Abstract: A method for storing X-ray data includes acquiring the X-ray data by using an X-ray detection module; and transmitting all or some of the acquired X-ray data to other X-ray detection module which is different from the X-ray detection module that has acquired the X-ray data.

Abstract: An X-ray detector and an X-ray imaging apparatus including the X-ray detector are provided. The X-ray detector includes a detector element including a cathode electrode and an anode electrode which are spaced apart from each other and a photoconductive layer located between the cathode electrode and the anode electrode and configured to absorb X-rays and generate electric charges, a first temperature controller configured to contact a first surface of the detector element and is configured to control a temperature of the cathode electrode, and a second temperature controller configured to contact a second surface of the detector element opposite to the first surface of the detector element and configured to control a temperature of the anode electrode.

Abstract: A method for storing X-ray data includes acquiring the X-ray data by using an X-ray detection module; and transmitting all or some of the acquired X-ray data to other X-ray detection module which is different from the X-ray detection module that has acquired the X-ray data.

Abstract: An X-ray detector and an X-ray imaging apparatus including the X-ray detector are provided. The X-ray detector includes a detector element including a cathode electrode and an anode electrode which are spaced apart from each other and a photoconductive layer located between the cathode electrode and the anode electrode and configured to absorb X-rays and generate electric charges, a first temperature controller configured to contact a first surface of the detector element and is configured to control a temperature of the cathode electrode, and a second temperature controller configured to contact a second surface of the detector element opposite to the first surface of the detector element and configured to control a temperature of the anode electrode.

Abstract: At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algorithms. As the wafer is lowered into contact against the polishing platen, a load cell senses how much of the weight of the jig shaft, wafer mount and wafer continues to be supported by the jig. The vertical displacement of the wafer is controlled using a linear actuator responsive to a signal from the load cell. Vertical actuation of the wafer serves to increase or decrease this amount of supported weight, in turn decreasing or increasing the amount of applied down-force exerted between the wafer and the platen. A compression spring is used to increase the resolution of the pressure control. Finally, system components exposed to the work environment are encapsulated by chemically resistive components to prevent corrosion of system components.

Abstract: At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algorithms. As the wafer is lowered into contact against the polishing platen, a load cell senses how much of the weight of the jig shaft, wafer mount and wafer continues to be supported by the jig. The vertical displacement of the wafer is controlled using a linear actuator responsive to a signal from the load cell. Vertical actuation of the wafer serves to increase or decrease this amount of supported weight, in turn decreasing or increasing the amount of applied downforce exerted between the wafer and the platen. A compression spring is used to increase the resolution of the pressure control. Finally, system components exposed to the work environment are encapsulated by chemically resistive components to prevent corrosion of system components.

Abstract: At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algorithms. As the wafer is lowered into contact against the polishing platen, a load cell senses how much of the weight of the jig shaft, wafer mount and wafer continues to be supported by the jig. The vertical displacement of the wafer is controlled using a linear actuator responsive to a signal from the load cell. Vertical actuation of the wafer serves to increase or decrease this amount of supported weight, in turn decreasing or increasing the amount of applied down-force exerted between the wafer and the platen. A compression spring is used to increase the resolution of the pressure control. Finally, system components exposed to the work environment are encapsulated by chemically resistive components to prevent corrosion of system components.

Abstract: At least one wafer is suspended on a respective jig shaft above a polishing platen. The degree of parallelism between the wafer and the polishing platen is controlled using a three-point suspension, which allows for planar pitch adjustments using vertical actuation algorithms. As the wafer is lowered into contact against the polishing platen, a load cell senses how much of the weight of the jig shaft, wafer mount and wafer continues to be supported by the jig. The vertical displacement of the wafer is controlled using a linear actuator responsive to a signal from the load cell. Vertical actuation of the wafer serves to increase or decrease this amount of supported weight, in turn decreasing or increasing the amount of applied downforce exerted between the wafer and the platen. A compression spring is used to increase the resolution of the pressure control. Finally, system components exposed to the work environment are encapsulated by chemically resistive components to prevent corrosion of system components.