Patents by Inventor Jerrel K. Antolik
Jerrel K. Antolik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230032820Abstract: Semiconductor processing tools are provided that include a support framework, semiconductor processing chambers arranged along an axis, an attachment point connected to the support framework, and a detachable hoist system. Each chamber includes a base portion fixedly mounted relative to the support framework and a removable top cover including one or more hoisting features. The detachable hoist system includes a vertical member including a top end including a complementary attachment point and a bottom end including a movement mechanism supported by a floor. The complementary attachment point is detachably connected to the attachment point. The detachable hoist system further includes a hoist arm connected to the vertical member. The hoist arm is configured to pivot about a vertical axis substantially perpendicular to the axis, and includes one or more links and a hoist feature engagement interface configured to engage with the hoisting features of any of the removable top covers.Type: ApplicationFiled: October 5, 2022Publication date: February 2, 2023Inventors: Paul Albert Avanzino, Jerrel K. Antolik, Daniel Arthur Brown, Jason Lee Treadwell
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Patent number: 11495486Abstract: Semiconductor processing tools are provided that include an upper support framework, a plurality of semiconductor processing chambers arranged along a first axis, a linear guide system fixedly supported by the upper support framework and extending along a second axis substantially parallel to the first axis, and a carriage. Each chamber has a base portion fixedly mounted relative to the upper support framework and a removable top cover with one or more hoisting features. The carriage includes a hoist arm configured to pivot about a vertical axis that is substantially perpendicular to the second axis, the carriage is configured to movably engage with the linear guide system and translate along the second axis relative to the linear guide system. The carriage and hoist arm are movable such that a hoist feature engagement interface of the hoist arm can be moved engage with hoisting features of any of the removable top covers.Type: GrantFiled: February 21, 2020Date of Patent: November 8, 2022Assignee: Lam Research CorporationInventors: Paul Albert Avanzino, Jerrel K. Antolik, Daniel Arthur Brown, Jason Lee Treadwell
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Publication number: 20220044958Abstract: Semiconductor processing tools are provided that include an upper support framework, a plurality of semiconductor processing chambers arranged along a first axis, a linear guide system fixedly supported by the upper support framework and extending along a second axis substantially parallel to the first axis, and a carriage. Each chamber has a base portion fixedly mounted relative to the upper support framework and a removable top cover with one or more hoisting features. The carriage includes a hoist arm configured to pivot about a vertical axis that is substantially perpendicular to the second axis, the carriage is configured to movably engage with the linear guide system and translate along the second axis relative to the linear guide system. The carriage and hoist arm are movable such that a hoist feature engagement interface of the hoist arm can be moved engage with hoisting features of any of the removable top covers.Type: ApplicationFiled: February 21, 2020Publication date: February 10, 2022Inventors: Paul Albert Avanzino, Jerrel K. Antolik, Daniel Arthur Brown, Jason Lee Treadwell
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Patent number: 10665435Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.Type: GrantFiled: August 12, 2019Date of Patent: May 26, 2020Assignee: Lam Research CorporationInventors: Daniel Arthur Brown, John Patrick Holland, Michael C. Kellogg, James E. Tappan, Jerrel K. Antolik, Ian Kenworthy, Theo Panagopoulos, Zhigang Chen
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Publication number: 20190371579Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.Type: ApplicationFiled: August 12, 2019Publication date: December 5, 2019Inventors: Daniel Arthur Brown, John Patrick Holland, Michael C. Kellogg, James E. Tappan, Jerrel K. Antolik, Ian Kenworthy, Theo Panagopoulos, Zhigang Chen
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Patent number: 10395902Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.Type: GrantFiled: July 18, 2018Date of Patent: August 27, 2019Assignee: Lam Research CorporationInventors: Daniel Arthur Brown, John Patrick Holland, Michael C. Kellogg, James E. Tappan, Jerrel K. Antolik, Ian Kenworthy, Theo Panagopoulos, Zhigang Chen
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Publication number: 20180323044Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.Type: ApplicationFiled: July 18, 2018Publication date: November 8, 2018Inventors: Daniel Arthur Brown, John Patrick Holland, Michael C. Kellogg, James E. Tappan, Jerrel K. Antolik, Ian Kenworthy, Theo Panagopoulos, Zhigang Chen
