Abstract: The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

Abstract: A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.

Abstract: The present invention relates to a thermosetting resin composition, and a prepreg, a laminate sheet and a printed circuit board, which use the same. The thermosetting resin composition comprises: (a) a polyphenylene ether having two or more unsaturated substituents, selected from the group consisting of vinyl and allyl groups, at both ends of its molecular chain, or an oligomer thereof; and (b) a polytetrafluoroethylene (PTFE) filler.

Abstract: A thermosetting resin composition for use with high frequencies is provided. The composition includes: (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. It is possible to provide a printed circuit board for use with high frequencies which simultaneously exhibits, inter alia, an outstanding low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, thermal stability and outstanding working properties.

Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.

Abstract: The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.

Abstract: The present disclosure provides: a thermosetting resin composition comprising: (a) bisphenol M-type epoxy resin; (b) bisphenol M-type cyanate ester resin; (c) polyphenylene ether having two or more vinyl groups at both ends of a branched chain, or oligomers thereof; and (d) a cross-linking curing agent, a prepreg comprising the composition, and a printed circuit board. The printed circuit board simultaneously has an excellent low dielectric loss characteristic, a great moisture-absorbing and heat-resistant characteristic, a low thermal expansion characteristic, thermal stability and the like.

Abstract: Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that the space between heavy copper, which is comparable to a thick film, can be filled efficiently without creating voids. The PCB includes a copper clad laminate having first copper patterned on one surface or both surfaces of a core substrate; at least one first prepreg laminated on one surface or both surfaces of the copper clad laminate, nonwoven glass web being used as the substrate of the first prepreg; at least one second prepreg laminated on one surface or both surfaces of the first prepreg, glass fabric being used as a substrate of the second prepreg; and second copper laminated on one surface or both surfaces of the second prepreg.

Abstract: Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that the space between heavy copper, which is comparable to a thick film, can be filled efficiently without creating voids. The PCB includes a copper clad laminate having first copper patterned on one surface or both surfaces of a core substrate; at least one first prepreg laminated on one surface or both surfaces of the copper clad laminate, nonwoven glass web being used as the substrate of the first prepreg; at least one second prepreg laminated on one surface or both surfaces of the first prepreg, glass fabric being used as a substrate of the second prepreg; and second copper laminated on one surface or both surfaces of the second prepreg.