Patents by Inventor Jens Jung

Jens Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12001246
    Abstract: A display control method applicable to an all-in-one (AIO) computer is provided. The AIO computer includes a first monitor and a second monitor. The display control method includes: receiving a control instruction from the first monitor; projecting a display content on the second monitor according to the control instruction; and selectively enabling a touch control function of the second monitor according to the control instruction.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: June 4, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yuni Lai, Jen-Chiu Chiang, Meng-Ru He, Chung-Shang Chi, Jia-Jung Kuo, Hsueh-Chih Tang, Shu-Yun Chen, Chun-Yen Huang, Chi-Rong Hsu, Yi-Ting Chen
  • Publication number: 20240179875
    Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.
    Type: Application
    Filed: February 7, 2024
    Publication date: May 30, 2024
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Sin-Hong LIEN, Jen-Mao CHEN
  • Patent number: 11996351
    Abstract: Semiconductor devices including lids having liquid-cooled channels and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first integrated circuit die; a lid coupled to the first integrated circuit die, the lid including a plurality of channels in a surface of the lid opposite the first integrated circuit die; a cooling cover coupled to the lid opposite the first integrated circuit die; and a heat transfer unit coupled to the cooling cover through a pipe fitting, the heat transfer unit being configured to supply a liquid coolant to the plurality of channels through the cooling cover.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sheng-Tsung Hsiao, Jen Yu Wang, Chung-Jung Wu, Tung-Liang Shao, Chih-Hang Tung
  • Publication number: 20240168387
    Abstract: A method and a system for inspecting an extreme ultra violet mask and a mask pod for such masks is provided. An EUV mask inspection tool inspects a mask retrieved from a mask pod placed on the load port positioned exterior of the mask inspection tool. The inspection process is performed during a selected period of time. After the inspection process is initiated, a robotic handling mechanism such as a robotic arm or an AMHS picks up the mask pod and inspects the mask pod for foreign particles. A mask pod inspection tool determines whether the mask pod needs cleaning or replacing based on a selected swap criteria. The mask pod is retrieved from the mask pod inspection tool and placed on the load port before the selected period of time lapses. This method and system promotes a reduction in the overall time required for inspecting the mask and the mask pod.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 23, 2024
    Inventors: Tung-Jung CHANG, Jen-Yang CHUNG, Han-Lung CHANG
  • Patent number: 11991867
    Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: May 21, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Jen-Mao Chen, Shao-Yu Chen
  • Patent number: 11973377
    Abstract: Disclosed is a method and a system for pretensioning fiber-reinforced plastic (FRP) sleeves surrounding an assembly of parts. The method includes application of pretensioning FRP sleeves surrounding a permanent magnet rotor with surface magnets.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: April 30, 2024
    Assignee: Albany Engineered Composites, Inc.
    Inventors: Ralph Funck, Jens Jung, Martin Welsch
  • Publication number: 20240136251
    Abstract: A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang
  • Patent number: 11955405
    Abstract: A semiconductor package includes a package substrate; semiconductor devices disposed on the package substrate; a package ring disposed on a perimeter of the package substrate surrounding the semiconductor devices; a cover including silicon bonded to the package ring and covering the semiconductor devices; and a thermal interface structure (TIS) thermally connecting the semiconductor devices to the cover.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jen Yu Wang, Chung-Jung Wu, Sheng-Tsung Hsiao, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
  • Publication number: 20240093024
    Abstract: A polymer is formed by capping a copolymer-graft-polylactone with an alcohol, wherein the copolymer is copolymerized from an anhydride monomer with a double bond, a monomer with a double bond, and an initiator. The polymer can be mixed with an organic solvent and pigment powder to form a dispersion. The dispersion can be mixed with a binder to form a paint.
    Type: Application
    Filed: November 23, 2022
    Publication date: March 21, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cha-Wen CHANG, Jen-Yu CHEN, Wan-Jung TENG, Wen-Pin CHUANG, Ruo-Han YU
  • Patent number: 11937405
    Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: March 19, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu Nien Huang, Sin-Hong Lien, Jen-Mao Chen
  • Publication number: 20240087207
    Abstract: Disclosed herein are system, method, and computer program product embodiments for reducing GPU load by programmatically controlling shading rates in computer graphics. GPU load may be reduced by applying different shading rates to different screen regions. By reading the depth buffer of previous frames and performing image processing, thresholds may be calculated that control the shading rates. The approach may be run on any platform that supports VRS hardware and primitive- or image-based VRS. The approach may be applied on a graphics driver installed on a client device, in a firmware layer between hardware and a driver, in a software layer between a driver and an application, or in hardware on the client device. The approach is flexible and adaptable and calculates and sets the variable rate shading based on the graphics generated by an application without requiring the application developer to manually set variable rate shading.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Applicant: MediaTek Inc.
