Patents by Inventor Jhao-Yi Wu

Jhao-Yi Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124298
    Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.
    Type: Application
    Filed: January 10, 2023
    Publication date: April 18, 2024
    Inventors: Yun-Chung Wu, Jhao-Yi Wang, Hao Chun Yang, Pei-Wei Lee, Wen-Hsiung Lu
  • Publication number: 20240120295
    Abstract: A semiconductor chip and a manufacturing method thereof are provided. The semiconductor chip includes: an array of pillar structures, disposed on a front surface of the semiconductor chip, and respectively including a ground pillar and multiple working pillars laterally spaced apart from and substantially parallel with a line portion of the ground pillar; and dummy pillar structures, disposed on the front surface of the semiconductor chip and laterally surrounding the pillar structures. Active devices formed inside the semiconductor chip are electrically connected to the working pillar. The ground pillars of the pillar structures and the dummy pillar structures are electrically connected to form a current pathway on the front surface of the semiconductor chip.
    Type: Application
    Filed: January 30, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Hsien Lee, Yun-Chung Wu, Pei-Wei Lee, Fu Wei Liu, Jhao-Yi Wang
  • Patent number: 10478898
    Abstract: A silver particles manufacturing method comprises following steps: providing a silver containing compound; providing an organic solution; adding the silver containing compound into the organic solution, to perform ultrasonic vibrations or a heating process until the silver containing compound is dissolved completely into the organic solution, to form a silver ion solution; performing the ultrasonic vibrations or the heating process, and then let the solution settle down for a period, to form a silver particles synthesized solution; and placing the silver particles synthesized solution into a centrifuge to perform centrifugation and separation, to obtain ?m-scale silver particles and nm-scale silver particles. The silver particles manufacturing method has the advantages of low pollution, low cost, high yield, and mass production.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: November 19, 2019
    Assignee: NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chien-Liang Chang, Wu-Ching Hung, Wei-Jen Liu, Kuei-Ting Hsu, Jhao-Yi Wu, Pin-Chun Lin
  • Publication number: 20190221849
    Abstract: A method of producing graphene including the following steps is provided. A graphite material is dispersed in a solution to form a graphite suspension solution. A first crushing process and a second crushing process are performed on the graphite suspension solution sequentially to crush the graphite material, so as to form the graphene. The first crushing process includes applying a first pressure to the graphite suspension solution, and the second crushing process includes applying a second pressure to the graphite suspension solution. The second pressure is greater than the first pressure.
    Type: Application
    Filed: October 22, 2018
    Publication date: July 18, 2019
    Applicant: Chung Yuan Christian University
    Inventors: Wei-Jen Liu, Jhao-Yi Wu, Pin-Chun Lin, Yen-Yu Yeh, Cheng-Yi Lin
  • Publication number: 20180320045
    Abstract: A manufacturing method of a thermal dissipating structure including following steps is provided. A carbon material is formed by performing a homogeneous cavitation process to a raw material of graphite. A thermal dissipating slurry is formed by mixing the carbon material and a binder. A thermal dissipating film is formed on a substrate by coating the thermal dissipating slurry on the substrate.
    Type: Application
    Filed: October 23, 2017
    Publication date: November 8, 2018
    Applicant: Chung Yuan Christian University
    Inventors: Wei-Jen Liu, Yi-Chin Lai, Pin-Chun Lin, Jhao-Yi Wu
  • Publication number: 20170157675
    Abstract: A silver particles manufacturing method comprises following steps: providing a silver containing compound; providing an organic solution; adding the silver containing compound into the organic solution, to perform ultrasonic vibrations or a heating process until the silver containing compound is dissolved completely into the organic solution, to form a silver ion solution; performing the ultrasonic vibrations or the heating process, and then let the solution settle down for a period, to form a silver particles synthesized solution; and placing the silver particles synthesized solution into a centrifuge to perform centrifugation and separation, to obtain ?m-scale silver particles and nm-scale silver particles. The silver particles manufacturing method has the advantages of low pollution, low cost, high yield, and mass production.
    Type: Application
    Filed: December 8, 2015
    Publication date: June 8, 2017
    Inventors: Chien-Liang Chang, Wu-Ching Hung, Wei-Jen Liu, Kuei-Ting Hsu, Jhao-Yi Wu, Pin-Chun Lin