Abstract: An automated door removal and replacement system utilizes a combination of linear and rotational drive to remove a door of a wafer supporting device and store the door below the device. In one embodiment, the wafer-supporting device is a Front Opening Unified Pod (FOUP). A door-contacting assembly is pivotally mounted to include a horizontal rest position and a vertical unlocking position. In the horizontal rest position, the assembly resides below the wafer-supporting device. The assembly is rotated to a vertical position and then linearly moved to engage the door. Keys of the assembly are manipulated to release the door. The assembly and the door are moved rearwardly and the assembly is pivoted to the rest position, clearing the opening to the wafer-supporting device.