Abstract: A method for making ultrasound transducers and ultrasound probes includes providing a piezoelectric layer having a first surface and a second surface, where the second surface is on an opposite side of the piezoelectric layer from the first surface. The method includes fabricating a plurality of conductive through vias extending from the first surface to the second surface of the piezoelectric layer, where fabricating the plurality of conductive through vias comprises cutting a plurality of trenches through the piezoelectric layer and filling each of the plurality of trenches with a conductive material. The method includes cutting the piezoelectric layer into a plurality of transducer units after fabricating the plurality of conductive through vias and cutting each of the transducer units into a plurality of transducer elements.

Abstract: A method for making ultrasound transducers and ultrasound probes includes providing a piezoelectric layer having a first surface and a second surface, where the second surface is on an opposite side of the piezoelectric layer from the first surface. The method includes fabricating a plurality of conductive through vias extending from the first surface to the second surface of the piezoelectric layer, where fabricating the plurality of conductive through vias comprises cutting a plurality of trenches through the piezoelectric layer and filling each of the plurality of trenches with a conductive material. The method includes cutting the piezoelectric layer into a plurality of transducer units after fabricating the plurality of conductive through vias and cutting each of the transducer units into a plurality of transducer elements.

Abstract: An acoustic stack is described, where the acoustic stack comprises a plurality of acoustic stack components, which are laminated with an accelerated cure adhesive, which comprises an epoxy resin. The epoxy resin comprises one or more modified epoxy resins, which are selected from a group consisting of epoxy phenol novolac, bisphenol A, and bisphenol F. Further described is a method for producing an acoustic stack. The method comprises providing a plurality of acoustic stack components and dispensing an accelerated cure adhesive to the acoustic stack components. The accelerated cure adhesive dispensed on, to, and/or in the acoustic stack components includes an epoxy resin, which comprises at least one modified epoxy resin selected from a group consisting of epoxy phenol novolac, bisphenol A, and bisphenol F. After the accelerated cure adhesive is dispensed to the acoustic stack components, the accelerated cure adhesive is cured.

Abstract: An acoustic stack is described, where the acoustic stack comprises a plurality of acoustic stack components, which are laminated with an accelerated cure adhesive, which comprises an epoxy resin. The epoxy resin comprises one or more modified epoxy resins, which are selected from a group consisting of epoxy phenol novolac, bisphenol A, and bisphenol F. Further described is a method for producing an acoustic stack. The method comprises providing a plurality of acoustic stack components and dispensing an accelerated cure adhesive to the acoustic stack components. The accelerated cure adhesive dispensed on, to, and/or in the acoustic stack components includes an epoxy resin, which comprises at least one modified epoxy resin selected from a group consisting of epoxy phenol novolac, bisphenol A, and bisphenol F. After the accelerated cure adhesive is dispensed to the acoustic stack components, the accelerated cure adhesive is cured.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.