Abstract: A layer of an amphoteric dopant on the surface of a group III-V intermetallic semiconductor crystal will diffuse into the crystal surface in a heating cycle forming a stable contact. The contact can be ohmic or rectifying depending on the localized presence of an excess of one crystal ingredient. A layer of Si on GaAs upon heating forms a rectifying contact. When the layer of Si contains As, the contact is ohmic.

Abstract: Degradation of the cleaved light output surface of a semiconductor crystal injection laser is reduced through control of surface recombination by providing an annealed optically transparent coating at least one ingredient of which has a higher bandgap than said crystal over the cleaved light output surface. Crystals of GaAs, GaAlAs and GaInAsP are provided with annealed coatings of ZnS, CdS, CdTe and CdSe.

Abstract: Aluminum alkoxide or aluminum aryloxide is produced by dissolving aluminum in gallium and/or gallium-based alloy wherein the gallium and/or gallium-based alloy is in a liquid form. The aluminum is then reacted with an organic compound having at least one reactive hydroxyl group to thereby obtain the aluminum alkoxide or aluminum aryloxide.

Abstract: An electrical device which employs two-dimensional space charge modulation in a semiconductor structure. The device has an approximately Debye length wide contact and a rectifying contact positioned adjacent to each other within a Debye length on a semiconductor body and a contact remotely positioned. A bias on the rectifying contact will effect conduction between the other contacts.

Abstract: Crystalline compound semiconductors are passivated with a layer of the most volatile element thereof to prevent the formation of oxides that would interfere with further processing. A GaAs crystal is provided with a surface layer of arsenic. The arsenic layer is formed by exposure to light having a photon energy greater than 1.8 eV, at a power density of 0.01 to 0.5 watts per cm.sup.2 while the GaAs immersed in a 1:1 HCl:H.sub.2 O solution for a period of 10-30 minutes. The intermediate processing passivated GaAs crystal may be stored and handled in air and the As layer is removed by low temperature baking.

Abstract: A heterojunction semiconductor is provided where the carrier transport dimension is governed by a layer thickness and where the characteristics of the materials self-limit process steps. A field effect transistor is provided wherein the work function is matched across regions to reduce limits on the channel dimension. A vertical transistor is provided wherein a vertical web is formed with precise thickness governed by electrolytic etching using photogenerated carrier current.

Abstract: A quantity of silicon serving as a source of the element silicon for use in a molecular beam epitaxial growth apparatus where the silicon is in the form of a monocrystalline wafer with a plurality of electrically parallel filaments separated by slots that pass completely through the wafer, each filament having a length dimension that is greater than the width and height dimensions, joined at a broad contact area at each filament end and where an electric current is passed through the filaments through the broad contact areas.

Abstract: The formation of lines of the order of 8 Angstroms wide is achieved using a tunneling current through a gas that changes to provide a residue that is the basis of the line. The tunneling current energy is tuned to the energy required to dissociate the gas.

Abstract: An energy discriminator is provided wherein energy, entering through a receiving surface into a multilayer semiconductor monocrystalline body is converted into hole-electron pair carriers in different particular energy responsive layers and the electrons thereof are collected in potential wells that are asymmetric to electron flow associated with the particular layer.

Abstract: A ballistic conduction majority carrier type semiconductor device structure can be fabricated with a built-in difference in barrier height between the emitter and collector interfaces by employing surface fermi level pinning in a crystalline structure with three copolanar regions of different semiconductor materials. The center region between the interfaces with the external zones of the structure has a thickness of the order of the mean free path of an electron. The materials of the external regions are such that there is a mismatch between the crystal spacing of the external regions and the central region which causes the fermi level of the material in the central zone to be pinned in the region of the conduction band at the interfaces with the external regions and the material of the external regions is selected so that the surface fermi level is pinned in the forbidden region. A monocrystalline structure having an emitter region of GaAs, a central or base region of InAs or W 100 .ANG. to 500 .ANG.

Abstract: Optical-to-electrical conversion is accomplished using an undoped region bounded by a tunneling junction of the order of the mean free path of an electron. A number of regions are assembled in series with larger thickness away from the light incident surface. The thickness and doping of the regions for maximum effectiveness in monochromatic light are tailored to produce similar quantities of carriers from the light. A nine section GaAs structure with 50 .ANG. n.sup.+ and p.sup.+ tunneling bounding regions has a 90% quantum efficiency and delivers a 5 volt output with a 0.35 picosecond transit time.

