Abstract: A bearing unit (1) for a suspension strut (2) of a motor vehicle (3), has at least the following components: a guide ring (4) having a guide axis (5) for a wheel spring (6); a cap (7) with a damper holder (8) for a damper block (9); a bumpstop holder (10) for a bumpstop (11); an axial bearing (12) with a bearing pitch circle (13) for supporting the guide ring (4) on the cap (7) and for low-friction rotation about the guide axis (5) relative to the cap (7). The bumpstop holder (10) is formed integrally by the cap (7).

Abstract: The invention provides a method for providing a luminescent particle with a hybrid coating, the method comprising: (i) providing a luminescent core comprising a primer layer on the luminescent core; (ii) providing a main ALD coating layer onto the primer layer by application of a main atomic layer deposition process, the main ALD coating layer comprising a multilayer with two or more layers having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; (iii) providing a main sol-gel coating layer onto the main ALD-coating layer by application of a main sol-gel coating process, the main sol-gel coating layer having a chemical composition different from one or more of the layers of the multilayer.

Abstract: The invention provides a method for providing a luminescent particle (100) with a hybrid coating, the method comprising: (i) providing a luminescent core (102) comprising a primer layer (105) on the luminescent core (102); (ii) providing a main ALD coating layer (120) onto the primer layer (105) by application of a main atomic layer deposition process, the main ALD coating layer (120) comprising a multilayer (1120) with two or more layers (1121) having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; (iii) providing a main sol-gel coating layer (130) onto the main ALD-coating layer (120) by application of a main sol-gel coating process, the main sol-gel coating layer (130) having a chemical composition different from one or more of the layers (1121) of the multilayer (1120).

Abstract: An optical coupling structures are disposed on light output surfaces of semiconductor LEDs of a miniLED or microLED array to facilitate coupling of light emitted by the semiconductor LEDs through the light output surfaces. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LEDs.

Abstract: The invention provides a method for providing a luminescent particle (100) with a hybrid coating, the method comprising: (i) providing a luminescent core (102) comprising a primer layer (105) on the luminescent core (102); (ii) providing a main ALD coating layer (120) onto the primer layer (105) by application of a main atomic layer deposition process, the main ALD coating layer (120) comprising a multilayer (1120) with two or more layers (1121) having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; (iii) providing a main sol-gel coating layer (130) onto the main ALD-coating layer (120) by application of a main sol-gel coating process, the main sol-gel coating layer (130) having a chemical composition different from one or more of the layers (1121) of the multilayer (1120).

Abstract: A polymer dispersion layer is formed on a substrate or semiconductor light-emitting devices on the substrate. After forming the polymer dispersion layer, drying and curing the polymer dispersion layer forms a cured polymer layer. After curing and drying, with the cured polymer layer being present on only selected, masked areas of the substrate or light-emitting devices, and with other areas of the substrate or light-emitting devices lacking the cured polymer layer and remaining exposed, a material layer is formed on at least the exposed areas of the substrate or light-emitting devices. After forming the material layer, the cured polymer layer is removed from the masked areas, leaving the material layer on the exposed areas.

Abstract: Embodiments include a device having a micro-LED that includes at least two, individually addressable light emitting diodes on a same substrate; a phosphor converter layer disposed on the micro-LED, the phosphor converter layer including phosphor particles having a D50 of greater than 1 ?m and less than 10 ?m.

Abstract: A layer of multiple phosphor particles is formed on a surface of a substrate, and inorganic material is formed or deposited to embed at least partially the layer of phosphor particles on the substrate. A wavelength-converting layer is thus formed, including the phosphor particles and the inorganic material, that is then separated from the substrate. The inorganic material binds together the phosphor particles so that the wavelength-converting layer is self-supporting. In some examples, before separating the wavelength-converting layer from the substrate, a release member can be adhered to a surface of the wavelength-converting layer opposite the substrate; the wavelength-converting layer can remain adhered to the release member after separation from the substrate. In some examples the wavelength-converting layer can be adhered to a light-emitting surface of a semiconductor light-emitting device.

Abstract: An optical coupling structures are disposed on light output surfaces of semiconductor LEDs of a miniLED or microLED array to facilitate coupling of light emitted by the semiconductor LEDs through the light output surfaces. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LEDs.