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Patent number: 10049862Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.Type: GrantFiled: March 11, 2016Date of Patent: August 14, 2018Assignee: Lam Research CorporationInventors: Daniel Arthur Brown, John Patrick Holland, Michael C. Kellogg, James E. Tappan, Jerrel K. Antolik, Ian Kenworthy, Theo Panagopoulos, Zhigang Chen
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Publication number: 20160307743Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.Type: ApplicationFiled: March 11, 2016Publication date: October 20, 2016Inventors: Daniel Arthur Brown, John Patrick Holland, Michael C. Kellogg, James E. Tappan, Jerrel K. Antolik, Ian Kenworthy, Theo Panagopoulos, Zhigang Chen
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Patent number: 8784948Abstract: Apparatuses are provided for controlling flow conductance of plasma formed in a plasma processing apparatus that includes an upper electrode opposite a lower electrode to form a gap therebetween. The lower electrode is adapted to support a substrate and coupled to a RF power supply. Process gas injected into the gap is excited into the plasma state during operation. The apparatus includes a ground ring that concentrically surrounds the lower electrode and has a set of slots formed therein, and a mechanism for controlling gas flow through the slots.Type: GrantFiled: September 22, 2011Date of Patent: July 22, 2014Assignee: Lam Research CorporationInventors: Rajinder Dhindsa, Jerrel K. Antolik, Scott Stevenot
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Publication number: 20120028379Abstract: Apparatuses are provided for controlling flow conductance of plasma formed in a plasma processing apparatus that includes an upper electrode opposite a lower electrode to form a gap therebetween. The lower electrode is adapted to support a substrate and coupled to a RF power supply. Process gas injected into the gap is excited into the plasma state during operation. The apparatus includes a ground ring that concentrically surrounds the lower electrode and has a set of slots formed therein, and a mechanism for controlling gas flow through the slots.Type: ApplicationFiled: September 22, 2011Publication date: February 2, 2012Applicant: Lam Research CorporationInventors: Rajinder Dhindsa, Jerrel K. Antolik, Scott Stevenot
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Patent number: 8043430Abstract: Apparatuses are provided for controlling flow conductance of plasma formed in a plasma processing apparatus that includes an upper electrode opposite a lower electrode to form a gap therebetween. The lower electrode is adapted to support a substrate and coupled to a RF power supply. Process gas injected into the gap is excited into the plasma state during operation. The apparatus includes a ground ring that concentrically surrounds the lower electrode and has a set of slots formed therein, and a mechanism for controlling gas flow through the slots.Type: GrantFiled: December 20, 2006Date of Patent: October 25, 2011Assignee: Lam Research CorporationInventors: Rajinder Dhindsa, Jerrel K. Antolik, Scott Stevenot
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Publication number: 20080149596Abstract: Apparatuses are provided for controlling flow conductance of plasma formed in a plasma processing apparatus that includes an upper electrode opposite a lower electrode to form a gap therebetween. The lower electrode is adapted to support a substrate and coupled to a RF power supply. Process gas injected into the gap is excited into the plasma state during operation. The apparatus includes a ground ring that concentrically surrounds the lower electrode and has a set of slots formed therein, and a mechanism for controlling gas flow through the slots.Type: ApplicationFiled: December 20, 2006Publication date: June 26, 2008Applicant: Lam Research CorporationInventors: Rajinder Dhindsa, Jerrel K. Antolik, Scott Stevenot
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Patent number: 7211170Abstract: Wafer area pressure rings used to confine plasma in plasma processing chambers which are manufactured with bores therein such that replacement of the pressure rings during routine or repair maintenance is significantly eased. The bores allows the pressure rings to be installed by simply aligning the bores under hanging adapters which are connected to the ceiling of the chamber, lifting the rings such that the hanging adapters enter the ring, turning or twisting the entire apparatus a miniscule amount, and then lowering the ring apparatus on the hanging apparatus, thereby locking the rings in place.Type: GrantFiled: July 27, 2001Date of Patent: May 1, 2007Assignee: Lam Research CorporationInventor: Jerrel K. Antolik
