Abstract: Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.

Abstract: An apparatus to clean an electronic device may include a head structure having a first surface adapted to face a body to be cleaned, and a plurality of supply openings and return openings on the first surface. At least a portion of the supply openings and return openings are positioned as alternating rows of supply openings and return openings. The supply openings are larger in area than the return openings in at least a majority of the alternating rows. The supply openings and the return openings are adapted to transmit at least one of a gas and a liquid therethrough. The head structure is adapted to permit the transmission of at least one of a gas and a liquid through the supply openings and at the same time the head structure is also adapted to permit the transmission of at least one of a gas and a liquid through the return openings. Other embodiments are described and claimed.

Abstract: Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.