Abstract: A multilayered ceramic chip capacitor. An electrode ink pattern is formed on a release film. The electrode ink pattern is calendered, densified and flattened. Dielectric material is applied to the release film and surrounds but does not cover the electrode ink to form an electrode surround printed dielectric sheet. The dielectric is calendered, densified and flattened. The densities of the electrode ink and dielectric are formulated such that after calendering the electrode ink and dielectric surfaces are substantially coplanar. A final overcoat of dielectric is applied over the surround printed dielectric sheet.

Abstract: A method for making a substrate for use in a multilayered integrated circuit or multichip module which includes coating a conductive material on a surface of a support sheet to form a conductive circuit and then drying the sheet. Next, a coating of a layer of dielectric layer is placed on the support surface in the areas where the conductive material is not cast. After which the coated sheet is densified to form a densified conductive circuit embedded dielectric layer. A second coating of a dielectric is placed over the first densified conductive circuit embedded dielectric layer such that the second layer is characterized by vias therein which are in register with at least a portion of the conductive circuit. The vias in the second dielectric layer are filled to form electrically conductive vias and then densifying to form the substrate.

Abstract: Multilayered ceramic capacitors are manufactured using electrode machine coating densification techniques. The capacitors produced have electrodes and dielectric layers which are more uniform, thinner and flatter than prior art electrode and dielectric layers. An electrode pattern is printed on a release sheet and calendered. A dielectric overcoats the electrode pattern and is calendered, forming an electrode embedded green sheet. The green sheet is stacked with similarly formed electrode embedded green sheets, the stack is laminated and unfinished capacitors are cut from the stack.