Abstract: A laser-processing apparatus is disclosed. In one embodiment, the laser-processing apparatus includes a debris removal system with an integrated beam dump system, the beam dump system operative to selectively position an absorber within the beam path of a beam of laser energy. The beam dump system may allow the beam of laser energy to propagate through the scan lens of the laser-processing apparatus, but prevent the beam of laser energy from processing a workpiece. The beam dump system may include an actuator assembly operative to retract the absorber from the beam path, thereby allowing the beam to propagate to the workpiece and for debris from laser processing to be drawn into a vacuum nozzle, thereby preventing damage to the scan lens. The beam dump system may further include a heat transfer system operative to control the rate of heat transferred away from the absorber.

Abstract: A frame for a laser processing module can be characterized as including a platform having an upper surface and a lower surface, an optics bridge spaced apart from, and extending over, the upper surface of the platform and a bridge support interposed between, and coupled to, the platform and the optics bridge. At least one selected from the group consisting of the platform and the optics bridge includes a sandwich panel. The sandwich panel can include a first plate, a second plate and a core interposed between the first plate and the second plate. The first plate and the second plate can be indirectly attached to one another by the core and the core can define at least one channel extending between the first plate and the second plate. The sandwich panel can also include a first port formed at an exterior of the sandwich panel and in fluid communication with the at least one channel, and a second port formed at the exterior of the sandwich panel and in fluid communication with the at least one channel.

Abstract: A laser system (112, 1300) modifies a large area on an article (100) by employing a beamlet generator (1404) to provide a plurality of beamlets (1408) to a beamlet selection device (2350) whose operation is synchronized with movement of a beam steering system (1370) to variably select a number and spatial arrangement of beamlets (1408) to propagate a variable pattern of spot areas (302) to the article (100).

Abstract: A specimen inspection stage implemented with a processing stage coupling mechanism provides a capability to conduct with maximum efficiency post-processing specimen inspections on-board a processing platform. Heavy inspection equipment is mounted on a specimen inspection stage that is separate from a processing stage. In a preferred embodiment, the processing stage moves in response to an applied motive force and performs laser-based processing operations on a specimen. While laser processing is ongoing, the specimen inspection stage remains parked in its home position. When it is time for post-processing inspection, a stage coupling and decoupling mechanism couples together the specimen inspection stage and the processing stage, which transports the specimen inspection stage to and from the specimen position.

Abstract: A specimen inspection stage implemented with a processing stage coupling mechanism provides a capability to conduct with maximum efficiency post-processing specimen inspections on-board a processing platform. Heavy inspection equipment is mounted on a specimen inspection stage that is separate from a processing stage. In a preferred embodiment, the processing stage moves in response to an applied motive force and performs laser-based processing operations on a specimen. While laser processing is ongoing, the specimen inspection stage remains parked in its home position. When it is time for post-processing inspection, a stage coupling and decoupling mechanism couples together the specimen inspection stage and the processing stage, which transports the specimen inspection stage to and from the specimen position.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system carried by the support member. The support member, for example, can be a ring or another structure that has an opening configured to receive the workpiece. In one embodiment, the support member is a conductive ring. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member. The contact members can comprise electrically conductive biasing elements that have contact sites and the contact members can also have a dielectric coating covering at least a portion of the biasing elements. The contact system can also have a shield carried by the support member and a seal on the lip of the shield.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system carried by the support member. The support member, for example, can be a ring or another structure that has an opening configured to receive the workpiece. In one embodiment, the support member is a conductive ring. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member. The contact members can comprise electrically conductive biasing elements that have contact sites and the contact members can also have a dielectric coating covering at least a portion of the biasing elements. The contact system can also have a shield carried by the support member and a seal on the lip of the shield.