Patents by Inventor Jh Yoon

Jh Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device package
    Patent number: 9859255
    Abstract: Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a package substrate, an electronic component, a mold compound encapsulating the electronic component, and a redistribution layer disposed such that the mold compound is between the package substrate and the redistribution layer. The redistribution layer and the package substrate can be electrically coupled. In addition, the redistribution layer and the electronic component can be electrically coupled to electrically couple the electronic component and the package substrate. Associated systems and methods are also disclosed.
    Type: Grant
    Filed: October 1, 2016
    Date of Patent: January 2, 2018
    Assignee: Intel Corporation
    Inventors: Jh Yoon, Yong She, Mao Guo, Richard Patten