Abstract: A surface mount process, a surface mount system, and a feeding apparatus thereof are provided. The surface mount system includes a feeding apparatus and a surface mount apparatus. The feeding apparatus includes a vibrating tray feeder module, a vibrating linear feeder module, and a component recycling module. The vibrating tray feeder module has a circular vibrating conveyer belt with a vibrating tray output end. The vibrating linear feeder module has a linear vibrating conveyer belt connected to the vibrating tray output end and has a linear vibrating output end opposite the vibrating tray feeder module. The component recycling module is disposed under the vibrating tray feeder module to recycle the rejected components. The surface mount apparatus has a component receiving unit corresponding to the linear vibrating output end of the vibrating linear feeder module.

Abstract: A method for transferring chips is provided for fixing one of the chips on a blue tape without sorting. A blue tape, a plurality of chips disposed thereon and a mapping data are provided, wherein the chips are disposed on the same blue tape, belong to the same wafer, and belong to a plurality of specifications. The specifications include a first specification and a second specification. The mapping data include the specifications the chips belonging to and the positions of the chips relative to the blue tape. According the mapping data, the chips belonging to the first specification are moved from the blue tape and fixed to a package carrier corresponding to the first specification. According the mapping data, the chips belonging to the second specification are moved from the blue tape and fixed to a package carrier corresponding to the second specification. A chip transferring apparatus is also provided.

Abstract: A surface mount process, a surface mount system, and a feeding apparatus thereof are provided. The surface mount system includes a feeding apparatus and a surface mount apparatus. The feeding apparatus includes a vibrating tray feeder module, a vibrating linear feeder module, and a component recycling module. The vibrating tray feeder module has a circular vibrating conveyer belt with a vibrating tray output end. The vibrating linear feeder module has a linear vibrating conveyer belt connected to the vibrating tray output end and has a linear vibrating output end opposite the vibrating tray feeder module. The component recycling module is disposed under the vibrating tray feeder module to recycle the rejected components. The surface mount apparatus has a component receiving unit corresponding to the linear vibrating output end of the vibrating linear feeder module.