Patents by Inventor Jessica Kiefer

Jessica Kiefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power adapter for power supply unit
    Patent number: 11894936
    Abstract: In one embodiment, an apparatus includes a power adapter configured for direct connection to a Power Supply Unit (PSU) installed in a network device, the power adapter comprising a power input port for receiving power on an Ethernet cable, a power converter module for converting the power received at the power input port to a PSU input power, and a power output connector for connection with a PSU power input connector.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: February 6, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Richard Goergen, Chad M. Jones, Jessica Kiefer, Douglas Paul Arduini
  • INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMUNICATIONS SIGNALS FOR A PRINTED CIRCUIT BOARD
    Publication number: 20230354505
    Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).
    Type: Application
    Filed: June 20, 2023
    Publication date: November 2, 2023
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
    Patent number: 11751322
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
    Type: Grant
    Filed: March 24, 2022
    Date of Patent: September 5, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL TO REDUCE POWER LOSS IN A POWER PLANE
    Publication number: 20230269873
    Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
    Type: Application
    Filed: April 24, 2023
    Publication date: August 24, 2023
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
    Patent number: 11706870
    Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: July 18, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • POWER ADAPTER FOR POWER SUPPLY UNIT
    Publication number: 20220329448
    Abstract: In one embodiment, an apparatus includes a power adapter configured for direct connection to a Power Supply Unit (PSU) installed in a network device, the power adapter comprising a power input port for receiving power on an Ethernet cable, a power converter module for converting the power received at the power input port to a PSU input power, and a power output connector for connection with a PSU power input connector.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 13, 2022
    Inventors: Joel Richard Goergen, Chad M. Jones, Jessica Kiefer, Douglas Paul Arduini
  • Power adapter for power supply unit
    Patent number: 11438183
    Abstract: In one embodiment, an apparatus includes a power adapter configured for direct connection to a Power Supply Unit (PSU) installed in a network device, the power adapter comprising a power input port for receiving power on an Ethernet cable, a power converter module for converting the power received at the power input port to a PSU input power, and a power output connector for connection with a PSU power input connector.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: September 6, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Richard Goergen, Chad M. Jones, Jessica Kiefer, Douglas Paul Arduini
  • INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMUNICATIONS SIGNALS FOR A PRINTED CIRCUIT BOARD
    Publication number: 20220217837
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.
    Type: Application
    Filed: March 24, 2022
    Publication date: July 7, 2022
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
    Patent number: 11330702
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: May 10, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • Power distribution from point-of-load with cooling
    Patent number: 11252811
    Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: February 15, 2022
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Richard Goergen, Jessica Kiefer, Ashley Julia Maker Erickson, Yi Tang, M. Baris Dogruoz, Elizabeth Ann Kochuparambil, Shobhana Punjabi
  • PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL TO REDUCE POWER LOSS IN A POWER PLANE
    Publication number: 20220039257
    Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.
    Type: Application
    Filed: October 18, 2021
    Publication date: February 3, 2022
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
    Patent number: 11202368
    Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: December 14, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • PROVIDING ONE OR MORE CARBON LAYERS TO A COPPER CONDUCTIVE MATERIAL TO REDUCE POWER LOSS IN A POWER PLANE
    Publication number: 20210337666
    Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.
    Type: Application
    Filed: August 28, 2020
    Publication date: October 28, 2021
    Inventors: Joel Goergen, Jessica Kiefer, Alpesh Umakant Bhobe, Kameron Rose Hurst, D. Brice Achkir, Amendra Koul, Scott Hinaga, David Nozadze
  • INTEGRATING GRAPHENE INTO THE SKIN DEPTH REGION OF HIGH SPEED COMMUNICATIONS SIGNALS FOR A PRINTED CIRCUIT BOARD
    Publication number: 20210337657
    Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.
    Type: Application
    Filed: October 26, 2020
    Publication date: October 28, 2021
    Inventors: Joel Goergen, Scott Hinaga, Jessica Kiefer, Alpesh Umakant Bhobe, D. Brice Achkir, David Nozadze, Amendra Koul, Mehmet Onder Cap, Madeline Marie Roemer
  • POWER ADAPTER FOR POWER SUPPLY UNIT
    Publication number: 20210266188
    Abstract: In one embodiment, an apparatus includes a power adapter configured for direct connection to a Power Supply Unit (PSU) installed in a network device, the power adapter comprising a power input port for receiving power on an Ethernet cable, a power converter module for converting the power received at the power input port to a PSU input power, and a power output connector for connection with a PSU power input connector.
    Type: Application
    Filed: June 25, 2020
    Publication date: August 26, 2021
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Joel Richard Goergen, Chad M. Jones, Jessica Kiefer, Douglas Paul Arduini
  • POWER DISTRIBUTION FROM POINT-OF-LOAD WITH COOLING
    Publication number: 20210219415
    Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.
    Type: Application
    Filed: January 15, 2020
    Publication date: July 15, 2021
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Joel Richard Goergen, Jessica Kiefer, Ashley Julia Maker Erickson, Yi Tang, M. Baris Dogruoz, Elizabeth Ann Kochuparambil, Shobhana Punjabi