Patents by Inventor Jeremy S. ALDERMAN

Jeremy S. ALDERMAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Moisture seal for photonic devices
    Patent number: 11810870
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: November 7, 2023
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Asli Sahin, Thomas F. Houghton, Jennifer A. Oakley, Jeremy S. Alderman, Karen A. Nummy, Zhuojie Wu
  • MOISTURE SEAL FOR PHOTONIC DEVICES
    Publication number: 20230126719
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.
    Type: Application
    Filed: December 23, 2022
    Publication date: April 27, 2023
    Inventors: Asli SAHIN, Thomas F. HOUGHTON, Jennifer A. OAKLEY, Jeremy S. ALDERMAN, Karen A. NUMMY, Zhuojie WU
  • Moisture seal for photonic devices
    Patent number: 11587888
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: February 21, 2023
    Assignee: GLOBALFOUNDRIES U.S. INC.
    Inventors: Asli Sahin, Thomas F. Houghton, Jennifer A. Oakley, Jeremy S. Alderman, Karen A. Nummy, Zhuojie Wu
  • MOISTURE SEAL FOR PHOTONIC DEVICES
    Publication number: 20210183791
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.
    Type: Application
    Filed: December 13, 2019
    Publication date: June 17, 2021
    Inventors: Asli SAHIN, Thomas F. HOUGHTON, Jennifer A. OAKLEY, Jeremy S. ALDERMAN, Karen A. NUMMY, Zhuojie WU