Patents by Inventor Jeremy P. Hilton

Jeremy P. Hilton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11930721
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: March 12, 2024
    Assignee: 1372934 B.C. LTD.
    Inventors: Eric Ladizinsky, Jeremy P. Hilton, Byong Hyop Oh, Paul I. Bunyk
  • Patent number: 11593695
    Abstract: A hybrid computing system for solving a computational problem includes a digital processor, a quantum processor having qubits and coupling devices that together define a working graph of the quantum processor, and at least one nontransitory processor-readable medium communicatively coupleable to the digital processor which stores at least one of processor-executable instructions or data. The digital processor receives a computational problem, and programs the quantum processor with a first set of bias fields and a first set of coupling strengths. The quantum processor generates samples as potential solutions to an approximation of the problem. The digital processor updates the approximation by determining a second set of bias fields based at least in part on the first set of bias fields and a first set of mean fields that are based at least in part on the first set of samples and coupling strengths of one or more virtual coupling devices.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: February 28, 2023
    Assignee: D-WAVE SYSTEMS INC.
    Inventors: William W. Bernoudy, Mohammad H. Amin, James A. King, Jeremy P. Hilton, Richard G. Harris, Andrew J. Berkley, Kelly T. R. Boothby
  • Patent number: 10991755
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: April 27, 2021
    Assignee: D-WAVE SYSTEMS INC.
    Inventors: Eric Ladizinsky, Geordie Rose, Jeremy P. Hilton, Eugene Dantsker, Byong Hyop Oh
  • Publication number: 20200311591
    Abstract: A hybrid computing system for solving a computational problem includes a digital processor, a quantum processor having qubits and coupling devices that together define a working graph of the quantum processor, and at least one nontransitory processor-readable medium communicatively coupleable to the digital processor which stores at least one of processor-executable instructions or data. The digital processor receives a computational problem, and programs the quantum processor with a first set of bias fields and a first set of coupling strengths. The quantum processor generates samples as potential solutions to an approximation of the problem. The digital processor updates the approximation by determining a second set of bias fields based at least in part on the first set of bias fields and a first set of mean fields that are based at least in part on the first set of samples and coupling strengths of one or more virtual coupling devices.
    Type: Application
    Filed: March 26, 2020
    Publication date: October 1, 2020
    Inventors: William W. Bernoudy, Mohammad H. Amin, James A. King, Jeremy P. Hilton, Richard G. Harris, Andrew J. Berkley, Kelly T. R. Boothby
  • Publication number: 20200274050
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.
    Type: Application
    Filed: May 8, 2020
    Publication date: August 27, 2020
    Inventors: Eric Ladizinsky, Jeremy P. Hilton, Byong Hyop Oh, Paul I. Bunyk
  • Patent number: 10755190
    Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: August 25, 2020
    Assignee: D-WAVE SYSTEMS INC.
    Inventors: Alexandr M. Tcaciuc, Pedro A. de Buen, Peter D. Spear, Sergey V. Uchaykin, Colin C. Enderud, Richard D. Neufeld, Jeremy P. Hilton, J. Craig Petroff, Amar B. Kamdar, Gregory D. Peregrym, Edmond Ho Yin Kan, Loren J. Swenson, George E. G. Sterling, Gregory Citver
  • Patent number: 10700256
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 30, 2020
    Assignee: D-WAVE SYSTEMS INC.
    Inventors: Eric Ladizinsky, Jeremy P. Hilton, Byong Hyop Oh, Paul I. Bunyk
  • Publication number: 20200006421
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
    Type: Application
    Filed: September 12, 2019
    Publication date: January 2, 2020
    Inventors: Eric Ladizinsky, Geordie Rose, Jeremy P. Hilton, Eugene Dantsker, Byong Hyop Oh
  • Patent number: 10453894
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: October 22, 2019
    Assignee: D-WAVE SYSTEMS INC.
    Inventors: Eric Ladizinsky, Geordie Rose, Jeremy P. Hilton, Eugene Dantsker, Byong Hyop Oh
  • Patent number: 10268622
    Abstract: Topologies for analog computing systems are provided. Qubits in the topology are grouped into cells, and cells are coupled to adjacent cells by inter-cell couplers. At least some cells are coupled to non-adjacent cells via long-range couplers. Long-range couplers may be arranged into coverings so that certain sets of qubits within a covering region may be coupled with a reduced number of couplers. Each cell within a covering region without a long-range coupler may be proximate to a cell with a long range coupler so that each cell within the covering region is no more than a certain coupling distance away from a long-range coupler. Long-range couplers may couple over a greater physical distance than inter-cell couplers. Long-range couplers may couple to qubits over a larger coupling region, and may extend across multiple crossing regions between qubits.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: April 23, 2019
    Assignee: D-WAVE SYSTEMS INC.
    Inventors: Jeremy P. Hilton, Aidan Patrick Roy, Paul I. Bunyk, Andrew Douglas King, Kelly T. R. Boothby, Richard G. Harris, Chunqing Deng
  • Publication number: 20180308896
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
    Type: Application
    Filed: April 18, 2018
    Publication date: October 25, 2018
    Inventors: Eric Ladizinsky, Geordie Rose, Jeremy P. Hilton, Eugene Dantsker, Byong Hyop Oh
  • Patent number: 9978809
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: May 22, 2018
    Assignee: D-Wave Systems Inc.
