Abstract: A structure comprising a memory chip and a tester for testing the memory chip, and a method for operating the structure. The memory chip comprises a BIST (Built-in Self Test) circuit, a plurality of RAMs (Random Access Memories). A first RAM is selected for testing by scanning in a select value into a RAM select register in the BIST. While the BIST performs a first testing pass for the first RAM, the tester collects cycle numbers of the failing cycles. Then, the BIST performs a second testing pass for the first RAM. At each failing cycle identified during the first testing pass, the BIST pauses so that the content of the location of the first RAM associated with the failing cycle and the state of the BIST can be extracted out of the memory chip. The testing procedures for the other RAMs are similar to that of the first RAM.

Abstract: A method of manufacturing a device having embedded memory including a plurality of memory cells. During manufacturing test, a first test stress is applied to selected cells of the plurality of memory cells with a built-in self test. At least one weak memory cell is identified. The at least one weak memory cell is repaired. A second test stress is applied to the selected cells and the repaired cells with the built-in self test.

Abstract: Self-test architectures are provided to implement data column and row redundancy with a totally integrated self-test and repair capability in a Random Access Memory (RAM), either a Dynamic RAM (DRAM) or a Static Ram (SRAM), and are particularly applicable to compileable memories and to embedded RAM within microprocessor or logic chips. The invention uses two passes of self-test of a memory. The first pass of self-test determines the worst failing column, the column with the largest number of unique failing row addresses. After completion of the first pass of self-test, the spare column is allocated to replace the worst failing column. In the second pass of self-test, the BIST (Built In Self-Test) collects unique failing row addresses as it does today for memories with spare rows only. At the completion of the second pass of self-test, the spare rows are then allocated.

Abstract: A method and apparatus for accurately testing the addressing of memory devices having memory sets where the data input and data output have width disparities. The method and apparatus ensure that unique patterns are completely written to and read from the memory set in their entirety, thus ensuring that the memory set is valid.

Abstract: A method and apparatus for testing either or both the row and column decoders of a memory device. Upon selecting the decoder to be tested, the non-selected decoder is locked at a specific location while all possible transitions for the selected decoder are tested.

Abstract: A method and structure for content addressable memory structure having a memory array of words, each word having multiple memory bits and a plurality of matchlines. Each of the matchlines is connected to one of the words and a matchline compare circuit is connected to the matchlines and is adapted to test all of the words individually. The matchline compare circuit includes a plurality of comparators equal in number to a number of the words, such that each word is connected to a dedicated comparator to allow each word in the memory array to be individually tested.