Patents by Inventor Jeong Pil PARK

Jeong Pil PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Neuron circuit and operating method thereof
    Patent number: 11977973
    Abstract: A neuron circuit and an operating method thereof are disclosed. The neuron circuit may include an input unit to which an input pulse is applied, a bipolar memristor configured to have one end connected to one end of the input unit, a first capacitor configured to be connected between the one end of the bipolar memristor and a ground, a first diode configured to have an anode connected to the one end of the bipolar component, a second capacitor configured to have one end connected to a cathode of the first diode, a first switch configured to be connected between the one end of the second capacitor and the ground, and a second switch configured to be connected between the anode of the first diode and the other end of the second capacitor.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: May 7, 2024
    Assignees: Electronics and Telecommunications Research Institute, Konkuk University Industrial Cooperation Corp
    Inventors: Jong Pil Im, Bae Ho Park, Jeong Hun Kim, Seungeon Moon, Chansoo Yoon, Jaewoo Lee, Solyee Im
  • Transfer printing substrate
    Patent number: 9827799
    Abstract: Disclosed herein is a transfer printing technology. A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. In situ alignment of a transfer layer is performed by the pillar structures and a structural confinement by a concave structure formed on a bottom surface of the transfer layer corresponding to the pillar structures, or a chemical bond of the pillar structure and the transfer layer. In the in situ alignment by the structural confinement, the remaining sacrificial layer after being removed may serve as an adhesive component. The transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemic bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: November 28, 2017
    Assignee: Gwangju Institute of Science and Technology
    Inventors: Heung Cho Ko, Su Ok Yun, Jeong Pil Park, Suk Ho Kim, Young Kyu Hwang, Yujun Hyun, Hun Soo Jang, Yun Kyung Jeong
  • TRANSFER PRINTING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND METHOD OF TRANSFER PRINTING
    Publication number: 20140345794
    Abstract: Disclosed herein is a transfer printing technology. A transfer printing substrate includes a plurality of pillar structures and a sacrificial layer applied thereon. In situ alignment of a transfer layer is performed by the pillar structures and a structural confinement by a concave structure formed on a bottom surface of the transfer layer corresponding to the pillar structures, or a chemical bond of the pillar structure and the transfer layer. In the in situ alignment by the structural confinement, the remaining sacrificial layer after being removed may serve as an adhesive component. The transfer process is performed by a separation of the bond by the sacrificial layer, a cutting of the pillar structures in the chemic bonding state of the pillar structures and the transfer layer, or a separation of the bond between the pillar structures and the handling substrate.
    Type: Application
    Filed: December 30, 2013
    Publication date: November 27, 2014
    Applicant: GWANGJU INSTITUTE OF SICENCE AND TECHNOLOGY
    Inventors: Heung Cho KO, Su Ok YUN, Jeong Pil PARK, Suk Ho KIM, Young Kyu HWANG, Yujun HYUN, Hun Soo JANG, Yun Kyung JEONG