Patents by Inventor Jhih-Sin Hong

Jhih-Sin Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light-emitting device
    Patent number: 9190586
    Abstract: A semiconductor light-emitting device includes at least one light-emitting chip. The light-emitting chip includes plural light-emitting units, which are electrically coupled to each other in series, in parallel or in series-parallel combination; a first-type electrode electrically coupled to an external power source, the first-type electrode being disposed on one of the light-emitting units; a second-type electrode disposed on another of the light-emitting units; and a tapped point for electrically coupling at least one of the light-emitting units to an electronic component.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: November 17, 2015
    Assignee: PHOSTEK, INC.
    Inventors: Shih Tsun Yang, Yuan-Hsiao Chang, Jhih-Sin Hong
  • SEMICONDUCTOR LIGHT-EMITTING DEVICE
    Publication number: 20140055048
    Abstract: A semiconductor light-emitting device includes at least one light-emitting chip. The light-emitting chip includes plural light-emitting units, which are electrically coupled to each other in series, in parallel or in series-parallel combination; a first-type electrode electrically coupled to an external power source, the first-type electrode being disposed on one of the light-emitting units; a second-type electrode disposed on another of the light-emitting units; and a tapped point for electrically coupling at least one of the light-emitting units to an electronic component.
    Type: Application
    Filed: April 12, 2013
    Publication date: February 27, 2014
    Applicant: PHOSTEK, INC.
    Inventors: Shih Tsun Yang, Yuan-Hsiao Chang, Jhih-Sin Hong
  • LENS, PACKAGE AND PACKAGING METHOD FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE
    Publication number: 20130056774
    Abstract: This invention provides lenses having a pendant shape profile and their applications and forming methods. In an embodiment, the lenses are used to encapsulate one or more light-emitting diode chips so as to increase the light extraction efficiency.
    Type: Application
    Filed: December 6, 2011
    Publication date: March 7, 2013
    Applicant: PHOSTEK, INC.
    Inventors: Jhih-Sin HONG, Shih-Feng SHAO
  • LED CHIP MODULES, METHOD FOR PACKAGING THE LED CHIP MODULES, AND MOVING FIXTURE THEREOF
    Publication number: 20120056228
    Abstract: A method for packaging LED chip modules is provided. First, a first sacrificial layer is disposed on a substrate. Afterwards, LED chips are synchronously disposed on the first sacrificial layer before the first sacrificial layer cures. Next, a first material, a second sacrificial layer, and a second material are used to form a support layer on the first sacrificial layer. The first sacrificial layer and the second sacrificial layer are then removed, so that LED chip modules are obtained, wherein each LED chip module has a corresponding support layer. Furthermore, a moving fixture is provided to synchronously remove chips from a wafer and dispose them on the sacrificial layer.
    Type: Application
    Filed: September 6, 2011
    Publication date: March 8, 2012
    Applicants: PHOSTEK, INC., NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Ray-Hua Horng, Jhih-Sin Hong, Shih-Feng Shao, Heng Liu
  • METHOD FOR PACKAGING LED CHIP MODULES AND MOVING FIXTURE THEREOF
    Publication number: 20120058579
    Abstract: A method for packaging LED chip modules is provided. First, a first sacrificial layer is disposed on a substrate. Afterwards, LED chips are synchronously disposed on the first sacrificial layer before the first sacrificial layer cures. Next, a first material, a second sacrificial layer, and a second material are used to form a support layer on the first sacrificial layer. The first sacrificial layer and the second sacrificial layer are then removed, so that LED chip modules are obtained, wherein each LED chip module has a corresponding support layer. Furthermore, a moving fixture is provided to synchronously remove chips from a wafer and dispose them on the sacrificial layer.
    Type: Application
    Filed: September 6, 2011
    Publication date: March 8, 2012
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Ray-Hua Horng, Jhih-Sin Hong