Abstract: A system and method introduce a variable thermal resistance to test and burn in apparatus. The system and method provide an efficient design for more accurate temperature control of integrated circuits. A system for testing integrated circuit (IC) packages comprises a plurality of IC testing socket bases arranged on a testing board and configured to receive a plurality of IC packages. A plurality of IC testing socket lids are arranged to attach to the testing board. Each IC testing socket lid comprises a temperature sensor to thermally contact the IC package and measure a surface temperature of the IC package, a heat sink is placed into either proximity to or directly in contact with the IC package, and an electronic controller to receive signals from the temperature sensor.

Abstract: A method and apparatus for conducting burn-in testing of semiconductors is provided. A semiconductor device under test (DUT) with a plurality of contact pads is placed into a seal carrier. The seal carrier is then placed within a plurality of first inner walls of an outer housing of a burn-in testing apparatus that is fastened to a cold plate through a printed circuit board (PCB). The seal carrier has a plurality of second inner walls that define a recessed cavity. A lid is placed over the seal carrier and fastened to the outer housing to seal the recessed cavity. The recessed cavity is pneumatically pressurized to force the contact pads of the semiconductor DUT into electrical contact with a plurality of resiliently compressible pins of a socket of the PCB. The socket is then energized to conduct a burn-in test of the semiconductor DUT.

Abstract: A system and method introduce a variable thermal resistance to test and burn in apparatus. The system and method provide an efficient design for more accurate temperature control of integrated circuits. A system for testing integrated circuit (IC) packages comprises a plurality of IC testing socket bases arranged on a testing board and configured to receive a plurality of IC packages. A plurality of IC testing socket lids are arranged to attach to the testing board. Each IC testing socket lid comprises a temperature sensor to thermally contact the IC package and measure a surface temperature of the IC package, a heat sink is placed into either proximity to or directly in contact with the IC package, and an electronic controller to receive signals from the temperature sensor.

Abstract: Apparatus and methods provide burn-in testing for semiconductors. A burn-in test apparatus (1) may include an outer housing forming an aperture with a test socket to receive a tile or wafer. The tile or wafer may include semiconductor device(s) for burn-in testing. The apparatus may include a thermal control unit to regulate testing temperature and/or drive electronics for powering the socket. The apparatus may include an inlet for gas pressure from a pressure source. The apparatus may include a lid covering the aperture when a tile/wafer is at the test socket. The apparatus may include a seal carrier in the aperture to form a pressure chamber with a surface of the tile. The pressure chamber may pneumatically couple with the inlet. Pressure of the pressure chamber may act upon the tile/wafer to urge a device under testing into thermal and/or electrical contact with the socket for conducting the burn-in test.

Abstract: Apparatus and methods provide burn-in testing for semiconductors. A burn-in test apparatus (1) may include an outer housing forming an aperture with a test socket to receive a tile or wafer. The tile or wafer may include semiconductor device(s) for burn-in testing. The apparatus may include a thermal control unit to regulate testing temperature and/or drive electronics for powering the socket. The apparatus may include an inlet for gas pressure from a pressure source. The apparatus may include a lid covering the aperture when a tile/wafer is at the test socket. The apparatus may include a seal carrier in the aperture to form a pressure chamber with a surface of the tile. The pressure chamber may pneumatically couple with the inlet. Pressure of the pressure chamber may act upon the tile/wafer to urge a device under testing into thermal and/or electrical contact with the socket for conducting the burn-in test.

Abstract: Apparatus and methods provide burn-in testing for semiconductors. A burn-in test apparatus (1) may include an outer housing forming an aperture with a test socket to receive a tile or wafer. The tile or wafer may include semiconductor device(s) for burn-in testing. The apparatus may include a thermal control unit to regulate testing temperature and/or drive electronics for powering the socket. The apparatus may include an inlet for gas pressure from a pressure source. The apparatus may include a lid covering the aperture when a tile/wafer is at the test socket. The apparatus may include a seal carrier in the aperture to form a pressure chamber with a surface of the tile. The pressure chamber may pneumatically couple with the inlet. Pressure of the pressure chamber may act upon the tile/wafer to urge a device under testing into thermal and/or electrical contact with the socket for conducting the burn-in test.

Abstract: A method and apparatus for enhancing the ability of a human to run and jump with comfort comparable to running barefoot on a trampoline and with control comparable to that of the unaided human form, yet with freedom from ankle-turning roll moments associated with substantial ground contact member (GCM) extension downwardly away from the sole of the foot, including a resiliently urged GCM constrained to two degrees of freedom: translation away from the sole of the user's foot and rotation about a longitudinal axis at ground level. The apparatus relates flexure of a GCM toe pressure member to comparable flexure of user's toes at the metatarsal joints. The apparatus also incorporates lower leg to ankle pivot bracing, and extends the GCM in downward direction parallel to the lower leg while mimicking user ankle articulation with parallelism-maintaining rotation about a downwardly resiliently urged transverse pivot axis similar to the user's own ankle joint for extended travel.

Abstract: A method and apparatus for enhancing the ability of a human to run and jump with comfort comparable to running barefoot on a trampoline and with control comparable to that of the unaided human form, yet with freedom from ankle-turning roll moments associated with substantial ground contact member (GCM) extension downwardly away from the sole of the foot including, a resiliently urged GCM constrained to two degrees of freedom: translation away from the sole of the user's foot and rotation about a longitudinal axis at ground level. The apparatus relates flexure of a GCM toe pressure member to comparable flexure of user's toes at the metatarsal joints. The apparatus also incorporates lower leg to ankle pivot bracing, and extends the GCM in downward direction parallel to the lower leg while mimicking user ankle articulation with parallelism-maintaining rotation about a downwardly resiliently urged transverse pivot axis similar to the user's own ankle joint for extended travel.

Abstract: A method and apparatus for completing a natural solar distillation cycle (comprised of maritime trade winds being elevated over mountain formations to form orographic clouds) includes enabling the low cost harvesting of freshwater during time periods when weather conditions permit, despite the absence of rain. The cloud-catching wind management structures preferably incorporate minimal pressure drop gas cyclones to centrifuge condensate particles out of the air stream, and jet pump-like flow guide structures to help overcome pressure drop, for efficient, energy-passive production of freshwater utilizing only the stagnation pressure of natural wind velocity. The permanence (design and anchoring against natural disasters) of the structures provides for incorporation of water treatment means, and connection with permanent collection reservoirs and distribution systems, for large volume supply of potable freshwater for public and industrial use.