    Inventors: Eric Ladizinsky, Geordie Rose, Jeremy P. Hilton, Eugene Dantsker, Byong Hyop Oh
  • Publication number: 20180033944
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 1, 2018
    Inventors: Eric Ladizinsky, Jeremy P. Hilton, Byong Hyop Oh, Paul I. Bunyk
  • Patent number: 9768371
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits. A niobium/aluminum oxide/niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and/or additive patterning. A superconducting metal layer may be deposited by electroplating and/or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: September 19, 2017
    Assignee: D-Wave Systems Inc.
    Inventors: Eric Ladizinsky, Jeremy P. Hilton, Byong Hyop Oh, Paul I. Bunyk
  • Publication number: 20170220510
    Abstract: Topologies for analog computing systems are provided. Qubits in the topology are grouped into cells, and cells are coupled to adjacent cells by inter-cell couplers. At least some cells are coupled to non-adjacent cells via long-range couplers. Long-range couplers may be arranged into coverings so that certain sets of qubits within a covering region may be coupled with a reduced number of couplers. Each cell within a covering region without a long-range coupler may be proximate to a cell with a long range coupler so that each cell within the covering region is no more than a certain coupling distance away from a long-range coupler. Long-range couplers may couple over a greater physical distance than inter-cell couplers. Long-range couplers may couple to qubits over a larger coupling region, and may extend across multiple crossing regions between qubits.
    Type: Application
    Filed: January 27, 2017
    Publication date: August 3, 2017
    Inventors: Jeremy P. Hilton, Aidan Patrick Roy, Paul I. Bunyk, Andrew Douglas King, Tomas J. Boothby, Richard G. Harris, Chunqing Deng
  • Patent number: 9710758
    Abstract: In a quantum processor some couplers couple a given qubit to a nearest neighbor qubit (e.g., vertically and horizontally in an ordered 2D array), other couplers couple to next-nearest neighbor qubits (e.g., diagonally in the ordered 2D array). Couplers may include half-couplers, to selectively provide communicative coupling between a given qubit and other qubits, which may or may not be nearest or even next-nearest-neighbors. Tunable couplers selective mediate communicative coupling. A control system may impose a connectivity on a quantum processor, different than an “as designed” or “as manufactured” physical connectivity. Imposition may be via a digital processor processing a working or updated working graph, to map or embed a problem graph. A set of exclude qubits may be created from a comparison of hardware and working graphs. An annealing schedule may adjust a respective normalized inductance of one or more qubits, for instance to exclude certain qubits.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: July 18, 2017
    Assignee: D-Wave Systems Inc.
    Inventors: Paul I. Bunyk, Mohammad H. S. Amin, Richard G. Harris, Trevor Michael Lanting, Mark W. Johnson, Jeremy P. Hilton, Emile M. Hoskinson
  • Publication number: 20170178018
    Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.
    Type: Application
    Filed: December 16, 2016
    Publication date: June 22, 2017
    Inventors: Alexandr M. Tcaciuc, Pedro A. de Buen, Peter D. Spear, Sergey V. Uchaykin, Colin C. Enderud, Richard D. Neufeld, Jeremy P. Hilton, J. Craig Petroff, Amar B. Kamdar, Gregory D. Peregrym, Edmond Ho Yin Kan, Loren J. Swenson, George E.G. Sterling, Gregory Citver
  • Publication number: 20170098682
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
    Type: Application
    Filed: October 10, 2016
    Publication date: April 6, 2017
    Inventors: Eric Ladizinsky, Geordie Rose, Jeremy P. Hilton, Eugene Dantsker, Byong Hyop Oh
  • Publication number: 20160335558
    Abstract: In a quantum processor some couplers couple a given qubit to a nearest neighbor qubit (e.g., vertically and horizontally in an ordered 2D array), other couplers couple to next-nearest neighbor qubits (e.g., diagonally in the ordered 2D array). Couplers may include half-couplers, to selectively provide communicative coupling between a given qubit and other qubits, which may or may not be nearest or even next-nearest-neighbors. Tunable couplers selective mediate communicative coupling. A control system may impose a connectivity on a quantum processor, different than an “as designed” or “as manufactured” physical connectivity. Imposition may be via a digital processor processing a working or updated working graph, to map or embed a problem graph. A set of exclude qubits may be created from a comparison of hardware and working graphs. An annealing schedule may adjust a respective normalized inductance of one or more qubits, for instance to exclude certain qubits.
    Type: Application
    Filed: April 20, 2015
    Publication date: November 17, 2016
    Inventors: Paul I. Bunyk, Mohammad H.S. Amin, Richard G. Harris, Trevor Michael Lanting, Mark W. Johnson, Jeremy P. Hilton, Emile M. Hoskinson
  • Patent number: 9490296
    Abstract: Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
    Type: Grant
    Filed: January 5, 2015
    Date of Patent: November 8, 2016
    Assignee: D-WAVE SYSTEMS INC.
    Inventors: Eric Ladizinsky, Geordie Rose, Jeremy P. Hilton, Eugene Dantsker, Byong Hyop Oh