Patents by Inventor Ji Heon Yu

Ji Heon Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Antenna for device
    Patent number: 10218054
    Abstract: An antenna for an electronic device is disclosed that can reduce or prevent problems such as a shock hazard and/or an Electrostatic Discharge (ESD) issue, particularly in the case when device are subjected to impact such as being dropped. The antenna includes a radiator; an antenna clip connected with a metallic housing of the electronic device; a capacitor includes a part of the antenna clip; and a feeding part and a ground for operating the antenna.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: February 26, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae Woong Kim, Cheol Ho Lee, Ji Heon Yu, Il Hyung Chung
  • Printed circuit board
    Patent number: 10111321
    Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: October 23, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Won Park, Dong-Kyun Yu, Ji-Heon Yu, Seung-Yup Lee, Taek-Kyun Choi
  • ANTENNA FOR DEVICE
    Publication number: 20170040671
    Abstract: An antenna for an electronic device is disclosed that can reduce or prevent problems such as a shock hazard and/or an Electrostatic Discharge (ESD) issue, particularly in the case when device are subjected to impact such as being dropped. The antenna includes a radiator; an antenna clip connected with a metallic housing of the electronic device; a capacitor includes a part of the antenna clip; and a feeding part and a ground for operating the antenna.
    Type: Application
    Filed: August 1, 2016
    Publication date: February 9, 2017
    Inventors: Dae Woong KIM, Cheol Ho LEE, Ji Heon YU, Il Hyung CHUNG
  • PRINTED CIRCUIT BOARD
    Publication number: 20160242291
    Abstract: Various embodiments related to a printed circuit board in which a capacitor is embedded are described. The capacitor may include: a plurality of first conductive layers that have a plurality of first via holes; a plurality of second conductive layers that have a plurality of second via holes, wherein the first and second conductive layers are alternately arranged in turns; and a plurality of dielectric layers that are arranged between the first and second conductive layers. Other various embodiments are possible.
    Type: Application
    Filed: February 17, 2016
    Publication date: August 18, 2016
    Inventors: Sung-Won PARK, Dong-Kyun YU, Ji-Heon YU, Seung-Yup LEE, Taek-Kyun CHOI
  • Semiconductor device
    Patent number: 9159625
    Abstract: Disclosed is a semiconductor device. For instance, the semiconductor device includes a main via formed on a dielectric and a ground via formed in a circular arc shape and spaced apart from the main via. The semiconductor device is superior in electric characteristics such as insertion loss or reflection loss and allows efficient use of space.
    Type: Grant
    Filed: January 27, 2011
    Date of Patent: October 13, 2015
    Assignee: Amkor Technology, Inc.
    Inventors: Seung Jae Lee, Sang Won Kim, Ki Cheol Bae, Ji Heon Yu