Abstract: In one embodiment, an integrated circuit package substrate includes a core layer comprising a dielectric material and a plurality of metal vias within the core layer. The dielectric material includes Silicon, Oxygen, and at least one of Boron or Phosphorus. The metal vias electrically couple a first side of the core layer and a second side of the core layer opposite the first side. The package substrate further includes a plurality of build-up layers on the core layer, the build-up layers comprising metal vias electrically connected to the metal vias of the core layer.

Abstract: In one embodiment, an integrated circuit package substrate includes a core layer comprising a plurality of metal vias electrically coupling a first side of the core layer and a second side of the core layer opposite the first side. The package substrate further includes a build-up layer on the first side of the core layer, the build-up layer comprising metal vias within a dielectric material and electrically connected to the metal vias of the core layer. The dielectric material includes Silicon, Oxygen, and at least one of Boron or Phosphorus.

Abstract: Pharmaceutical compositions of anti-TSLP-R antibodies, and uses thereof, are provided herein. The pharmaceutical compositions can comprise for example, an anti-TSLP-R antibody, or antigen-binding fragment thereof, a pharmaceutically acceptable buffer, an excipient, and a surfactant, or other compositions as provided for herein.

Abstract: Provided are a genetically modified cell line producing a recombinant glycoprotein having a mannose-terminated N-glycan and a method for producing the recombinant glycoprotein or a method for generating the cell, clone or cell line. The cell line comprises an insertion of less than 600 bp in the coding region of a chromosomal sequence encoding MGAT1.

Abstract: A transistor device may include a semiconductor structure including a channel layer and a barrier layer on the channel layer, wherein the barrier layer has a higher bandgap than the channel layer; a source contact and a drain contact on the barrier layer; a gate contact on the semiconductor structure between the source contact and the drain contact, the gate contact including a drain-side wing portion extending from a central portion of the gate contact; and a field plate on the semiconductor structure between the gate contact and the drain contact and laterally offset from the gate contact by a distance. The field plate may include a first wing portion extending from a central portion of the field plate.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the second thickness is different from the first thickness. In some embodiments, the first conductive trace and the second conductive trace have rectangular cross-sections.

Abstract: Embodiments disclosed herein include package substrates. In an embodiment, the package substrate comprises a core, where the core comprises glass. In an embodiment, a first layer is under the core, a second layer is over the core, and a via is through the core, the first layer, and the second layer. In an embodiment a width of the via through the core is equal to a width of the via through the first layer and the second layer. In an embodiment, the package substrate further comprises a first pad under the via, and a second pad over the via.

Abstract: Provided are a genetically modified cell line producing a recombinant glycoprotein having a mannose-terminated N-glycan and a method for producing the recombinant glycoprotein or a method for generating the cell, clone or cell line. The cell line comprises an insertion of less than 600 bp in the coding region of a chromosomal sequence encoding MGAT1.

Abstract: A pharmaceutical product includes a container having an exterior surface and an interior chamber, an active ingredient disposed in the interior chamber, the active ingredient having a photosensitive property that changes based on at least cumulative exposure to light having a wavelength within the range between X and Y, and a layer of photosensitive material disposed on or in the container and exposed to environmental conditions contemporaneous with the active ingredient being disposed in the interior chamber. The photosensitive material is reactive to light having a wavelength within the range between X and Y to experience a property change at a threshold of cumulative exposure to light received within the range between X and Y related to the change in the photosensitive property of the active ingredient. A photosensitive device can also be disposed along a path followed by the pharmaceutical product within a facility.