Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.

Abstract: A mechanical assembly, for regulating the temperature of an electronic device, includes a gimbal and a heat-exchanger which is attached to the gimbal. The gimbal includes a base member, a carrier member, and a spring which has—1) a first end with a rigid coupling to one of the base and carrier members, and 2) a second end with a slideable coupling to the remaining member. The slideable coupling prevents any gap from occurring between the heat-exchanger and the electronic device when they are pressed together.

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Further, at least one window is provided in the container such that it passes energy by electromagnetic radiation from a radiation source to the IC-module, but blocks the liquid coolant.

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an opn end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.