Abstract: An embodiment provides a pixel including: a first bank pattern on a substrate; a first electrode and a second electrode on the first bank pattern and extending in a first direction; an insulating layer on the first electrode and the second electrode; a plurality of light emitting elements on the insulating layer between the first electrode and the second electrode; a first contact electrode electrically connecting the first electrode and the light emitting elements; and a second contact electrode electrically connecting the second electrode and the light emitting elements. The first electrode and the second electrode may be spaced from each other in a second direction different from the first direction on the first bank pattern.

Abstract: A test apparatus includes: a compensation coefficient calculator configured to calculate a main compensation coefficient for a main gradation and a sub compensation coefficient for a sub gradation based on a detected image signal; a primary predictor configured to determine a representative value of each of a plurality of blocks of a display panel based on the detected image signal, and output a prediction compensation coefficient for the sub gradation based on the main compensation coefficient and the representative value corresponding to each of the plurality of blocks; a secondary predictor configured to determine a flag based on the sub compensation coefficient and the prediction compensation coefficient; and a controller configured to output the main compensation coefficient, the representative value, and the flag stored in a memory as compensation data.

Abstract: In a method of generating compensation data for a display device, first color, second color, and third color compensation value sets may be obtained by capturing first color, second color, and third color images displayed by the display device, respectively, white, first color, second color, and third color loading luminances may be obtained by capturing white, first color, second color, and third color loading patterns displayed by the display device, respectively, first color, second color, and third color scale factors may be calculated by dividing a luminance decrease ratio of the white loading luminance by luminance decrease ratios of the first color, second color, and third color loading luminances, respectively, and the first color, second color, and third color compensation value sets and the first color, second color, and third color scale factors may be stored in the display device.

Abstract: The present invention relates to a cosmetic composition for skin whitening.

Abstract: A test apparatus includes: a compensation coefficient calculator configured to calculate a main compensation coefficient for a main gradation and a sub compensation coefficient for a sub gradation based on a detected image signal; a primary predictor configured to determine a representative value of each of a plurality of blocks of a display panel based on the detected image signal, and output a prediction compensation coefficient for the sub gradation based on the main compensation coefficient and the representative value corresponding to each of the plurality of blocks; a secondary predictor configured to determine a flag based on the sub compensation coefficient and the prediction compensation coefficient; and a controller configured to output the main compensation coefficient, the representative value, and the flag stored in a memory as compensation data.

Abstract: A display device according to an exemplary embodiment includes: a plurality of transistors disposed on a substrate; a plurality of pixel electrodes electrically connected to the plurality of transistors; a plurality of first color filters, a plurality of second color filters, and a plurality of third color filters disposed between the plurality of transistors and the plurality of pixel electrodes; and a plurality of main spacers and a plurality of sub-spacers disposed on the pixel electrode, wherein the plurality of main spacers and the plurality of sub-spacers are disposed to overlap selected portions of the plurality of first color filters in a plan view, respectively, and not to overlap the plurality of second color filters and the plurality of third color filters in a plan view.

Abstract: In a method of generating compensation data for a display device, first color, second color, and third color compensation value sets may be obtained by capturing first color, second color, and third color images displayed by the display device, respectively, white, first color, second color, and third color loading luminances may be obtained by capturing white, first color, second color, and third color loading patterns displayed by the display device, respectively, first color, second color, and third color scale factors may be calculated by dividing a luminance decrease ratio of the white loading luminance by luminance decrease ratios of the first color, second color, and third color loading luminances, respectively, and the first color, second color, and third color compensation value sets and the first color, second color, and third color scale factors may be stored in the display device.

Abstract: A display device according to an exemplary embodiment includes: a plurality of transistors disposed on a substrate; a plurality of pixel electrodes electrically connected to the plurality of transistors; a plurality of first color filters, a plurality of second color filters, and a plurality of third color filters disposed between the plurality of transistors and the plurality of pixel electrodes; and a plurality of main spacers and a plurality of sub-spacers disposed on the pixel electrode, wherein the plurality of main spacers and the plurality of sub-spacers are disposed to overlap selected portions of the plurality of first color filters in a plan view, respectively, and not to overlap the plurality of second color filters and the plurality of third color filters in a plan view.

Abstract: A display device may include the following elements: a transistor; a pixel electrode electrically connected to the transistor; a first color filter overlapping the pixel electrode; a first color filtering member including a same material as the first color filter; a second color filter partially overlapping the first color filter or immediately neighboring the first color filter; a third color filter overlapping the first color filtering member and partially overlapping the second color filter or immediately neighboring the second color filter; a main spacer overlapping the third color filter; and an auxiliary spacer overlapping the first color filter or the second color filter and being shorter than the main spacer. The third color filter includes a first portion and a second portion. The first portion overlaps the first color filtering member. The second portion neighbors the first portion and is thicker than the first portion.

