Abstract: Disclosed are insert-molded electronic modules that include an electrical/electronic component and a heat sink that interlocks with, and optionally also encapsulates, the electrical/electronic component to provide thermal management for the component. The heat sink is formed using a thermally conductive thermoplastic polymer composition and replaces the potting compound and thermal interface material typically used in such assemblies. The electrical/electronic component includes openings that allow the thermally conductive thermoplastic polymer composition to flow therethrough and interlock with the electrical/electronic component. The electronic module may include an insert positioned between the electrical/electronic component and the heat sink, wherein the insert includes holes that allow the conductive thermoplastic polymer composition to flow therethrough and interlock with the insert.

Abstract: Disclosed are processes for In-Mold coating of a substrate. The processes include: introducing a curable composition to a mixhead at a first elevated pressure, the curable composition comprising a first polymeric component and a second polymeric component, the introducing of the curable composition to the mixhead comprising mixing the first and second polymeric components by impingement to form an intermediate composition; introducing the intermediate composition to a secondary mixer, the introducing of the intermediate composition to the secondary mixer comprising mixing the intermediate composition to form a coating composition; and introducing the coating composition into a mold containing a substrate to form a curable coating on a surface of the substrate.

Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

Abstract: Disclosed are processes for In-Mold coating of a substrate. The processes include: introducing a curable composition to a mixhead at a first elevated pressure, the curable composition comprising a first polymeric component and a second polymeric component, the introducing of the curable composition to the mixhead comprising mixing the first and second polymeric components by impingement to form an intermediate composition; introducing the intermediate composition to a secondary mixer, the introducing of the intermediate composition to the secondary mixer comprising mixing the intermediate composition to form a coating composition; and introducing the coating composition into a mold containing a substrate to form a curable coating on a surface of the substrate.

Abstract: Reflective coatings comprise a transparent binder, such as polyurethane, one or more reflective additives, such as metal flakes, coated mica or titanium dioxide particles, and a phosphor. Such coatings may be applied to polymer substrates such as polycarbonate, without any additional reflective coating, film or layer. Processes for the mixing and applying the coatings area described, including introducing a polymer substrate into a mold cavity of a mold, introducing a coating composition into the mold cavity containing the polymer substrate in order to coat the substrate, at processing temperature 50° C.-120° C., at processing pressure 11,000 to 20,700 kPa, and curing the composition in the mold cavity at cure temperature of 62-105° C.

Abstract: Processes for in-mold coating of polymer substrates comprising: introducing a plastic substrate into a mold cavity of a mold; introducing a coating composition into the mold cavity containing the plastic substrate in order to coat the substrate, at processing temperature 50° C.-120° C., and at processing pressure 11,000 to 20,700 kPa; and curing the composition in the mold cavity at cure temperature of 62-105° C.; wherein the coating composition comprises a polymer comprising isocyanate-reactive groups; and a polyisocyanate, and wherein the coating composition has a viscosity of 200 to 500 mPa·s at the processing temperature. Further embodiments include attaching electronic circuits, light emitting diodes and/or graphic images to the plastic substrate before coating.

Abstract: Two shot injection molding processes are disclosed for making thermoplastic parts of two different compositions, the second shot composition having a higher thermal conductivity than the first, and the mold cavity surface temperature is greater than 70° C., preferably 70-100° C. In embodiments, the cavity surface temperature is within 20° C. of the Vicat temperature for the composition being injected, the cavity pressure is between 20 and 150 MPa, and the melt temperature of the second shot material is 200-400° C., or 250-340° C. The resulting molded part provides for improved thermal conductivity between the two molded compositions.

Abstract: Disclosed are processes for In-Mold coating of a substrate. The processes include: introducing a curable composition to a mixhead at a first elevated pressure, the curable composition comprising a first polymeric component and a second polymeric component, the introducing of the curable composition to the mixhead comprising mixing the first and second polymeric components by impingement to form an intermediate composition; introducing the intermediate composition to a secondary mixer, the introducing of the intermediate composition to the secondary mixer comprising mixing the intermediate composition to form a coating composition; and introducing the coating composition into a mold containing a substrate to form a curable coating on a surface of the substrate.

Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

Abstract: Disclosed are processes for in-mold coating of a plastic substrate. The processes include: (a) molding a plastic substrate in a first mold cavity of a mold comprising at least two cavities to form a molded plastic substrate; (b) introducing the molded plastic substrate into a second mold cavity of the mold; (c) introducing a coating composition into the second mold cavity containing the molded plastic substrate in order to coat the substrate, the coating composition comprising: (i) a polymer comprising isocyanate-reactive groups; and (ii) a polyisocyanate; (d) curing the composition in the second mold cavity; and (e) opening the mold cavity.

Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

Abstract: Disclosed are processes for in-mold coating of a plastic substrate. The processes include: (a) molding a plastic substrate in a first mold cavity of a mold comprising at least two cavities to form a molded plastic substrate; (b) introducing the molded plastic substrate into a second mold cavity of the mold; (c) introducing a coating composition into the second mold cavity containing the molded plastic substrate in order to coat the substrate, the coating composition comprising: (i) a polymer comprising isocyanate-reactive groups; and (ii) a polyisocyanate; (d) curing the composition in the second mold cavity; and (e) opening the mold cavity.

Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.