Abstract: A display device includes a substrate and a first pad. The substrate includes a display area to display an image, and a pad area outside the display area. The first pad is in the pad area, and includes first pad terminals extending parallel to one another in a first direction. The first pad terminals include: first connection pad terminals arranged along a first column that forms a first slope angle with the first direction; second connection pad terminals spaced apart from the first connection pad terminals and arranged along a second column that forms a second slope angle with the first direction; and a first dummy pad terminal between a pair of adjacent first connection pad terminals among the first connection pad terminals along the first column. The first dummy pad terminal and the first connection pad terminals are in different layers than one another.

Abstract: A cover panel and a display device, the cover panel including a heat sink layer; an impact absorbing layer on the heat sink layer; and an elastic pattern on at least one side of the impact absorbing layer.

Abstract: A semiconductor chip includes: a base substrate; a conductive pad on one surface of the base substrate; an insulating layer on the one surface of the base substrate and having an opening exposing a portion of the conductive pad; and a bump on the exposed portion of the conductive pad and on the insulating layer around the opening. The bump includes a plurality of concave portions corresponding to the opening and is arranged in a longitudinal direction of the bump.

Abstract: A display device including: a display substrate including a display area configured to display an image and a pad area positioned on the periphery of the display area; a first pad part positioned above the pad area and including first pad terminals arranged in a first direction; and a printed circuit board including a base film and a second pad part positioned at one side of the base film and coupled with the first pad part, the second pad part includes first contact terminals coupled with first pad terminals, each of first contact terminals includes first contact pad terminals arranged along a first row forming a first inclination angle with the first direction, and second contact pad terminals spaced from first contact pad terminals and arranged along a second row forming a second inclination angle with the first direction.

Abstract: A display device includes a display panel with a first area having pixels on a first surface of a substrate, a second area having pads on the first surface of the substrate, and a third area part of the second area and having the second surface of the substrate bent toward the first surface, and a flexible PCB with a first bent portion in the second area and contacting and electrically connected to the pads, the first bent portion being bent from inside of the display panel toward an external side of the display panel to wrap around an edge of the display panel, and a second bent portion extending from the first bent portion and wrapping an external side of the second area and bent toward the inside of the display panel from the external side of the display panel to contact the second surface of the substrate.

Abstract: A semiconductor chip, a display device or an electronic device includes a substrate, one or more conductive pads disposed on the substrate, and one or more bumps electrically connected to the one or more conductive pads, in which the one or more bumps includes a metal core, a polymer layer disposed over a surface of the metal core, and a conductive coating layer disposed over a surface of the polymer layer and electrically connected to the one or more conductive pads.

Abstract: A display device includes a display substrate and a printed circuit board (PCB). The display substrate includes a display area to display an image, and includes a pad area outside the display area. The PCB is bonded to a surface of the display substrate in the pad area. The PCB includes a base film, first terminal wires positioned at the base film, second terminal wires positioned at the base film, first sub-pad terminals electrically connected to the first terminal wires through contact holes formed in the base film, and second sub-pad terminals directly and electrically connected to the second terminal wires without contact holes. The first sub-pad terminals and the second sub-pad terminals are alternately arranged. The first terminal wires and the second terminal wires are, in a view normal to the surface, spaced apart from one another.

Abstract: An exemplary embodiment provides a driving circuit chip including: a substrate; a terminal electrode disposed on the substrate; and an electrode pad disposed on the terminal electrode, wherein the electrode pad includes: a bump structure protruded from the substrate to include a short side and a long side; and a bump electrode disposed on the bump structure and connected with the terminal electrode around a short edge portion of the bump structure, wherein the bump electrode is disposed to not cover at least a part of a long edge portion of the bump structure.

Abstract: A display device includes a substrate including a display area and a peripheral area outside the display area, the peripheral area including a bendable bending region, a display member on the display area of the substrate to display an image, and a protection film under the substrate, the protection film including a groove at a position corresponding to the bending region of the peripheral area, wherein the groove includes a bottom surface and inner walls extending from the bottom surface to a surface of the protection film, a boundary part being defined at an intersection of each inner wall with the surface of the protection film, and wherein boundary parts adjacent to opposite ends of the protection film are separated from the opposite ends of the protection film, respectively.