Abstract: A semiconductor package includes: a connection member including a plurality of connection pads and a redistribution layer; a semiconductor chip disposed on the connection member; an encapsulant sealing the semiconductor chip; a passivation layer disposed on the connection member; a plurality of under bump metallurgy (UBM) pads disposed on the passivation layer; and a plurality of UBM vias connecting the plurality of UBM pads to the plurality of connection pads, respectively, wherein the plurality of UBM pads include a first UBM pad overlapped with the semiconductor chip in a stacking direction, and a second UBM pad located outside of the overlapped region, and the first connection pad has an area larger than an area of an associated first UBM pad while the associated first UBM pad is overlapped in the stacking direction, and has an area larger than an area of the second connection pad.

Abstract: A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.

Abstract: A thermoplastic resin composition of the present invention comprises: an acrylate-based rubber-modified vinyl-based graft copolymer; aromatic vinyl-cyanide vinyl-based copolymer resin; a first dulling agent; and a second dulling agent, wherein the first dulling agent is a copolymer (PS-g-SAN) in which a styrene-acrylonitrile copolymer is graft-polymerized in polystyrene, and the second dulling agent is a copolymer in which a styrene-acrylonitrile copolymer is graft-polymerized in a poly(ethylene-co-glycidyl methacrylate). The thermoplastic resin composition has excellent low-light properties, impact resistance and fluidity.

Abstract: A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.

Abstract: A semiconductor package includes: a connection member including a plurality of connection pads and a redistribution layer; a semiconductor chip disposed on the connection member; an encapsulant sealing the semiconductor chip; a passivation layer disposed on the connection member; a plurality of under bump metallurgy (UBM) pads disposed on the passivation layer; and a plurality of UBM vias connecting the plurality of UBM pads to the plurality of connection pads, respectively, wherein the plurality of UBM pads include a first UBM pad overlapped with the semiconductor chip in a stacking direction, and a second UBM pad located outside of the overlapped region, and the first connection pad has an area larger than an area of an associated first UBM pad while the associated first UBM pad is overlapped in the stacking direction, and has an area larger than an area of the second connection pad.

Abstract: An integrated circuit including: a plurality of physically unclonable function (PUF) cells each configured to generate a cell signal having a unique value; a selector configured to output a first signal obtained by not inverting a cell signal output by a PUF cell selected from the plurality PUF cells and a second signal obtained by inverting the cell signal; and a key generator configured to generate a security key in response to the first signal or the second signal, wherein the selector includes a first conversion circuit configured to generate the first signal and a second conversion circuit having the same structure as the first conversion circuit and configured to generate the second signal.

Abstract: A display device includes a display panel including a first pixel having first and second sub-pixels for first and second color light, and a second pixel having third and fourth sub-pixels for third and second color light, an image processor to convert input image data into output image data of greater resolution, and a panel driver to display images based on the output image data, the input image data including first, second, and third input color data corresponding to the first, second, and third color light, the output image data including first, second, and third output color data corresponding to the first, second, and third color light, and the image processor for generating the first and third output color data, by performing an upscaling-rendering operation on the first and third input color data, and the second output color data, by performing an upscaling operation on the second input color data.

Abstract: A random number generator including: a first ring oscillator including a first inverter chain, the first inverter chain including a plurality of serially connected first inverters, the first ring oscillator configured to output a first random signal generated at a first sub-node between two neighboring first inverters among the plurality of first inverters; a second ring oscillator including a second inverter chain, the second inverter chain including a plurality of serially connected second inverters, the second ring oscillator configured to output a second random signal generated at a second sub-node between two neighboring second inverters among the plurality of second inverters; and a signal processing circuit for generating a random number by combining the first random signal with the second random signal.

Abstract: A broadcast receiving for updating service map information by scanning the broadcast signal when signaling information included in a broadcast signal has been changed.

Abstract: A semiconductor package includes a support frame, and including a cavity, a semiconductor chip disposed in the cavity and having an active surface on which contact pads are arranged, and a connection member on the support frame and on the active surface of the semiconductor chip. The semiconductor chip includes a first insulating film disposed on the active surface and exposing the contact pads, a second insulating film disposed on the first insulating film and including a first opening exposing connection regions of the contact pads, and a conductive crack preventing layer disposed on the connection regions and having an outer peripheral region extending to a portion of the second insulating film around the first opening. The connection member includes an insulating layer including a second opening exposing the connection regions; and a redistribution layer connected to the contact pads through the second opening.

Abstract: A semiconductor package includes: a connection member including a plurality of connection pads and a redistribution layer; a semiconductor chip disposed on the connection member; an encapsulant sealing the semiconductor chip; a passivation layer disposed on the connection member; a plurality of under bump metallurgy (UBM) pads disposed on the passivation layer; and a plurality of UBM vias connecting the plurality of UBM pads to the plurality of connection pads, respectively, wherein the plurality of UBM pads include a first UBM pad overlapped with the semiconductor chip in a stacking direction, and a second UBM pad located outside of the overlapped region, and the first connection pad has an area larger than an area of an associated first UBM pad while the associated first UBM pad is overlapped in the stacking direction, and has an area larger than an area of the second connection pad.