Patents by Inventor Jeong Don Ihm
Jeong Don Ihm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240021259Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.Type: ApplicationFiled: July 28, 2023Publication date: January 18, 2024Inventors: EUN-JI KIM, JUNG-JUNE PARK, JEONG-DON IHM, BYUNG-HOON JEONG, YOUNG-DON CHOI
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Patent number: 11804270Abstract: A non-volatile memory device includes a memory cell region including a first metal pad and a memory cell array including a plurality of memory cells, and a peripheral circuit region including a second metal pad and an output driver to output a data signal, and vertically connected to the memory cell region by the first metal pad and the second metal pad. The output driver includes a pull-up driver and a pull-down driver. The pull-up driver includes a first pull-up driver having a plurality of P-type transistors and a second pull-up driver having a plurality of N-type transistors. The pull-down driver includes a plurality of N-type transistors. One or more power supply voltages having different voltage levels are selectively applied to the pull-up driver. A first power supply voltage is applied to the first pull-up driver, and a second power supply voltage is applied to the second pull-up driver.Type: GrantFiled: August 30, 2021Date of Patent: October 31, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Ji-Yeon Shin, Jeong-Don Ihm, Byung-Hoon Jeong, Jung-June Park
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Publication number: 20230298639Abstract: A memory device includes; a first memory chip including a first on-die Termination (ODT) circuit comprising a first ODT resistor, a second memory chip including a second ODT circuit comprising a second ODT resistor, at least one chip enable signal pin that receives at least one chip enable signal, wherein the at least one chip enable signal selectively enables at least one of the first memory chip and the second memory chip, and an ODT pin commonly connected to the first memory chip and the second memory chip that receives an ODT signal, wherein the ODT signal defines an enable period for at least one of the first ODT circuit and the second ODT circuit, and in response to the ODT signal and the at least one chip enable signal, one of the first ODT resistor and the second ODT resistor is enabled to terminate a signal received by at least one of the first memory chip and the second memory chip.Type: ApplicationFiled: May 25, 2023Publication date: September 21, 2023Inventors: EUN-JI KIM, JUNG-JUNE PARK, JEONG-DON IHM, BYUNG-HOON JEONG, YOUNG-DON CHOI
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Patent number: 11742040Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.Type: GrantFiled: March 25, 2022Date of Patent: August 29, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun-Ji Kim, Jung-June Park, Jeong-Don Ihm, Byung-Hoon Jeong, Young-Don Choi
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Patent number: 11705166Abstract: A memory device includes; a first memory chip including a first on-die Termination (ODT) circuit comprising a first ODT resistor, a second memory chip including a second ODT circuit comprising a second ODT resistor, at least one chip enable signal pin that receives at least one chip enable signal, wherein the at least one chip enable signal selectively enables at least one of the first memory chip and the second memory chip, and an ODT pin commonly connected to the first memory chip and the second memory chip that receives an ODT signal, wherein the ODT signal defines an enable period for at least one of the first ODT circuit and the second ODT circuit, and in response to the ODT signal and the at least one chip enable signal, one of the first ODT resistor and the second ODT resistor is enabled to terminate a signal received by at least one of the first memory chip and the second memory chip.Type: GrantFiled: February 23, 2021Date of Patent: July 18, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Eun-Ji Kim, Jung-June Park, Jeong-Don Ihm, Byung-Hoon Jeong, Young-Don Choi
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Publication number: 20230205711Abstract: A memory device includes a path state check circuit configured to check states of signal transmission paths, each signal transmission path including a data transmission path and a clock transmission path of the memory device. The path state check circuit includes a sampling circuit configured to perform a sampling operation by using pattern data that has passed through the data transmission path and a clock signal that has passed through the clock transmission path, and generate sample data, and a management circuit configured to generate a comparison of the sample data with the pattern data and manage check result information indicating whether a re-training operation for the memory device is to be performed, based on a result of the comparison.Type: ApplicationFiled: February 17, 2023Publication date: June 29, 2023Applicant: Samsung Electronics Co., Ltd.Inventors: Won-joo JUNG, Jang-Woo LEE, Byung-hoon JEONG, Jeong-don IHM
