amthor
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Patent number: 9606141Abstract: A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.Type: GrantFiled: November 6, 2014Date of Patent: March 28, 2017Assignee: ROBERT BOSCH GMBHInventors: Jens Frey, Arnd Kaelberer, Jochen Reinmuth, Johannes Classen
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Patent number: 9567212Abstract: A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.Type: GrantFiled: October 24, 2013Date of Patent: February 14, 2017Assignee: ROBERT BOSCH GMBHInventors: Julian Gonska, Jochen Reinmuth, Kathrin Gutsche, Jens Frey, Heribert Weber
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Patent number: 9475693Abstract: Measures are provided which are used for stabilizing the substructure of the connecting areas of ASIC elements. These measures relate to ASIC elements including an ASIC substrate, into which electrical circuit functions are integrated, and including an ASIC layer structure on the ASIC substrate, which includes multiple wiring levels for the circuit functions, which are separated from one another by insulation layers and are interconnected via metallic plugs. At least one connecting area for placing wire bonds or for wafer bonding is implemented in at least one of the uppermost wiring levels. At least one chain of metallic plugs arranged vertically in a direct line is implemented in the ASIC layer structure below the connecting area, which extends from the uppermost wiring level up to the ASIC substrate or oxide trenches introduced therein.Type: GrantFiled: June 8, 2015Date of Patent: October 25, 2016Assignee: ROBERT BOSCH GMBHInventors: Daniel Christoph Meisel, Christoph Schelling, Torsten Kramer, Jens Frey
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Patent number: 9416000Abstract: To implement cavities having different internal pressures in joining two semiconductor elements, at least one of the two element surfaces to be joined is structured, so that at least one circumferential bonding frame area is recessed or elevated in comparison with at least one other circumferential bonding frame area. At least one connecting layer should then be applied to this structured element surface and at least two circumferential bonding frames should be structured out of this connecting layer on different surface levels of the element surface. The topography created in the element surface permits sequential bonding in which multiple cavities between the two elements may be successively hermetically sealed, so that a defined internal pressure prevails in each of the cavities.Type: GrantFiled: June 5, 2015Date of Patent: August 16, 2016Assignee: ROBERT BOSCH GMBHInventors: Christoph Schelling, Ralf Reichenbach, Jens Frey, Antoine Puygranier