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Patent number: 6936135Abstract: A confinement ring coupling arrangement for coupling, in a plasma processing chamber, a confinement ring to a plunger. The plunger is configured to move the confinement ring to deploy and stow the confinement ring to facilitate processing of a substrate within the plasma processing chamber. The confinement ring coupling arrangement includes a hanger adapter having a locking head, the hanger adapter being configured to be coupled with the plunger. The confinement ring coupling arrangement further includes a hanging bore disposed in the confinement ring and configured to receive the locking head and to secure the locking head within the hanging bore during stowing and deployment of the confinement ring, wherein a diameter of the locking head is sufficiently smaller than a cross-section dimension of the hanging bore to prevent a sidewall of the locking head from scraping against a sidewall of the hanging bore during the stowing and deployment of the confinement ring.Type: GrantFiled: April 16, 2003Date of Patent: August 30, 2005Assignee: Lam Research CorporationInventor: Jerrel K. Antolik
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Patent number: 6926803Abstract: A confinement ring support assembly for coupling together a plurality of confinement rings in a plasma processing chamber. The confinement ring support assembly includes a post having first end and a second end. The post further includes a first lip having an associated first sliding surface, and a second lip having an associated second sliding surface. The first lip is disposed at a first position on the post, the second lip being disposed at a second position at a different arc relative to the first location on the post, the second position being disposed between the first position and the first end along a longitudinal axis of the post. The confinement ring support assembly further includes a first washer configured to move slidably from the first lip past the second lip toward the first end of the post.Type: GrantFiled: April 16, 2003Date of Patent: August 9, 2005Assignee: Lam Research CorporationInventor: Jerrel K. Antolik
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Publication number: 20030196755Abstract: A confinement ring support assembly for coupling together a plurality of confinement rings in a plasma processing chamber. The confinement ring support assembly includes a post having first end and a second end. The post further includes a first lip having an associated first sliding surface, and a second lip having an associated second sliding surface. The first lip is disposed at a first position on the post, the second lip being disposed at a second position at a different arc relative to the first location on the post, the second position being disposed between the first position and the first end along a longitudinal axis of the post. The confinement ring support assembly further includes a first washer configured to move slidably from the first lip past the second lip toward the first end of the post.Type: ApplicationFiled: April 16, 2003Publication date: October 23, 2003Applicant: Lam Research CorporationInventor: Jerrel K. Antolik
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Publication number: 20030196756Abstract: A confinement ring coupling arrangement for coupling, in a plasma processing chamber, a confinement ring to a plunger. The plunger is configured to move the confinement ring to deploy and stow the confinement ring to facilitate processing of a substrate within the plasma processing chamber. The confinement ring coupling arrangement includes a hanger adapter having a locking head, the hanger adapter being configured to be coupled with the plunger. The confinement ring coupling arrangement further includes a hanging bore disposed in the confinement ring and configured to receive the locking head and to secure the locking head within the hanging bore during stowing and deployment of the confinement ring, wherein a diameter of the locking head is sufficiently smaller than a cross-section dimension of the hanging bore to prevent a sidewall of the locking head from scraping against a sidewall of the hanging bore during the stowing and deployment of the confinement ring.Type: ApplicationFiled: April 16, 2003Publication date: October 23, 2003Applicant: Lam Research CorporationInventor: Jerrel K. Antolik
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Publication number: 20020139479Abstract: Wafer area pressure rings used to confine plasma in plasma processing chambers which are manufactured with bores therein such that replacement of the pressure rings during routine or repair maintenance is significantly eased. The bores allows the pressure rings to be installed by simply aligning the bores under hanging adapters which are connected to the ceiling of the chamber, lifting the rings such that a the hanging adapter enters the ring and then turning or twisting the entire apparatus a miniscule amount and then dropping the ring apparatus on the hanging apparatus, locking the rings in place.Type: ApplicationFiled: July 27, 2001Publication date: October 3, 2002Inventor: Jerrel K. Antolik