Patents by Inventor Jetse de Witte
Jetse de Witte has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10643957Abstract: Embodiments of packaged semiconductor devices and methods of making thereof are provided herein, which include a semiconductor die having a plurality of pads on an active side; a dummy die having a plurality of openings that extend from a first major surface to a second major surface opposite the first major surface, wherein the plurality of openings are aligned with the plurality of pads; and a silicone-based glue attaching the dummy die to the active side of the semiconductor die, wherein a plurality of bondable surfaces of the semiconductor die are exposed through the plurality of openings of the dummy die.Type: GrantFiled: August 27, 2018Date of Patent: May 5, 2020Assignee: NXP B.V.Inventors: Antonius Hendrikus Jozef Kamphuis, Amar Ashok Mavinkurve, Jetse De Witte, Andrei-Alexandru Damian
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Publication number: 20200066653Abstract: Embodiments of packaged semiconductor devices and methods of making thereof are provided herein, which include a semiconductor die having a plurality of pads on an active side; a dummy die having a plurality of openings that extend from a first major surface to a second major surface opposite the first major surface, wherein the plurality of openings are aligned with the plurality of pads; and a silicone-based glue attaching the dummy die to the active side of the semiconductor die, wherein a plurality of bondable surfaces of the semiconductor die are exposed through the plurality of openings of the dummy die.Type: ApplicationFiled: August 27, 2018Publication date: February 27, 2020Inventors: Antonius Hendrikus Jozef KAMPHUIS, Amar Ashok MAVINKURVE, Jetse DE WITTE, Andrei-Alexandru DAMIAN
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Patent number: 10431476Abstract: A method of making a plurality of packaged semiconductor devices. The method includes providing a carrier blank having a die receiving surface and an underside. The method also includes mounting a plurality of semiconductor dies on the die receiving surface, wherein the dies extend to a first height above the die receiving surface. The method further includes depositing an encapsulant on the die receiving surface, wherein an upper surface of the encapsulant is located above said first height. The method also includes singulating to form the plurality of packaged semiconductor devices by sawing into the underside, through the carrier blank and partially through the encapsulant to a depth intermediate the first height and the upper surface, wherein said sawing separates the carrier blank into a plurality of carriers, and removing encapsulant from the upper surface of the encapsulant at least until said saw depth is reached.Type: GrantFiled: March 26, 2018Date of Patent: October 1, 2019Assignee: NXP B.V.Inventors: Jetse de Witte, Antonius Hendrikus Jozef Kamphuis, Jan Gulpen
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Patent number: 10177111Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.Type: GrantFiled: March 6, 2017Date of Patent: January 8, 2019Assignee: NXP B.V.Inventors: Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes
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Publication number: 20180301353Abstract: A method of making a plurality of packaged semiconductor devices. The method includes providing a carrier blank having a die receiving surface and an underside. The method also includes mounting a plurality of semiconductor dies on the die receiving surface, wherein the dies extend to a first height above the die receiving surface. The method further includes depositing an encapsulant on the die receiving surface, wherein an upper surface of the encapsulant is located above said first height. The method also includes singulating to form the plurality of packaged semiconductor devices by sawing into the underside, through the carrier blank and partially through the encapsulant to a depth intermediate the first height and the upper surface, wherein said sawing separates the carrier blank into a plurality of carriers, and removing encapsulant from the upper surface of the encapsulant at least until said saw depth is reached.Type: ApplicationFiled: March 26, 2018Publication date: October 18, 2018Inventors: Jetse de Witte, Antonius Hendrikus Jozef Kamphuis, Jan Gulpen
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Patent number: 9704823Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.Type: GrantFiled: October 29, 2015Date of Patent: July 11, 2017Assignee: NXP B.V.Inventors: Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes
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Publication number: 20170179076Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.Type: ApplicationFiled: March 6, 2017Publication date: June 22, 2017Inventors: Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes
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Patent number: 9466585Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.Type: GrantFiled: October 29, 2015Date of Patent: October 11, 2016Assignee: NXP B.V.Inventors: Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes, Jetse de Witte
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Publication number: 20160276176Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.Type: ApplicationFiled: October 29, 2015Publication date: September 22, 2016Inventors: Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes
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Publication number: 20160276306Abstract: Consistent with example embodiments, a wafer substrate undergoes processing in which a resilient material is applied to the front-side and back-side surfaces of the wafer substrate. By defining trenches in saw lanes between active device die, additional resilient material may be placed therein. In an example embodiment, after the active device die are separated into individual product devices, the resulting product device has coverage on the front-side surface, back-side surface, and the four vertical faces of the encapsulated active device die. The front-side surface has exposed contact areas so that the product device may be attached to an end user's system circuit board. Further, the resilient coating protects the encapsulated active device die from damage during assembly.Type: ApplicationFiled: October 29, 2015Publication date: September 22, 2016Inventors: Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes, Jetse de Witte