Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material, that may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm. Optically powered surfaces of the imaging lens may include a sag across their respective clear apertures that are less than 10% of a largest clear aperture of the imaging lens. Respective maximum peak to peak thicknesses of the first and second optical elements may be similar in size, for example within 15 percent of each other. Ratios of maximum peak to peak thickness to clear aperture and, separately, to sag are also provided.

Abstract: An integrated optical assembly comprises an optics mount, an optical element comprising material that is optically transparent, the optical element molded in the optics mount, and an optical aperture wherein the optical aperture is secured in fixed position with respect to the optics mount and the transparent optical element.

Abstract: An integrated optical assembly comprises an optics mount, an optical element comprising material that is optically transparent, the optical element molded in the optics mount, and an optical aperture wherein the optical aperture is secured in fixed position with respect to the optics mount and the transparent optical element.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material. At least two surfaces of the first and second optical elements may be optically powered surfaces. A largest clear aperture of all optically powered surfaces may not exceed a diameter of an image circle of the imaging lens corresponding to a field of view of 55 degrees or greater by more than 30%. The first and second high-index materials may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm.

Abstract: A method of manufacturing lenses includes creating a wafer-level master, overmolding the wafer-level master to form a daughter replica, casting a polymer lens shapes onto a wafer using the daughter replica, transferring the polymer lens shapes into the wafer, and singulating the wafer to create individual dies with a lens thereon. The wafer may be silicon, e.g., silicon having a resistivity between 0.1 and 100 ?cm.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material, that may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm. Optically powered surfaces of the imaging lens may include a sag across their respective clear apertures that are less than 10% of a largest clear aperture of the imaging lens. Respective maximum peak to peak thicknesses of the first and second optical elements may be similar in size, for example within 15 percent of each other. Ratios of maximum peak to peak thickness to clear aperture and, separately, to sag are also provided.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material, that may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm. Optically powered surfaces of the imaging lens may include a sag across their respective clear apertures that are less than 10% of a largest clear aperture of the imaging lens. Respective maximum peak to peak thicknesses of the first and second optical elements may be similar in size, for example within 15 percent of each other. Ratios of maximum peak to peak thickness to clear aperture and, separately, to sag are also provided.

Abstract: An integrated optical assembly comprises an optics mount, an optical element comprising material that is optically transparent, the optical element molded in the optics mount, and an optical aperture wherein the optical aperture is secured in fixed position with respect to the optics mount and the transparent optical element.

Abstract: A method of manufacturing lenses includes creating a wafer-level master, overmolding the wafer-level master to form a daughter replica, casting a polymer lens shapes onto a wafer using the daughter replica, transferring the polymer lens shapes into the wafer, and singulating the wafer to create individual dies with a lens thereon. The wafer may be silicon, e.g., silicon having a resistivity between 0.1 and 100 ?cm.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material. At least two surfaces of the first and second optical elements may be optically powered surfaces. A largest clear aperture of all optically powered surfaces may not exceed a diameter of an image circle of the imaging lens corresponding to a field of view of 55 degrees or greater by more than 30%. The first and second high-index materials may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm.

Abstract: An optical barrel assembly includes a barrel having an inner bottom surface and an inner lateral surface extending from the inner bottom surface, the inner bottom and lateral surfaces defining a cylindrical housing, and a first element surrounded by the inner lateral surface of the barrel, wherein an outer perimeter of the first element has a different shape than a perimeter defined by the cylindrical housing.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material. At least two surfaces of the first and second optical elements may be optically powered surfaces. A largest clear aperture of all optically powered surfaces may not exceed a diameter of an image circle of the imaging lens corresponding to a field of view of 55 degrees or greater by more than 30%. The first and second high-index materials may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material. At least two surfaces of the first and second optical elements may be optically powered surfaces. A largest clear aperture of all optically powered surfaces may not exceed a diameter of an image circle of the imaging lens corresponding to a field of view of 55 degrees or greater by more than 30%. The first and second high-index materials may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material, that may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm. Optically powered surfaces of the imaging lens may include a sag across their respective clear apertures that are less than 10% of a largest clear aperture of the imaging lens. Respective maximum peak to peak thicknesses of the first and second optical elements may be similar in size, for example within 15 percent of each other. Ratios of maximum peak to peak thickness to clear aperture and, separately, to sag are also provided.

Abstract: An optical barrel assembly includes a barrel having an inner bottom surface and an inner lateral surface extending from the inner bottom surface, the inner bottom and lateral surfaces defining a cylindrical housing, and a first element surrounded by the inner lateral surface of the barrel, wherein an outer perimeter of the first element has a different shape than a perimeter defined by the cylindrical housing.

Abstract: An imaging lens for use with an operational waveband over any subset of 7.5-13.5 ?m may include a first optical element of a first high-index material and a second optical element of a second high-index material. At least two surfaces of the first and second optical elements may be optically powered surfaces. A largest clear aperture of all optically powered surfaces may not exceed a diameter of an image circle of the imaging lens corresponding to a field of view of 55 degrees or greater by more than 30%. The first and second high-index materials may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm.

Abstract: A wafer level lens includes a first lens structure of a first polymeric material coupled to a second lens structure of a second polymeric material, wherein an interface is formed by opposing surfaces of the first lens structure and the second lens structure, the opposing surfaces having no air gap therebetween, at least one aperture disposed between the first lens structure and the second lens structure, wherein the aperture contacts the first lens structure and the second lens structure and wherein a supporting substrate is not positioned between the first lens structure and the second lens structure, and a spacer coupled to and separate from the wafer level lens.

Abstract: A method of manufacturing lenses includes creating a wafer-level master, overmolding the wafer-level master to form a daughter replica, casting a polymer lens shapes onto a wafer using the daughter replica, transferring the polymer lens shapes into the wafer, and singulating the wafer to create individual dies with a lens thereon. The wafer may be silicon, e.g., silicon having a resistivity between 0.1 and 100 ?cm.

Abstract: The present invention, in some embodiments, provides a low distortion singlet lens and optical imaging apparatus including the same.

Abstract: An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.