Patents by Inventor Jeongha Sohn

Jeongha Sohn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5306668
    Abstract: A method of fabricating a metal electrode of a semiconductor device that includes a substrate with unanodized and anodized metal layers thereon includes the steps of forming and patterning a first metal layer, which is not anodizable, to a first predetermined thickness on the substrate; forming and patterning a second metal layer, which is anodized on the substrate forming a mask corresponding to said first metal layer on said second metal layer, and forming a flat surface by anodic oxidation in order that regions other than the first and second metal layers become an insulator having the same vertical elevation as the surface of the substrate. Various preferred embodiments and relationships between thickness of each layer for flattening by anodic oxidation are also given.
    Type: Grant
    Filed: May 21, 1993
    Date of Patent: April 26, 1994
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bae Byungseong, Jeongha Sohn, Insik Jang, Sangsoo Kim, Namdeog Kim, Hyungtaek Kim
  • Patent number: 5247194
    Abstract: A thin film transistor arranged in a matrix array with a strip type gate address line and a source signal line, comprising: an insulating layer formed on the gate address line; a semiconductor layer formed on the insulating layer, which serves as a channel conductive layer; the source signal line formed passing by one side of the channel layer; a first drain electrode arranged in parallel with, and spaced from, said source signal line; and at least one pixel electrode connected to any one side of the drain electrode.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: September 21, 1993
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byungseong Bae, Jeongha Sohn
  • Patent number: 5240868
    Abstract: A method of fabricating a metal electrode of a semiconductor device that includes a substrate with unanodized and anodized metal layers thereon includes the steps of forming a first metal layer, which is anodizable, to a first predetermined thickness on a substrate; forming and patterning a second metal layer, which is not anodizable, to a second predetermined thickness so as to act as a mask on the first metal layer; depositing a third metal layer, that may be anodizable, to a third predetermined thickness; and forming a flat surface on the third layer by anodic oxidation. Various preferred embodiments and relationships between thickness of each layer for flattening by anodic oxidation are also given.
    Type: Grant
    Filed: December 20, 1991
    Date of Patent: August 31, 1993
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byungseong Bae, Jeongha Sohn, Insik Jang, Sangsoo Kim, Namdeog Kim, Hyungtaek Kim