Abstract: A method is described. The method includes creating a partial through-substrate via (TSV) plug in a front side of a wafer, the partial TSV having a front side and a back side. The back side of the partial TSV extending toward a front side of a substrate but not into a bulk of the substrate. A cavity is etched in a back side of the wafer that exposes the partial TSV plug. An insulator is applied to the etched back side of the wafer. A portion of the partial TSV plug is exposed by removing a portion of the insulator. A conductive material is deposited to connect the exposed, partial TSV plug to a surface on the back side of the wafer.

Abstract: One embodiment is a method including forming a partial through-substrate via (TSV) plug in a front side of a wafer, the partial TSV plug having a front side, a back side, and a body with a variable dimension in the body so that a largest dimension is at the back side of partial TSV plug. A cavity is etched in a back side of the wafer that exposes the back side of the partial TSV plug and a portion of a front side interconnect in a common etched cavity. A conductive material is deposited to connect the exposed portion of the front side interconnect to the back side of the wafer and to connect the exposed back side of the partial TSV plug to the back side of the wafer without connecting the partial TSV plug and the portion of the front side interconnect.

Abstract: A method is described including creating a partial through substrate via (TSV) plug in a front side of a wafer, the partial TSV plug having a front side and a back side, the back side of the partial TSV extending through the front side of the substrate. A cavity is etched in a back side of the wafer that exposes the back side of the partial TSV plug. An insulator is applied to the etched back side of the wafer. A back side of the partial TSV plug is exposed by removing one or more of a portion of the insulator and a liner. A conductive material is deposited to connect the exposed, back side of the partial TSV plug to a surface on the back side of the wafer.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Abstract: A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.