Abstract: A method for forming a connection between a wire and a pin includes placing a fixturing element over the pin, capturing the wire between an upper surface and a lower surface of the fixturing element, compressing the fixturing element to hold the wire around the pin and forming a fixed connection between the wire and the pin. A system for forming an electrical connection includes a pin, a fixturing element disposed around the pin, and a wire placed around pin and sandwiched between an upper surface and a lower surface of the fixturing element.

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

Abstract: A method for forming a connection between a wire and a pin includes placing a fixturing element over the pin, capturing the wire between an upper surface and a lower surface of the fixturing element, compressing the fixturing element to hold the wire around the pin and forming a fixed connection between the wire and the pin. A system for forming an electrical connection includes a pin, a fixturing element disposed around the pin, and a wire placed around pin and sandwiched between an upper surface and a lower surface of the fixturing element.

Abstract: In some embodiments, an apparatus includes an electrical connector having a side wall defining a lumen and an elongate opening. The lumen is configured to receive at least a conductive portion of an electronic implant. The elongate opening divides the side wall into a first portion and a second portion. The first portion of the side wall is configured to move relative to the second portion of the side wall between a first position and a second position. The first portion of the side wall is electrically conductive and includes a protrusion. The protrusion is configured to contact the conductive portion of the electronic implant such that the conductive portion of the electronic implant is electrically coupled to the first portion of the side wall when the first portion of the side wall is in the second position.

Abstract: In some embodiments, an apparatus includes an electrical connector having a side wall defining a lumen and an elongate opening. The lumen is configured to receive at least a conductive portion of an electronic implant. The elongate opening divides the side wall into a first portion and a second portion. The first portion of the side wall is configured to move relative to the second portion of the side wall between a first position and a second position. The first portion of the side wall is electrically conductive and includes a protrusion. The protrusion is configured to contact the conductive portion of the electronic implant such that the conductive portion of the electronic implant is electrically coupled to the first portion of the side wall when the first portion of the side wall is in the second position.

Abstract: An apparatus and method for a medical implant having a reinforced medical implant body. In an embodiment of the invention, an apparatus includes a sheath, a conductive element, a distal electrode and a length limiting element. The conductive element has a proximal end and a distal end. The distal electrode can be coupled to the distal end of the conductive element. The sheath has a distal end, a proximal end and a length defined between the distal end and the proximal end. The sheath of the apparatus is configured to enclose at least a portion of the conductive element. The length limiting element has a distal end and a proximal end. The distal end of the length limiting element can be coupled to the distal end of the sheath and the proximal end of the length limiting element can be coupled to the proximal end of the sheath.

Abstract: An apparatus includes a coupling portion, a bioerodible anchor portion and a bioerodable retainer. The coupling portion is configured to be coupled to an electrical conductor. The bioerodible retention portion is adjacent to the coupling portion and is moveable from a collapsed configuration to an expanded configuration. The bioerodible retention portion is configured to anchor the electrical conductor with respect to body tissue when the bioerodible retention portion is in its expanded configuration. The bioerodible anchor portion is formulated to erode when disposed within the body tissue at a first rate. The bioerodible retainer is coupled to the bioerodible anchor portion and is configured to inhibit movement of the bioerodible anchor portion from the collapsed configuration to the expanded configuration. The bioerodible retainer is formulated to erode when disposed within the body tissue at a second rate greater than the first rate.

Abstract: A lead assembly and a method of making a lead are provided. The lead comprises a terminal, proximal end having a plurality of terminal contacts and material separating the terminal contacts. In one embodiment of the lead, the terminal contacts are separated by a preformed spacer, that may be made from various hard materials such as polyurethane, PEEK and polysulfone. Epoxy may be used to fill spaces at the proximal lead end, including between the spacer and terminal contacts. In one embodiment of the lead, the terminal contacts are separated by epoxy only. The lead may include a plurality of conductor lumens that contain conductors. The lead may also include a stylet lumen for accepting a stylet.

Abstract: An implantable lead includes a tubular polymer body having a plurality of wire conductors embedded or carried within the inner tube body. A ring contact, e.g., a platinum ring contact, is electrically and mechanically connected to at least one of the plurality of wires at at least one end of the tubular body. In one embodiment, ring contacts are attached at both ends of the tubular body. In another embodiment, a lumen passes longitudinally through the length of the lead body.