    Inventors: Po-Yu HUANG, Shih-Chin LIN, Jen-Jung CHENG, Tu-Hsiu LEE
  • Patent number: 11921431
    Abstract: A method and a system for inspecting an extreme ultra violet mask and a mask pod for such masks is provided. An EUV mask inspection tool inspects a mask retrieved from a mask pod placed on the load port positioned exterior of the mask inspection tool. The inspection process is performed during a selected period of time. After the inspection process is initiated, a robotic handling mechanism such as a robotic arm or an AMHS picks up the mask pod and inspects the mask pod for foreign particles. A mask pod inspection tool determines whether the mask pod needs cleaning or replacing based on a selected swap criteria. The mask pod is retrieved from the mask pod inspection tool and placed on the load port before the selected period of time lapses. This method and system promotes a reduction in the overall time required for inspecting the mask and the mask pod.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tung-Jung Chang, Jen-Yang Chung, Han-Lung Chang
  • Patent number: 11921552
    Abstract: A computer chassis includes walls defining an airspace containing heat-generating components (e.g., storage drives). The airspace is divided into first and second regions, such as by a printed circuit board supporting the heat-generating components within the first region. An air input feeds both the first region and second region. Input air going through the first region first passes by a forward set of heat-generating components before continuing to a rearward set of heat-generating components to extract heat therefrom. Input air going through the second region bypasses the forward set of heat-generating components before being directed out through an air opening partway down the length of the chassis, after which this air passes by a rearward set of heat-generating components to extract heat.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: March 5, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Jen-Hui Wang
  • Publication number: 20240001626
    Abstract: Disclosed are reinforced structures. The structures are comprised of reinforced elements that have continuous fibers embedded in a matrix material. The reinforced elements are combined in a matrix material to form a desired shape of reinforced structure.
    Type: Application
    Filed: September 18, 2023
    Publication date: January 4, 2024
    Applicant: Albany Engineered Composites, Inc.
    Inventors: Ralph Funck, Jens Jung, Martin Welsch
  • Patent number: 11813806
    Abstract: Disclosed are reinforced structures. The structures are comprised of reinforced elements that have continuous fibers embedded in a matrix material. The reinforced elements are combined in a matrix material to form a desired shape of reinforced structure.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: November 14, 2023
    Assignee: Albany Engineered Composites, Inc.
    Inventors: Ralph Funck, Jens Jung, Martin Welsch
  • Publication number: 20230025347
    Abstract: Disclosed are embodiments of a graphics scene detection technique that provides an adaptive scale factor dependent on an image quality, such that certain images may be downscaled prior to being displayed to preserve system resources without significantly affecting image quality for a user. The inventors recognized and appreciated that certain images may be presented at a lower resolution to a user without being perceived as lower image quality. Some aspects provide a scene detection module that determines a quality score from a graphic command output for an image. Depending on the quality score, the scene detection module may output a quality-aware scale factor that can be applied to reduce pixel resolution of an image before displaying the image to a user. Resultingly, the computing device may be improved by saving system resources including memory bandwidth, processing power for other apps or instances, without negatively affecting visual perception of the scene.
    Type: Application
    Filed: June 24, 2022
    Publication date: January 26, 2023
    Applicant: MediaTek Inc.
    Inventors: Jen-Jung Cheng, Shih-Chin Lin, Du-Xiu Li, Ying-Chieh Chen, Kun-Han Huang
  • Publication number: 20220344989
    Abstract: Disclosed is a method and a system for pretensioning fiber-reinforced plastic (FRP) sleeves surrounding an assembly of parts. The method includes application of pretensioning FRP sleeves surrounding a permanent magnet rotor with surface magnets.
    Type: Application
    Filed: April 19, 2022
    Publication date: October 27, 2022
    Inventors: Ralph Funck, Jens Jung, Martin Welsch
  • Publication number: 20210370619
    Abstract: Disclosed are reinforced structures. The structures are comprised of reinforced elements that have continuous fibers embedded in a matrix material. The reinforced elements are combined in a matrix material to form a desired shape of reinforced structure.
    Type: Application
    Filed: May 24, 2021
    Publication date: December 2, 2021
    Inventors: Ralph Funck, Jens Jung, Martin Welsch
  • Patent number: 10146296
    Abstract: An integrated circuit is provided with an independent power framework for a first subsystem and another independent power framework for a processor subsystem that receives messages from the first subsystem.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: December 4, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Kenneth Gainey, Eunjoo Hwang, Karthik Reddy Neravetla, Jen-Jung Hsu
  • Patent number: 9425489
    Abstract: A charging and discharging system is disclosed. The charging and discharging system includes a first cell assembly and a second cell assembly. The first battery cell assembly includes a first cell, a first connecting piece, and a second connecting piece. The second cell assembly includes a second cell, a third connecting piece, and a fourth connecting piece. The first connecting piece and the second connecting piece connect the first cell to a circuit board. The third connecting piece and the fourth connecting piece connect the second cell to the circuit board. A length of the third connecting piece and the fourth connecting piece is greater than a total length of the first connecting piece and the second connecting piece. A resistivity of the third connecting piece and the fourth connecting piece is smaller than a length of the first connecting piece and the second connecting piece.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: August 23, 2016
    Assignee: ScienBiziP Consulting (Shenzhen) Co., Ltd.
    Inventor: Jen-Jung Hsiao