Abstract: A proximity sensitive display element (1) is provided that comprises a light guide (10), at least one light emitting element (30) and at least one infrared radiation sensor (40). The light guide (10) comprises a substrate (11) with a first and a second mutually opposite main sides (12, 14), respectively having a first and a second reflective layer (22, 24), with a reflective inner surface (222, 242) facing inside the light guide. At least one window (16) is defined in the first main side to allow optical radiation to enter and to leave the light guide. The at least one light emitting element (30) is typically embedded in the substrate at its second main side to generate optical radiation in said light guide. The at least one IR-sensor (40) is arranged at the second main side of the substrate and faces the first main side through a semi-transparent patch (240) in the second reflective layer (24).

Abstract: An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for olidifying the thermosetting material (TSM1) and forming an electrical connection (E).

Abstract: A proximity sensitive display element (1) is provided that comprises a light guide (10), at least one light emitting element (30) and at least one infrared radiation sensor (40). The light guide (10) comprises a substrate (11) with a first and a second mutually opposite main sides (12, 14), respectively having a first and a second reflective layer (22, 24), with a reflective inner surface (222, 242) facing inside the light guide. At least one window (16) is defined in the first main side to allow optical radiation to enter and to leave the light guide. The at least one light emitting element (30) is typically embedded in the substrate at its second main side to generate optical radiation in said light guide. The at least one IR-sensor (40) is arranged at the second main side of the substrate and faces the first main side through a semi-transparent patch (240) in the second reflective layer (24).

Abstract: A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

Abstract: Illuminating sections of a light guide with LEDs leads to unwanted light bleeding to other parts of the light guide. Furthermore typically LEDs are placed at a large distance from the area that couples out light from this LED due to a spike in intensity close to the LED. In order to avoid this spike being visible in the lit area the distance is increased which results in unwanted areal increase of the overall system. The present provides a layout to overcome these challenges.

Abstract: Illuminating sections of a light guide with LEDs leads to unwanted light bleeding to other parts of the light guide. Furthermore typically LEDs are placed at a large distance from the area that couples out light from this LED due to a spike in intensity close to the LED. In order to avoid this spike being visible in the lit area the distance is increased which results in unwanted areal increase of the overall system. The present provides a layout to overcome these challenges.