Abstract: Optical-to-electrical logic operations may be performed employing as each logic variable a different light wavelength and providing an optical-to-electrical semiconductor converter such that each particular wavelength responsive optical energy receiving region is an updoped region bounded by a thin tunneling junction having a thickness of the order of the mean free path of a carrier in the tunneling region.

Abstract: A highly efficient monolithic direct bandgap lattice accommodated semiconductor structure in which an input signal is converted to photons on one side of an insulating region and the photons are reconverted on the opposite side of the insulating region to an output signal in a multi-oblique segment region. The structure converts AC to DC, AC to AC and DC to DC signals and is adapted to the efficient V-groove multijunction solar cell.

Abstract: Ion implanted impurity activation in a multi-element compound semiconductor crystal such as gallium arsenide, GaAs, over a broad integrated circuit device area, is accomplished using a short time anneal, in the proximity of a uniform concentration of the most volatile element of said crystal, in solid form, over the broad integrated circuit device area surface. A GaAs integrated circuit wafer having ion implanted impurities in the surface for an integrated circuit is annealed in the vicinity of 800.degree.-900.degree. C. for a time of the order of 1-20 seconds in the proximity of a uniform layer of solid arsenic.

Abstract: A heterojunction semiconductor is provided where the carrier transport dimension is governed by a layer thickness and where the characteristics of the materials self-limit process steps. A field effect transistor is provided wherein the work function is matched across regions to reduce limits on the channel dimension. A vertical transistor is provided wherein a vertical web is formed with precise thickness governed by electrolytic etching using photogenerated carrier current.

Abstract: Photon energy can be efficiently absorbed by a material having a reflectivity control surface region wherein the index of refraction, the thickness, and the contour of the external surface of the reflecting control surface region operate to curtail all reradiation components.

Abstract: A refractory compound structure comprising a substrate of a compound which is a combination of a refractory and/or metallic element and a nonmetallic element and an elemental layer of the refractory and/or metallic element on the substrate is formed by heating the refractory compound in a vacuum at a decomposition temperature for the refractory compound.

Abstract: When growing GaAs by molecular beam epitaxy (MBE), a typical related reaction acts to affix Ga.sub.2 O.sub.3 to the growth surface and hence incorporates such oxide contaminants in the epitaxial layer as it is grown. Such contaminants may yield crystals of poor electrical and optical properties. When Al is added to the Ga source crucible, the Ga.sub.2 O flux is reduced substantially thereby suppressing the formation of such oxide contaminants and remove a serious constraint to MBE growth. When doping GaAs with Mg to form a p-type GaAs layer, unity Mg doping efficiency is achieved by including 0.1% Al in the Ga effusion cell. Such an inclusion of Al improves the Mg doping efficiency by suppressing the formation of MgO, and allows MBE growth at lower substrate temperatures and at higher growth rates.

Abstract: Semiconductor devices can be fabricated using as an intermediate manufacturing structure a substrate of one semiconductor with a thin epitaxial surface layer of a different semiconductor with properties such that the semiconductors each have different solubilities with respect to a metal. When a vertical differentiation is used to expose the different materials and the metal is deposited on both and heated, the metal will form a Schottky barrier in one material and an ohmic contact in the other. Where the substrate is gallium arsenide and the epitaxial layer is gallium aluminum arsenide and the metal is tin, a self-aligned gallium arsenide MESFET is formed wherein the tin forms ohmic contacts with the gallium arsenide and a Schottky barrier contact with the gallium aluminum arsenide.

Abstract: A semiconductor device of the ballistic type, wherein the carrier transport in the body of the device from one electrode to the other takes place essentially free of collisions, is fabricated with a semiconductor body having a long mean-free path, a body width between ohmic electrodes that is less than or equal to the product of the velocity of a carrier and the time to a collision, but more than the distance that will permit quantum mechanical tunnelling, an impressed voltage less than required for an intervalley carrier transition and having the ohmic external contact on each surface of the body free of any barrier to carrier flow. A ballistic type triode device is provided with a current modulating electrode included within the body of the device.