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Patent number: 11604714Abstract: A memory device includes a path state check circuit configured to check states of signal transmission paths, each signal transmission path including a data transmission path and a clock transmission path of the memory device. The path state check circuit includes a sampling circuit configured to perform a sampling operation by using pattern data that has passed through the data transmission path and a clock signal that has passed through the clock transmission path, and generate sample data, and a management circuit configured to generate a comparison of the sample data with the pattern data and manage check result information indicating whether a re-training operation for the memory device is to be performed, based on a result of the comparison.Type: GrantFiled: August 21, 2020Date of Patent: March 14, 2023Assignee: Samsung Electronics Co, Ltd.Inventors: Won-joo Jung, Jang-woo Lee, Byung-hoon Jeong, Jeong-don Ihm
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Patent number: 11600539Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.Type: GrantFiled: June 23, 2021Date of Patent: March 7, 2023Inventors: Min-Jae Lee, Sang-Lok Kim, Byung-Hoon Jeong, Tae-Sung Lee, Jeong-Don Ihm, Jae-Yong Jeong, Young-Don Choi
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Publication number: 20220215892Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.Type: ApplicationFiled: March 25, 2022Publication date: July 7, 2022Inventors: Eun-ji KIM, JUNG-JUNE PARK, JEONG-DON IHM, BYUNG-HOON JEONG, YOUNG-DON CHOI
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Patent number: 11342038Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.Type: GrantFiled: January 29, 2021Date of Patent: May 24, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun-Ji Kim, Jung-June Park, Jeong-Don Ihm, Byung-Hoon Jeong, Young-Don Choi
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Patent number: 11257531Abstract: Provided is a nonvolatile memory including a clock pin configured to receive an external clock signal during a duty correction circuit training period; a plurality of memory chips configured to perform a duty correction operation on an internal clock signal based on the external clock signal, the plurality of memory chips configured to perform the duty correction operation in parallel during the training period; and an input/output pin commonly connected to the plurality of memory chips, wherein each of the plurality of memory chips includes: a duty correction circuit (DCC) configured to perform the duty correction operation on the internal clock signal; and an output buffer connected between an output terminal of the DCC and the input/output pin.Type: GrantFiled: January 27, 2021Date of Patent: February 22, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Jung-june Park, Jeong-don Ihm, Byung-hoon Jeong, Eun-ji Kim, Ji-yeon Shin, Young-don Choi
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Patent number: 11244738Abstract: Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.Type: GrantFiled: August 4, 2020Date of Patent: February 8, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dae Hoon Na, Jang Woo Lee, Jin Do Byun, Jeong Don Ihm
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Publication number: 20210391023Abstract: A non-volatile memory device includes a memory cell region including a first metal pad and a memory cell array including a plurality of memory cells, and a peripheral circuit region including a second metal pad and an output driver to output a data signal, and vertically connected to the memory cell region by the first metal pad and the second metal pad. The output driver includes a pull-up driver and a pull-down driver. The pull-up driver includes a first pull-up driver having a plurality of P-type transistors and a second pull-up driver having a plurality of N-type transistors. The pull-down driver includes a plurality of N-type transistors. One or more power supply voltages having different voltage levels are selectively applied to the pull-up driver. A first power supply voltage is applied to the first pull-up driver, and a second power supply voltage is applied to the second pull-up driver.Type: ApplicationFiled: August 30, 2021Publication date: December 16, 2021Inventors: Ji-yeon SHIN, Jeong-don IHM, Byung-hoon JEONG, Jung-june PARK
