Patents by Inventor Jesse YUAN
Jesse YUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11980759Abstract: Systems and techniques for wireless implantable devices, for example implantable biomedical devices employed for biomodulation. Some embodiments include a biomodulation system including a non-implantable assembly including a source for wireless power transfer and a data communications system, an implantable assembly including a power management module configured to continuously generate one or more operating voltage for the implantable assembly using wireless power transfer from the non-implantable assembly, a control module operably connected to at least one communication channel and at least one stimulation output, the control module including a processor unit to process information sensed via the at least one communication channel and, upon determining a condition exists, to generate an output to trigger the generation of a stimulus.Type: GrantFiled: December 12, 2022Date of Patent: May 14, 2024Assignee: Purdue Research FoundationInventors: Pedro Irazoqui, Gabriel Omar Albors, Daniel Pederson, Christopher John Quinkert, Muhammad Abdullah Arafat, Jack Williams, Zhi Wang, John G. R. Jefferys, Thelma Anderson Lovick, Terry L. Powley, Rebecca Anne Bercich, Henry Mei, Jesse Paul Somann, Quan Yuan, Hansraj Singh Bhamra
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Patent number: 11959894Abstract: LC techniques are disclosed. The LC technique includes providing a liquid chromatography system having a coated metallic fluid-contacting element, and transporting a fluid to contact the coated metallic fluid contacting element. Conditions for the transporting of the fluid are selected from the group consisting of the temperature of the fluid being greater than 150 degree Celsius, pressure urging the fluid being greater than 60 MPa, the fluid having a protein-containing analyte incompatible with one of titanium and polyether ether ketone, the fluid having a chelating agent incompatible with the one or both of the titanium or the polyether ether ketone.Type: GrantFiled: February 22, 2019Date of Patent: April 16, 2024Assignee: Silcotek CorpInventors: Jesse Bischof, Lucas D. Patterson, Gary Barone, Min Yuan, David A. Smith
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Publication number: 20240117495Abstract: Cold thermal chemical vapor deposition coatings, articles, and processes are disclosed. Specifically, a cold thermal chemical vapor deposition process includes positioning an article, heating a precursor gas to at least a decomposition temperature of the precursor gas to produce a deposition gas, introducing the deposition gas to a coating vessel, and depositing a coating from the deposition gas onto the article within the coating vessel. The article remains at a temperature below the decomposition temperature throughout the introducing and depositing of the deposition gas. The coating on the article has a gradient formed by the depositing of the coating having no flow for a period of time. The coated article includes a thermally-sensitive substrate (the thermally-sensitive substrate capable of being modified by a temperature of 300 degrees Celsius) and a coating the thermally-sensitive substrate.Type: ApplicationFiled: October 13, 2020Publication date: April 11, 2024Inventors: Geoffrey K. WHITE, Nicholas P. DESKEVICH, James B. MATTZELA, Gary A. BARONE, David A. SMITH, Pierre A. LECLAIR, Min YUAN, Jesse BISCHOF
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Patent number: 11703678Abstract: A method includes forming a first aluminum silicon layer on a metal layer and forming a titanium nitride layer (or other titanium-based layer) on a surface of the aluminum-silicon layer opposite the metal layer. The method further includes etching the titanium nitride layer to create a titanium nitride pad and forming a torsion hinge in the metal layer. The titanium nitride pad is on the torsion hinge. The method also includes depositing a sacrificial layer over the torsion hinge and titanium nitride pad, forming a via in the sacrificial layer from a surface of the sacrificial layer opposite the torsion hinge to the titanium nitride pad, depositing a metal mirror layer on a surface of the sacrificial layer opposite the torsion hinge and into the via, and removing the sacrificial layer.Type: GrantFiled: June 23, 2022Date of Patent: July 18, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Lucius M. Sherwin, Jesse Yuan, Noppawan Boorananut
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Publication number: 20220326508Abstract: A method includes forming a first aluminum silicon layer on a metal layer and forming a titanium nitride layer (or other titanium-based layer) on a surface of the aluminum-silicon layer opposite the metal layer. The method further includes etching the titanium nitride layer to create a titanium nitride pad and forming a torsion hinge in the metal layer. The titanium nitride pad is on the torsion hinge. The method also includes depositing a sacrificial layer over the torsion hinge and titanium nitride pad, forming a via in the sacrificial layer from a surface of the sacrificial layer opposite the torsion hinge to the titanium nitride pad, depositing a metal mirror layer on a surface of the sacrificial layer opposite the torsion hinge and into the via, and removing the sacrificial layer.Type: ApplicationFiled: June 23, 2022Publication date: October 13, 2022Applicant: TEXAS INSTRUMENTS INCORPORATEDInventors: Lucius M. Sherwin, Jesse Yuan, Noppawan Boorananut
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Patent number: 11409098Abstract: A method includes forming a first aluminum silicon layer on a metal layer and forming a titanium nitride layer (or other titanium-based layer) on a surface of the aluminum-silicon layer opposite the metal layer. The method further includes etching the titanium nitride layer to create a titanium nitride pad and forming a torsion hinge in the metal layer. The titanium nitride pad is on the torsion hinge. The method also includes depositing a sacrificial layer over the torsion hinge and titanium nitride pad, forming a via in the sacrificial layer from a surface of the sacrificial layer opposite the torsion hinge to the titanium nitride pad, depositing a metal mirror layer on a surface of the sacrificial layer opposite the torsion hinge and into the via, and removing the sacrificial layer.Type: GrantFiled: November 21, 2017Date of Patent: August 9, 2022Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Lucius M. Sherwin, Jesse Yuan, Noppawan Boorananut
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Publication number: 20190155016Abstract: A method includes forming a first aluminum silicon layer on a metal layer and forming a titanium nitride layer (or other titanium-based layer) on a surface of the aluminum-silicon layer opposite the metal layer. The method further includes etching the titanium nitride layer to create a titanium nitride pad and forming a torsion hinge in the metal layer. The titanium nitride pad is on the torsion hinge. The method also includes depositing a sacrificial layer over the torsion hinge and titanium nitride pad, forming a via in the sacrificial layer from a surface of the sacrificial layer opposite the torsion hinge to the titanium nitride pad, depositing a metal mirror layer on a surface of the sacrificial layer opposite the torsion hinge and into the via, and removing the sacrificial layer.Type: ApplicationFiled: November 21, 2017Publication date: May 23, 2019Inventors: Lucius M. SHERWIN, Jesse YUAN, Noppawan BOORANANUT