Abstract: External interaction with a mover in an independent cart system is allowed at known locations along the track. The mover is initially propelled along the track in a first operating state. When the mover arrives at a station, the controller generates a signal to alert the external actuator of the presence of a mover at the station. After waiting at the station for a first predefined time interval, the controller switches to a second operating state, in which the coils are de-energized or the controller is reconfigured to operate in a less responsive manner than in the first operating state. The controller remains in the second operating state for a second predefined interval, during which the external actuator interacts with the mover or a load on the mover. After the second predefined interval, the controller enters a third operating state, and the controller propels the mover away from the station.

Abstract: Embodiments of the present invention provide a method, system, devices and software which provide customized, clinically relevant designs, e.g. treatment plans/solutions for at least single tooth replacement therapy in real-time as needed to enable immediate confirmation of the validity and execution of patient-specific treatment solutions. A Machine Learning algorithm is used in a method or system for computer implementation of automatic restoration design. The restoration design includes the design of restorative elements such as crowns and abutments. Software is provided for carrying out the methods when executed on a digital processor. Manufacturing of the restorative elements is also included.

Abstract: Some embodiments of the present disclosure include a front and side viewable brake indicator system for a vehicle. The brake indicator system may include a pair of front mounted brake lights mounted on a vehicle, the first front mounted brake light mounted to a position proximate to a passenger side front corner of the vehicle, and the second front mounted brake light mounted to a position proximate to a driver side front corner of the vehicle. In some embodiments, the system also includes a top mounted brake light mounted on an exterior surface of a roof of the vehicle. Each of the brake lights may be configured to be viewed at a position in front of and to a side of the vehicle and may be configured to illuminate when a driver presses on a brake pedal in the vehicle.

Abstract: An apparatus for patterning objects for the manufacture of semiconductor integrated circuits includes an optical source, multiple fiber cores coupled to the optical source, each of the fiber cores has an input end and an output end, and each of the input ends is coupled to the optical source. The apparatus further includes an array coupled to each of the fiber cores, the array is configured to allow each of the fiber ends to output toward a common plane, an object having a photosensitive material coupled to the common plane, and a pattern that is exposed onto the photosensitive material. The pattern is composed of a number beams corresponding to a number of fiber cores.

Abstract: An apparatus for patterning objects for the manufacture of semiconductor integrated circuits includes an optical source, multiple fiber cores coupled to the optical source, each of the fiber cores has an input end and an output end, and each of the input ends is coupled to the optical source. The apparatus further includes an array coupled to each of the fiber cores, the array is configured to allow each of the fiber ends to output toward a common plane, an object having a photosensitive material coupled to the common plane, and a pattern that is exposed onto the photosensitive material. The pattern is composed of a number beams corresponding to a number of fiber cores.

Abstract: A method for patterning objects, e.g., semiconductor wafer, glass plate, composite, etc. The method includes providing an object, which has an overlying layer of photosensitive material. The method includes selectively applying light through one or more fiber cores from a plurality of fiber cores. Each of the fiber cores has an input end and an output end. Each of the input ends is coupled to the optical source. The plurality of fiber cores is numbered from 1 through N, where N is an integer greater than 1. Each of the output ends is also numbered from 1 through N, which corresponds respectively to each of the plurality of fiber cores numbered from 1 through N. The method exposes the photosensitive material from light emitted selectively through the one or more fiber cores. The one or more fiber cores out(s) light respectively through one or more output ends of the fiber cores. Each of the output ends numbered from 1 through N is associated with a pixel numbered respectively from 1 through N.

Abstract: A method for verifying the accuracy of speech is provided. The speech is pre-loaded into a dialog system. A medium is provided to verify the accuracy of the pre-loaded speech in the dialog system by comparing the test content with a predetermined speech script.

Abstract: A method for patterning objects, e.g., semiconductor wafer, glass plate, composite, etc. The method includes providing an object, which has an overlying layer of photosensitive material. The method includes selectively applying light through one or more fiber cores from a plurality of fiber cores. Each of the fiber cores has an input end and an output end. Each of the input ends is coupled to the optical source. The plurality of fiber cores is numbered from 1 through N, where N is an integer greater than 1. Each of the output ends is also numbered from 1 through N, which corresponds respectively to each of the plurality of fiber cores numbered from 1 through N. The method exposes the photosensitive material from light emitted selectively through the one or more fiber cores. The one or more fiber cores out(s) light respectively through one or more output ends of the fiber cores. Each of the output ends numbered from 1 through N is associated with a pixel numbered respectively from 1 through N.

Abstract: A packaging process for improving effective chip-bonding area is disclosed in the present invention. An A-stage liquid paste is formed on a substrate and partially cured to become a B-stage film layer. The B-stage film layer is maintained without fully cured passing through a chip-attaching step and an electrically connecting step. During the molding step, the packing pressure for the molding compound (1000 psi˜1500 psi) is larger than the chip attaching pressure for enabling the B-stage film layer to be closely compressed in order to improve effective chip-bonding area. The B-stage film layer and the molding compound are cured simultaneous in the molding step.

Abstract: A packaging process for improving effective chip-bonding area is disclosed in the present invention. An A-stage liquid paste is formed on a substrate and partially cured to become a B-stage film layer. The B-stage film layer is maintained without fully cured passing through a chip-attaching step and an electrically connecting step. During the molding step, the packing pressure for the molding compound (1000 psi˜1500 psi) is larger than the chip attaching pressure for enabling the B-stage film layer to be closely compressed in order to improve effective chip-bonding area. The B-stage film layer and the molding compound are cured simultaneous in the molding step.

Abstract: A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage property which has a glass transition temperature not less than 40° C. for handling without adhesive under room temperature. After positioning the wafer, the wafer is singulated to form a plurality of dies with adhesive for die-to-die stacking, die-to-substrate or die-to-leadframe attaching.

Abstract: A SOC (Substrate-On-Chip) packaging process is disclosed. A layer of two-stage thermosetting mixture with solvent is coating on an upside of a substrate. Thereafter, the substrate is heated for removing solvent so that the two-stage thermosetting mixture becomes a B-stage dry adhesive film without solvent. Thus, the bonding pads of the chip are not covered by the dry adhesive film and a better operating flexibility is obtained in the SOC packaging process.

Abstract: A SOC (Substrate-On-Chip) packaging process is disclosed. A layer of two-stage thermosetting mixture with solvent is coating on an upside of a substrate. Thereafter, the substrate is heated for removing solvent so that the two-stage thermosetting mixture becomes a B-stage dry adhesive film without solvent. Thus, the bonding pads of the chip are not covered by the dry adhesive film and a better operating flexibility is obtained in the SOC packaging process.

Abstract: A steering lock comprising a lock bar having one end pivotably secured to an U-shaped plate at a hooked end of an actuating bar and an opposite end attached with a forked stop bar through screw joint, wherein said lock bar is locked in line with said actuating bar by a lock cylinder in said U-shaped plate when the forked end of said forked stop bar and the hooked end of said actuating bar are respectively stopped at the periphery of a steering wheel at two opposite locations.

Abstract: A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage property which has a glass transition temperature not less than 40° C. for handling without adhesive under room temperature. After positioning the wafer, the wafer is singulated to form a plurality of dies with adhesive for die-to-die stacking, die-to-substrate or die-to-leadframe attaching.