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Publication number: 20210320039Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Inventors: Min-Jae LEE, Sang-Lok KIM, Byung-Hoon JEONG, Tae-Sung LEE, Jeong-Don IHM, Jae-Yong JEONG, Young-Don CHOI
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Patent number: 11114171Abstract: A non-volatile memory device includes a memory cell region including a first metal pad and a memory cell array including a plurality of memory cells, and a peripheral circuit region including a second metal pad and an output driver to output a data signal, and vertically connected to the memory cell region by the first metal pad and the second metal pad. The output driver includes a pull-up driver and a pull-down driver. The pull-up driver includes a first pull-up driver having a plurality of P-type transistors and a second pull-up driver having a plurality of N-type transistors. The pull-down driver includes a plurality of N-type transistors. One or more power supply voltages having different voltage levels are selectively applied to the pull-up driver. A first power supply voltage is applied to the first pull-up driver, and a second power supply voltage is applied to the second pull-up driver.Type: GrantFiled: September 2, 2020Date of Patent: September 7, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Ji-yeon Shin, Jeong-don Ihm, Byung-hoon Jeong, Jung-june Park
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Patent number: 11062966Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.Type: GrantFiled: March 19, 2019Date of Patent: July 13, 2021Inventors: Min-Jae Lee, Sang-Lok Kim, Byung-Hoon Jeong, Tae-Sung Lee, Jeong-Don Ihm, Jae-Yong Jeong, Young-Don Choi
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Publication number: 20210201964Abstract: A memory device includes; a first memory chip including a first on-die Termination (ODT) circuit comprising a first ODT resistor, a second memory chip including a second ODT circuit comprising a second ODT resistor, at least one chip enable signal pin that receives at least one chip enable signal, wherein the at least one chip enable signal selectively enables at least one of the first memory chip and the second memory chip, and an ODT pin commonly connected to the first memory chip and the second memory chip that receives an ODT signal, wherein the ODT signal defines an enable period for at least one of the first ODT circuit and the second ODT circuit, and in response to the ODT signal and the at least one chip enable signal, one of the first ODT resistor and the second ODT resistor is enabled to terminate a signal received by at least one of the first memory chip and the second memory chip.Type: ApplicationFiled: February 23, 2021Publication date: July 1, 2021Inventors: EUN-JI KIM, JUNG-JUNE PARK, JEONG-DON IHM, BYUNG-HOON JEONG, YOUNG-DON CHOI
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Patent number: 11024400Abstract: A nonvolatile memory (NVM) device includes a data pin, a control pin, an on-die termination (ODT) pin, and a plurality of NVM memory chips commonly connected to the data pin and the control pin. A first NVM chip among the NVM chips includes an ODT circuit. The first NVM chip determines one of an ODT write mode and an ODT read mode based on a control signal received through the control pin and an ODT signal received through the ODT pin, uses the ODT circuit to perform an ODT on the data pin during the ODT write mode, and uses the ODT circuit to perform the ODT on the control pin during the ODT read mode.Type: GrantFiled: April 30, 2020Date of Patent: June 1, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eun-Ji Kim, Jung-June Park, Jeong-Don Ihm, Byung-Hoon Jeong, Young-Don Choi
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Patent number: 11017877Abstract: Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.Type: GrantFiled: August 12, 2019Date of Patent: May 25, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Dae Hoon Na, Jang Woo Lee, Jin Do Byun, Jeong Don Ihm
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Patent number: RE49206Abstract: A nonvolatile memory device includes a first memory structure. The first memory structure includes first through N-th memory dies that may be connected to an external memory controller via a first channel. N is a natural number equal to or greater than two. At least one of the first through N-th memory dies is configured to be used as a first representative die that performs an on-die termination (ODT) operation while a data write operation is performed for one of the first through N-th memory dies.Type: GrantFiled: November 22, 2019Date of Patent: September 6, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Dae-Woon Kang, Jeong-don Ihm, Byung-Hoon Jeong, Young-Don Choi