Patents by Inventor Jerry K. Antolik

Jerry K. Antolik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
    Patent number: 8216486
    Abstract: A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric therewith, such that gas filled spaces surround the tubes. By flowing a heat transfer liquid in the tubes and adjusting the gas pressure in the spaces, localized temperature of the component body can be precisely controlled. One or more heating elements can be arranged in each zone and a heat transfer liquid can be passed through the tubes to effect heating or cooling of each zone by activating the heating elements and/or varying pressure of the gas in the spaces.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: July 10, 2012
    Assignee: Lam Research Corporation
    Inventors: Rajinder Dhindsa, Henry Povolny, Jerry K. Antolik
  • TEMPERATURE CONTROL MODULE USING GAS PRESSURE TO CONTROL THERMAL CONDUCTANCE BETWEEN LIQUID COOLANT AND COMPONENT BODY
    Publication number: 20120070914
    Abstract: A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric therewith, such that gas filled spaces surround the tubes. By flowing a heat transfer liquid in the tubes and adjusting the gas pressure in the spaces, localized temperature of the component body can be precisely controlled. One or more heating elements can be arranged in each zone and a heat transfer liquid can be passed through the tubes to effect heating or cooling of each zone by activating the heating elements and/or varying pressure of the gas in the spaces.
    Type: Application
    Filed: November 28, 2011
    Publication date: March 22, 2012
    Applicant: Lam Research Corporation
    Inventors: Rajinder Dhindsa, Henry Povolny, Jerry K. Antolik
  • Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
    Patent number: 8083855
    Abstract: A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric therewith, such that gas filled spaces surround the tubes. By flowing a heat transfer liquid in the tubes and adjusting the gas pressure in the spaces, localized temperature of the component body can be precisely controlled. One or more heating elements can be arranged in each zone and a heat transfer liquid can be passed through the tubes to effect heating or cooling of each zone by activating the heating elements and/or varying pressure of the gas in the spaces.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: December 27, 2011
    Assignee: Lam Research Corporation
    Inventors: Rajinder Dhindsa, Henry Povolny, Jerry K. Antolik
  • Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body
    Publication number: 20090111276
    Abstract: A temperature control module for a semiconductor processing chamber comprises a thermally conductive component body, one or more channels in the component body and one or more tubes concentric therewith, such that gas filled spaces surround the tubes. By flowing a heat transfer liquid in the tubes and adjusting the gas pressure in the spaces, localized temperature of the component body can be precisely controlled. One or more heating elements can be arranged in each zone and a heat transfer liquid can be passed through the tubes to effect heating or cooling of each zone by activating the heating elements and/or varying pressure of the gas in the spaces.
    Type: Application
    Filed: October 31, 2008
    Publication date: April 30, 2009
    Applicant: Lam Research Corporation
    Inventors: Rajinder Dhindsa, Henry Povolny, Jerry K. Antolik