Patents by Inventor Jeong Ah Yoon

Jeong Ah Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135863
    Abstract: A display device includes a display unit including pixels connected to data lines and scan lines, first and second temperature sensors for sensing first and second temperatures of the display unit, a data driver configured to generate a data signal configured to be supplied to the data lines using output data, and attached to a first printed circuit board configured to be fixed to a rear surface of the display unit, a timing controller configured to generate the output data using input data, and attached to a second printed circuit board configured to be fixed to the rear surface of the display unit, and a storage having a temperature weight table including a weight corresponding to the first and second temperatures and a plurality of temperature tables including temperature information of the display unit corresponding to an attachment position of the second printed circuit board.
    Type: Application
    Filed: July 13, 2023
    Publication date: April 25, 2024
    Inventors: Won Jin SEO, Tae Wan KIM, Hwa An SUNG, Hyun Sik YOON, Jeong Ah LEE, Dae Ho HWANG
  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Publication number: 20220184075
    Abstract: The present invention relates to a pharmaceutical composition containing an HDAC6 inhibitor as an active ingredient for prevention or treatment of itching. The present invention provides a novel pharmaceutical composition containing, as an active ingredient, an inhibitor for inhibiting an HDAC6 enzyme, and thus can effectively inhibit and treat itching caused by trypsin, tryptase, histamine, antimycin A, chloroquine, or the like.
    Type: Application
    Filed: March 7, 2022
    Publication date: June 16, 2022
    Inventors: Jun Ho Jang, Jeong Ah Yoon
  • Publication number: 20210077487
    Abstract: The present invention relates to a pharmaceutical composition containing an HDAC6 inhibitor as an active ingredient for prevention or treatment of itching. The present invention provides a novel pharmaceutical composition containing, as an active ingredient, an inhibitor for inhibiting an HDAC6 enzyme, and thus can effectively inhibit and treat itching caused by trypsin, tryptase, histamine, antimycin A, chloroquine, or the like.
    Type: Application
    Filed: November 15, 2018
    Publication date: March 18, 2021
    Inventors: Jun Ho Jang, Jeong Ah Yoon
  • Patent number: 10386404
    Abstract: A method for detecting damage of a solder joint of a printed circuit board of an electronic product by using a device for detecting damage of an electronic product according to the present invention includes: generating a digital signal and applying the digital signal to the solder joint of the printed circuit board; measuring a signal transmitted through the solder joint of the printed circuit board; and determining whether the solder joint of the printed circuit board is damaged using the measured signal. Accordingly, the device for detecting damage of an electronic product according to the present invention can nondestructively examine damage of the electronic product by using the digital signal.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: August 20, 2019
    Assignee: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Daeil Kwon, Jeong Ah Yoon
  • Publication number: 20180203055
    Abstract: A method for detecting damage of a solder joint of a printed circuit board of an electronic product by using a device for detecting damage of an electronic product according to the present invention includes: generating a digital signal and applying the digital signal to the solder joint of the printed circuit board; measuring a signal transmitted through the solder joint of the printed circuit board; and determining whether the solder joint of the printed circuit board is damaged using the measured signal. Accordingly, the device for detecting damage of an electronic product according to the present invention can nondestructively examine damage of the electronic product by using the digital signal.
    Type: Application
    Filed: May 2, 2016
    Publication date: July 19, 2018
    Inventors: Daeil Kwon, Jeong Ah Yoon
  • Patent number: 9556514
    Abstract: Deposition of material is performed on a substrate by causing short-distance reciprocating motions of the substrate that improve uniformity of material on the substrate. A series of reactors for injecting material onto the substrate is arranged along the length of the substrate in a repeating manner. During each reciprocating motion, the susceptor moves a distance shorter than an entire length of the substrate. Portions of the substrate are injected with materials by a subset of reactors. Since the movement of the substrate is smaller, a linear deposition device including the susceptor may be made smaller.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: January 31, 2017
    Assignee: Veeco ALD Inc.
    Inventors: Jeong Ah Yoon, Suk Yal Cha, Seung Yeop Baek, Daniel H. Lee, Samuel S. Pak, Daniel Yang, Sang In Lee
  • Publication number: 20150299857
    Abstract: Embodiments relate to a deposition device for depositing one or more layers of material onto a surface of a substrate using an injector module assembly according to a relative movement between the injector module assembly and the substrate. The injector module assembly injects different gases through auxiliary gas injectors of the injector module assembly onto the surface of the substrate depending on the direction of relative movement between the injector module assembly and the substrate to improve the deposition rate. A first auxiliary gas injector injects nucleophile gas and a second auxiliary gas injector injects separation gas while the injector module assembly and the substrate makes a relative movement in one direction. When the injector module assembly and the substrate makes a relative movement in the opposite direction, the first auxiliary gas injector injects the separation gas and the second auxiliary gas injector injects the nucleophile gas.
    Type: Application
    Filed: April 16, 2015
    Publication date: October 22, 2015
    Inventors: Sang In Lee, Jeong Ah Yoon, Jeong Hee Kim
  • Publication number: 20150218698
    Abstract: Embodiments relate to performing deposition of material on a substrate by causing short-distance reciprocating motions of the substrate. A series of reactors for injecting material onto the substrate is arranged along the length of the substrate in a repeating manner. During each reciprocating motion, the susceptor moves a distance shorter than an entire length of the substrate. Portions of the substrate are injected with materials by a subset of reactors. Since the movement of the substrate is smaller, a linear deposition device including the susceptor may be made smaller.
    Type: Application
    Filed: January 23, 2015
    Publication date: August 6, 2015
    Inventors: Jeong Ah Yoon, Suk Yal Cha, Seung Yeop Baek, Daniel H. Lee, Samuel S. Pak, Daniel Yang, Sang In Lee
  • Publication number: 20150104574
    Abstract: Embodiments relate to an atomic layer deposition (ALD) process that uses a seed precursor for increased deposition rate. A first reactant precursor (e.g., H2O) may be formed as a result of reaction. The first reactant precursor may react with or substitute source precursor (e.g., 3DMAS) in a subsequent process to deposit material on a substrate. In addition, a second reactant precursor (e.g., radicals) may be separately injected onto the substrate previously injected with the source precursor. By causing the source precursor to react with the first reactant precursor from the surface of the substrate and also react with the second reactant provided by the injector, the material is deposited on the substrate in an expedient manner.
    Type: Application
    Filed: October 14, 2014
    Publication date: April 16, 2015
    Inventors: Sang In Lee, Chang Wan Hwang, Jeong Ah Yoon