Abstract: The present invention discloses a bump nest which allows a semiconductor device to be temporarily connected with a package without having to be fused to the package. The disclosed temporary interconnect includes a contact group comprising at least three projecting contact elements. Each of the respective contact elements includes a projecting contact guide, which is concentrically located on an encircling contact. The projecting contact guides and the encircling contact are spaced in a manner so as to surround a ball or a bump of the semiconductor device. In the preferred embodiment, the temporary interconnect may also include a base pad on which each of the encircling contacts is accurately positioned to surround the ball or bump.