Abstract: A particle layer is positioned over a light output surface of a light emitting diode. A transparent protection layer positioned between and in contact with the light output surface and the particle layer. The particle layer comprises a multitude of optically scattering or luminescent particles and a thin coating layer of transparent material coating particles of the multitude. The particles are characterized by a D50 greater than about 1.0 ?m and less than about 30. ?m; the coating layer has a thickness less than about 0.20 ?m. The protection layer is less than about 0.05 ?m thick and includes one or more materials different from material of the coating layer. The protection and coating layers can each include one or more metal or semiconductor oxides. Oxide precursor reactivities, with respect to the corresponding light output surface, are less for protection layer material than for coating layer material.

Abstract: An optical coupling structures are disposed on light output surfaces of semiconductor LEDs of a miniLED or microLED array to facilitate coupling of light emitted by the semiconductor LEDs through the light output surfaces. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LEDs.

Abstract: A particle layer is positioned over a light output surface of a light emitting diode. A transparent protection layer positioned between and in contact with the light output surface and the particle layer. The particle layer comprises a multitude of optically scattering or luminescent particles and a thin coating layer of transparent material coating particles of the multitude. The particles are characterized by a D50 greater than about 1.0 ?m and less than about 30. ?m; the coating layer has a thickness less than about 0.20 ?m. The protection layer is less than about 0.05 ?m thick and includes one or more materials different from material of the coating layer. The protection and coating layers can each include one or more metal or semiconductor oxides. Oxide precursor reactivities, with respect to the corresponding light output surface, are less for protection layer material than for coating layer material.

Abstract: Embodiments include a device having a component with a component surface; a phosphor converter body with a phosphor converter body surface facing the component surface; a plurality of particles between and in contact with the component surface and the phosphor converter body surface; and an inorganic coating on and in contact with at least a portion of the particles, at least a portion of the component surface, and at least a portion of the phosphor converter body surface, and a method making such device.

Abstract: The invention provides a method for providing a luminescent particle with a hybrid coating, the method comprising: (i) providing a luminescent core comprising a primer layer on the luminescent core; (ii) providing a main ALD coating layer onto the primer layer by application of a main atomic layer deposition process, the main ALD coating layer comprising a multilayer with two or more layers having different chemical compositions, and wherein in the main atomic layer deposition process a metal oxide precursor is selected from a group of metal oxide precursors comprising Al, Zn, Hf, Ta, Zr, Ti, Sn, Nb, Y, Ga, and V; (iii) providing a main sol-gel coating layer onto the main ALD-coating layer by application of a main sol-gel coating process, the main sol-gel coating layer having a chemical composition different from one or more of the layers of the multilayer.

Abstract: An optical coupling structure is disposed on a light output surface of a semiconductor LED to facilitate coupling of light emitted by the semiconductor LED through the light output surface. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LED.

Abstract: An optical coupling structure is disposed on a light output surface of a semiconductor LED to facilitate coupling of light emitted by the semiconductor LED through the light output surface. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LED.

Abstract: An optical coupling structures are disposed on light output surfaces of semiconductor LEDs of a miniLED or microLED array to facilitate coupling of light emitted by the semiconductor LEDs through the light output surfaces. The optical coupling structures comprise light scattering particles and/or air voids embedded in or coated with a thin layer of a material that has an index of refraction close to or matching the index of refraction of the material forming the light output surface of the semiconductor LEDs.

Abstract: Embodiments include a device having a micro-LED that includes at least two, individually addressable light emitting diodes on a same substrate; a phosphor converter layer disposed on the micro-LED, the phosphor converter layer including phosphor particles having a D50 of greater than 1 ?m and less than 10 ?m.

Abstract: Embodiments include a device having a component with a component surface; a phosphor converter body with a phosphor converter body surface facing the component surface; a plurality of particles between and in contact with the component surface and the phosphor converter body surface; and an inorganic coating on and in contact with at least a portion of the particles, at least a portion of the component surface, and at least a portion of the phosphor converter body surface, and a method making such device.

Abstract: The invention relates to a substrate (2) for manufacturing an organic conversion device for converting electrical energy into light energy or light energy into electrical energy, wherein the substrate comprises a) an encapsulation layer (3) on the substrate, wherein the encapsulation layer includes a first inorganic layer (7), a second inorganic layer (9) and an intermediate organic layer (8), and b) a getter reservoir (6) in contact with the organic layer of the encapsulation layer. Water molecules will therefore not only be transported along the intermediate organic layer, but will also be gathered, especially absorbed, by the getter reservoir, if the encapsulation is damaged. This can slow down a transport of water molecules along a leakage path towards an organic conversion layer of the organic conversion device and hence slow down a possible degradation of the performance of the organic conversion device, if the encapsulation layer is damaged.