Abstract: A display device according to an exemplary embodiment includes: a substrate including a display region configured to display an image, and a pad region positioned around the display region; and a first pad unit positioned on the pad region, wherein the first pad unit includes a first terminal region including a plurality of first pad terminals arranged in a first pattern, and a second terminal region including a plurality of second pad terminals arranged in a second pattern different from the first pattern.

Abstract: A display device includes a pad portion disposed on a first substrate, a connection member disposed on the pad portion, and an anisotropic conductive layer disposed between the pad portion and the connection member, the anisotropic conductive layer including conductive particles. The pad portion includes a pad, the pad including a first pad electrode and a second pad electrode. A first insulating layer is disposed between the first pad electrode and the second pad electrode. The first insulating layer overlaps the first pad electrode. The second pad electrode is connected to the first pad electrode through a first contact hole. The first contact hole overlaps a center of the first pad electrode. The first pad electrode is at least twice as wide as the first contact hole.

Abstract: A display device includes a display substrate including a display area where an image is displayed and a pad area disposed at a periphery of the display area, and a first pad portion disposed in the pad area, the first pad portion including a plurality of first line pad terminals arranged along a first curved line in a first direction.

Abstract: A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines.

Abstract: A CO2 power generation system includes a furnace to burn fuel, a turbine operated by a working fluid supplied thereto, the working fluid being heated by heat generated in the furnace, a recuperator exchanging heat with the working fluid passing through the turbine, a cooler to cool the working fluid passing through the recuperator, and a compressor to compress the working fluid passing through the cooler, wherein the working fluid passing through the compressor is circulated to the furnace, and the working fluid is supercritical CO2.

Abstract: An integrated circuit includes a substrate, a pad electrode disposed on the substrate, and a passivation layer disposed on the pad electrode and including an organic insulating material. The integrated circuit further includes a bump electrode disposed on the passivation layer and connected to the pad electrode through a contact hole. The passivation layer includes an insulating portion having a first thickness and covering an adjacent edge region of the pad electrode and the substrate, and a bump portion having a second thickness, that is greater than the first thickness, and covering a center portion of the pad electrode.

Abstract: A chip-on-film (COF) package includes a film, a driver integrated circuit (IC) chip disposed on the film, an electrode pad disposed on an edge of the film, and a first deformation-preventing member disposed on the film, between the driver IC chip and the electrode pad.

Abstract: A display device including pads; an anisotropic conductive film on the pads; and a connection member bonded to the pads through the film, the connection member including bumps, the film includes a supporting layer including a plurality of conductive particles having a part protruded from a first and second surface of the support layer; a first adhesive layer contacting the first surface and the part of each conductive particle protruding from the first surface; and a second adhesive layer contacting the second surface and the part of each conductive particle protruding from the second surface, and wherein the first or second adhesive layer is positioned at both of a first and second region of the display device, the first region being a region in which the pads and the bumps are overlapped and the second region being a region in which the pads and the bumps are not overlapped.

Abstract: Provided is a waste heat recovery power generation system, including: a compressor configured to compress a working fluid; a heat exchanger configured to recover waste heat from waste heat gas supplied from a waste heat source, the recovered waste heat heating the working fluid; a turbine configured to be driven by the working fluid heated by the recovered waste heat; and a recuperator configured to exchange heat between an output fluid of the turbine and an output fluid of the compressor to cool the output fluid of the turbine in which the output fluid of the compressor is branched into a first output fluid and a second output fluid of the compressor.

Abstract: A hybrid power generation system using a supercritical CO2 cycle includes a steam power generation unit including a plurality of turbines driven with steam heated using heat generated by a boiler to produce electric power, and a supercritical CO2 power generation unit including an S—CO2 heater for heating a supercritical CO2 fluid, a turbine driven by the supercritical CO2 fluid, a precooler for lowering a temperature of the supercritical CO2 fluid passing through the turbine, and a main compressor for pressurizing the supercritical CO2 fluid, so as to produce electric power. The steam power generation unit and the supercritical CO2 power generation unit share the boiler. The hybrid power generation system may improve both the power generation efficiencies of the steam cycle and the supercritical CO2 cycle by interconnecting the steam cycle and the supercritical CO2 cycle.

Abstract: The present disclosure relates to a curved window, a method for manufacturing the same, and a display device including the same. The curved window for a display device includes a curved polymer resin layer, a high-hardness film over the curved polymer resin layer, and a curved metal film under the curved polymer resin layer.